Patents by Inventor Mitsuru Oota

Mitsuru Oota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-vehicle communication system, on-board terminal, portable device, and in-vehicle communication method
    Patent number: 7844377
    Abstract: Current position of a vehicle and current time are acquired. A user recognizing unit recognizes a user. A pattern recognizing unit detects location of a portable device and movement thereof. Operation state of an engine is acquired from an engine control mechanism. Based on the information, processes are performed such as switching communication stand-by mode of the portable device to active stand-by mode, notifying the portable device of a transition of an on-board terminal to automatic locking mode, preventing needless unlocking and locking of doors, and setting warning mode of the portable device.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: November 30, 2010
    Assignee: Fujitsu Ten Limited
    Inventors: Mitsuru Oota, Tetsuya Nomura, Satoshi Harumoto, Yuusaku Matsuda, Yasushi Seike
  • On-Vehicle Equipment Control Device and On-Vehicle Equipment Control Method
    Publication number: 20090055046
    Abstract: A situation determining unit determines a situation a vehicle currently faces. A control processing unit controls a vehicle equipment based on a determination of the situation determining unit. An arbitration processing unit determines, when a conflict of control requests occurs, contents of the control by settling the conflict, and when different control requests are issued to an identical vehicle equipment, sets a priority in the control requests, adjusts a timing of performing the control, and adjusts an amount for the control. The control processing unit performs the control based on the contents of the control determined by the arbitration processing unit.
    Type: Application
    Filed: December 26, 2005
    Publication date: February 26, 2009
    Applicant: Fujitsu Ten Limited
    Inventors: Satoshi Harumoto, Yuusaku Matsuda, Tetsuya Nomura, Mitsuru Oota, Hiroaki Yamao, Yasushi Seike
  • Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
    Patent number: 7331737
    Abstract: To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconductor chip having a second bonding pad thinner than the first bonding pad; and a bonding wire connected with each of the first bonding pad and the second bonding pad, the first bonding pad being connected with a first bond side end portion of the bonding wire and the second bonding pad being connected with a second bond side end portion of the bonding wire.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: February 19, 2008
    Assignee: NEC Electronics Corporation
    Inventor: Mitsuru Oota
  • Semiconductor device and manufacturing method therefor
    Publication number: 20070224805
    Abstract: To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconductor chip having a second bonding pad thinner than the first bonding pad; and a bonding wire connected with each of the first bonding pad and the second bonding pad, the first bonding pad being connected with a first bond side end portion of the bonding wire and the second bonding pad being connected with a second bond side end portion of the bonding wire.
    Type: Application
    Filed: May 22, 2007
    Publication date: September 27, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Mitsuru Oota
  • Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip
    Patent number: 7256485
    Abstract: To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconductor chip having a second bonding pad thinner than the first bonding pad; and a bonding wire connected with each of the first bonding pad and the second bonding pad, the first bonding pad being connected with a first bond side end portion of the bonding wire and the second bonding pad being connected with a second bond side end portion of the bonding wire.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: August 14, 2007
    Assignee: NEC Electronics Corporation
    Inventor: Mitsuru Oota
  • In-vehicle communication system, on-board terminal, portable device and in-vehicle communication method
    Publication number: 20070038344
    Abstract: Current position of a vehicle and current time are acquired. A user recognizing unit recognizes a user. A pattern recognizing unit detects location of a portable device and movement thereof. Operation state of an engine is acquired from an engine control mechanism. Based on the information, processes are performed such as switching communication stand-by mode of the portable device to active stand-by mode, notifying the portable device of a transition of an on-board terminal to automatic locking mode, preventing needless unlocking and locking of doors, and setting warning mode of the portable device.
    Type: Application
    Filed: June 14, 2006
    Publication date: February 15, 2007
    Applicant: Fujitsu Ten Limited
    Inventors: Mitsuru Oota, Tetsuya Nomura, Satoshi Harumoto, Yuusaku Matsuda, Yasushi Seike
  • Semiconductor device and manufacturing method therefor
    Publication number: 20060220231
    Abstract: To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconductor chip having a second bonding pad thinner than the first bonding pad; and a bonding wire connected with each of the first bonding pad and the second bonding pad, the first bonding pad being connected with a first bond side end portion of the bonding wire and the second bonding pad being connected with a second bond side end portion of the bonding wire.
    Type: Application
    Filed: February 10, 2006
    Publication date: October 5, 2006
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Mitsuru Oota