Patents by Inventor Mitsushi Taguchi

Mitsushi Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150051341
    Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 19, 2015
    Inventors: Norio Miura, Hiroaki Yamaguchi, Hideki Ozawa, Mitsushi Taguchi
  • Patent number: 8748509
    Abstract: A friction material characterized by using a resin composition for friction materials, the resin composition containing, as a binder, an aromatic imide oligomer having an addition-reactive group at an end thereof. Also described is a resin composition for friction materials, containing: a powder of an aromatic imide oligomer having an addition-reactive group at an end thereof; at least one type of fiber selected from the group consisting of carbon fiber, aramid fiber, glass fiber, ceramic fiber, and metal fiber; and an inorganic filler. The friction material and a resin composition for friction materials have good formability and in which the binder itself has excellent heat resistance and mechanical properties, compared to a friction material using a phenolic resin as a binder.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: June 10, 2014
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Ozawa, Mitsushi Taguchi
  • Publication number: 20110028595
    Abstract: A friction material characterized by using a resin composition for friction materials, the resin composition containing, as a binder, an aromatic imide oligomer having an addition-reactive group at an end thereof. Also described is a resin composition for friction materials, containing: a powder of an aromatic imide oligomer having an addition-reactive group at an end thereof; at least one type of fiber selected from the group consisting of carbon fiber, aramid fiber, glass fiber, ceramic fiber, and metal fiber; and an inorganic filler. The friction material and a resin composition for friction materials have good formability and in which the binder itself has excellent heat resistance and mechanical properties, compared to a friction material using a phenolic resin as a binder.
    Type: Application
    Filed: March 27, 2009
    Publication date: February 3, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hideki Ozawa, Mitsushi Taguchi
  • Patent number: 5252703
    Abstract: A polyimidosiloxane material useful for forming, on a flexible substrate material, a flexible protective coating layer with a high heat resistance, electrical insulating property and curl-resistance, comprises a polymerization-imidization product of an aromatic tetracarboxylic acid component comprising, as a principal ingredient, 2,3,3',4'-biphenyltetracarboxylic dianhydride with a diamine component comprising, as a principal ingredient, a diaminopolysiloxane compound of the formula (I) ##STR1## wherein R.sub.1 is a divalent hydrocarbon residue, R.sub.2 is an C.sub.1-3 alkyl or phenyl group, n is an integer of 3 to 30, and is preferably used, optionally together with an epoxy resin, in the form of a solution or dispersion in an organic solvent to coat a flexible substrate material, for example, a flexible circuit element, therewith.
    Type: Grant
    Filed: May 29, 1991
    Date of Patent: October 12, 1993
    Assignee: Ube Industries, Ltd.
    Inventors: Kohei Nakajima, Hiroshi Yasuno, Mitsushi Taguchi
  • Patent number: 4755551
    Abstract: An electrodeposition resinous paint composition comprising (a) a modified alkyd resin, (b) a melamine resin, (c) a water-soluble silicone resin and (d) an inorganic filler, in which these components (a), (b), (c) and (d) are contained in the following ratios by weight:[(a)/[(a)+(b)]]=0.4-0.9;[(c)/[(a)+(b)]]=0.01-0.1;and[(d)/[(a)+(b)+(c)]]=0.1-1.0.
    Type: Grant
    Filed: July 7, 1987
    Date of Patent: July 5, 1988
    Assignee: UBE Industries, Ltd.
    Inventors: Tsunetomo Nakano, Fumio Sakatani, Mitsushi Taguchi
  • Patent number: 4578479
    Abstract: There is disclosed a process for preparing a 1,2,4-triazole-3-carboxamide represented by the formula: ##STR1## wherein, R.sup.1 and R.sup.2 represent independently a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group, or both R.sup.1 and R.sup.2 represent an alkylene group linked with each other directly or through an oxygen atom or a nitrogen atom to form a ring together with the nitrogen atom to which they are attached,which comprises subjecting an oxamohydrazide represented by the formula: ##STR2## wherein R.sup.1 and R.sup.2 have the same meanings as defined above,to reaction with formamidine or a salt thereof.
    Type: Grant
    Filed: April 13, 1984
    Date of Patent: March 25, 1986
    Assignee: Ube Industries, Ltd.
    Inventors: Kiyoshi Fukui, Noboru Kakeya, Mitsushi Taguchi