Abstract: Provided are an emotion tag assigning system, method, and program for assigning, to a content, an emotion tag indicating an emotion of a user in execution of an event using the content. An emotion tag assigning method includes a step of detecting, by a voice detector, voice data indicating a voice uttered by a person who participates in an event using a content during execution of the event; a step of recognizing, by an emotion recognizer, an emotion of the person based on the voice data; a step of acquiring, by a processor, emotion information indicating the recognized emotion of the person during the execution of the event using the content; and a step of assigning, by the emotion recognizer, an emotion rank calculated from the acquired emotion information to the content as an emotion tag.

Abstract: A seal assembly device is configured to attach an annular seal by press-fitting to an axial end portion of a first raceway member of a wheel bearing device. The seal assembly device includes: a columnar guide member including a contact surface configured to contact a plurality of rolling elements provided along a raceway surface formed on the first raceway member from a side opposite to the raceway surface, the contact surface being continuous in a circumferential direction; a pressing member configured to move in an axial direction along the guide member toward the axial end portion so as to press the seal in the axial direction and to press-fit the seal into the axial end portion; and a reference member configured to restrict a movement stroke of the pressing member with respect to the guide member in the axial direction.

Abstract: The present invention provides a new device in which the influence of ?-ray is reduced, and a composition for forming an organic layer. The device of the present invention includes an ?-ray source, an electronic circuit influenced by ?-ray, and an organic layer including an ?-ray shielding agent, in which an ?-ray shielding ability X of the ?-ray shielding agent is 0.50 or less.

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

Abstract: Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device. A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m.

Abstract: Provided are a resin composition which allows laser ablation processing, allows removal of a protective film itself after the processing, and is capable of forming a protective film having peeling resistance, and a protective film. The resin composition for forming a protective film contains polyvinyl acetal, a light absorbing agent, and a solvent.

Abstract: A laminate includes, sequentially and adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which the tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa. A base material is peeled off by fixing any one of the first base material and the second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

Abstract: Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device. A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m.

Abstract: To provide a laminate, a temporary adhesion composition, and a temporary adhesion film which are capable of making warpage less likely to occur even when a wafer is thin. Provided is a laminate including, sequentially being adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which a tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa, a base material is peeled off by fixing any one of a first base material and a second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

Abstract: There are provided a sensor device and a sensor system that consume less power, can be miniaturized, and are excellent in productivity. The sensor device has: a unit 1 having at least one type of power supply portion 13 selected from a power generation portion and a wireless power supply portion, a sensor portion 11 that detects target information and outputs a signal, a logic portion 12 that performs determination based on the signal, and a wireless communication portion 14 that transmits a result of the determination to the outside; and a sealing material that covers at least a part of the outer periphery of the unit 1. The unit 1 has the respective portions on one semiconductor substrate surface, and the respective portions are electrically connected to each other.

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

Abstract: An electroluminescent device including a substrate on which a first electrode is formed; a transparent substrate disposed on the first electrode side of the substrate; a color filter disposed between the first electrode and the transparent substrate; an electroluminescent layer disposed between the first electrode and the color filter; and a second electrode disposed between the electroluminescent layer and the color filter.

Abstract: An elastic material for pressure measurement, containing an elastic resin composition having at least either a urethane bond or a urea bond and being obtained by reacting an isocyanate with (A) a linear polyol and then curing the obtained prepolymer with use of a curing agent having two —NH2 groups in one molecule.

Abstract: An electroluminescent device including a substrate on which a first electrode is formed; a transparent substrate disposed on the first electrode side of the substrate; a color filter disposed between the first electrode and the transparent substrate; an electroluminescent layer disposed between the first electrode and the color filter; and a second electrode disposed between the electroluminescent layer and the color filter.

Abstract: A light-emitting device or a display device comprising a resin film or a resin layer, a glass substrate, a light-emitting element laminate or a display element laminate, and a gas-barrier film in that order. The device is thin and hardly broken.

Abstract: An elastic material for pressure measurement, containing an elastic resin composition having at least either a urethane bond or a urea bond and being obtained by reacting an isocyanate with (A) a linear polyol and then curing the obtained prepolymer with use of a curing agent having two —NH2 groups in one molecule.

Abstract: A liquid ejection device includes a liquid ejection member including a pressurized liquid chamber and a liquid ejection orifice which is in fluid communication with the pressurized liquid chamber to eject a liquid in the pressurized liquid chamber to the outside. A piezoelectric device is formed on the pressurized liquid chamber via a vibrating diaphragm. The piezoelectric device includes a lower electrode, a piezoelectric film and an upper electrode, which are disposed sequentially. The piezoelectric film is a thin-film piezoelectric material having a Curie point of 200° C. or more. The liquid ejection device further includes a heating element for heating a material, which has a melting point of not less than 150° C. and lower than the Curie point of the piezoelectric film, charged in the pressurized liquid chamber to a temperature not less than the melting point of the material.

Abstract: A liquid ejection device includes a liquid ejection member including a pressurized liquid chamber and a liquid ejection orifice which is in fluid communication with the pressurized liquid chamber to eject a liquid in the pressurized liquid chamber to the outside. A piezoelectric device is formed on the pressurized liquid chamber via a vibrating diaphragm. The piezoelectric device includes a lower electrode, a piezoelectric film and an upper electrode, which are disposed sequentially. The piezoelectric film is a thin-film piezoelectric material having a Curie point of 200° C. or more. The liquid ejection device further includes a heating element for heating a material, which has a melting point of not less than 150° C. and lower than the Curie point of the piezoelectric film, charged in the pressurized liquid chamber to a temperature not less than the melting point of the material.

Abstract: An electroluminescent device including a substrate on which a first electrode is formed; a transparent substrate disposed on the first electrode side of the substrate; a color filter disposed between the first electrode and the transparent substrate; an electroluminescent layer disposed between the first electrode and the color filter; and a second electrode disposed between the electroluminescent layer and the color filter.

Abstract: A light-emitting device or a display device comprising a resin film or a resin layer, a glass substrate, a light-emitting element laminate or a display element laminate, and a gas-barrier film in that order. The device is thin and hardly broken.