Abstract: An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.

Abstract: An image pickup apparatus includes a lens unit and an image pickup unit. The lens unit includes a plurality of optical devices including a first optical device that includes: a first glass substrate having a first principal surface and a second principal surface and a groove leading to the second principal surface from the first principal surface in at least one of four corners on an outer edge; first resin disposed in the groove; and a resin lens disposed on the second principal surface. The image pickup unit including an image pickup device is disposed on an optical device not including the first resin, of the plurality of optical devices.

Abstract: A lens unit includes: a first optical device including a first glass substrate including a first principal surface and a second principal surface, and a resin lens disposed on the second principal surface; a second optical device including a second glass substrate including a third principal surface and a fourth principal surface, in which the third principal surface is disposed facing the second principal surface, and a substantially rectangular aperture layer made of metal that is disposed on the third principal surface and that has four corner regions cut out; and an adhesive layer that adhesively bonds the first optical device and the second optical device, in which four corner regions do not sandwich the aperture layer between the first optical device and the second optical device.

Abstract: An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.