Patents by Inventor Mitsutaka Yamada
Mitsutaka Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11178790Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.Type: GrantFiled: April 10, 2020Date of Patent: November 16, 2021Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Mitsutaka Yamada
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Publication number: 20200337176Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.Type: ApplicationFiled: April 10, 2020Publication date: October 22, 2020Applicant: FUJITSU LIMITEDInventors: Michimasa AOKI, Masumi SUZUKI, Mitsutaka YAMADA
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Patent number: 10499542Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.Type: GrantFiled: October 26, 2018Date of Patent: December 3, 2019Assignee: FUJITSU LIMITEDInventors: Keizou Takemura, Jie Wei, Masumi Suzuki, Michimasa Aoki, Mitsutaka Yamada
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Publication number: 20190166720Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.Type: ApplicationFiled: October 26, 2018Publication date: May 30, 2019Applicant: FUJITSU LIMITEDInventors: Keizou Takemura, Jie Wei, Masumi Suzuki, Michimasa Aoki, Mitsutaka Yamada
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Patent number: 10108235Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.Type: GrantFiled: October 2, 2017Date of Patent: October 23, 2018Assignee: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Michimasa Aoki, Masumi Suzuki, Mitsutaka Yamada
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Patent number: 10083938Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.Type: GrantFiled: December 16, 2016Date of Patent: September 25, 2018Assignee: FUJITSU LIMITEDInventors: Mitsutaka Yamada, Masumi Suzuki, Michimasa Aoki, Jie Wei
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Patent number: 10014239Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.Type: GrantFiled: May 30, 2017Date of Patent: July 3, 2018Assignee: FUJITSU LIMITEDInventors: Keizou Takemura, Jie Wei, Mitsutaka Yamada, Michimasa Aoki, Masumi Suzuki
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Publication number: 20180113494Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.Type: ApplicationFiled: October 2, 2017Publication date: April 26, 2018Applicant: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Michimasa AOKI, Masumi SUZUKI, Mitsutaka YAMADA
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Publication number: 20180005921Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.Type: ApplicationFiled: May 30, 2017Publication date: January 4, 2018Applicant: FUJITSU LIMITEDInventors: Keizou Takemura, JIE WEI, Mitsutaka YAMADA, Michimasa AOKI, Masumi SUZUKI
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Publication number: 20170207144Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.Type: ApplicationFiled: December 16, 2016Publication date: July 20, 2017Applicant: FUJITSU LIMITEDInventors: Mitsutaka YAMADA, Masumi SUZUKI, Michimasa AOKI, JIE WEI
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Patent number: 9653380Abstract: A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.Type: GrantFiled: April 26, 2016Date of Patent: May 16, 2017Assignee: FUJITSU LIMITEDInventors: Makoto Suwada, Mitsutaka Yamada, Masumi Suzuki, Michimasa Aoki, Keizou Takemura, Shinichirou Okamoto, Kenji Katsumata, Jie Wei
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Publication number: 20160351471Abstract: A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.Type: ApplicationFiled: April 26, 2016Publication date: December 1, 2016Applicant: FUJITSU LIMITEDInventors: MAKOTO SUWADA, Mitsutaka YAMADA, Masumi SUZUKI, Michimasa AOKI, Keizou Takemura, Shinichirou OKAMOTO, Kenji Katsumata, JIE WEI
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Publication number: 20150351283Abstract: A heatsink includes, a fin base that receives heat from a heat generating part; a cover that cooperates with the fin base to form a flow path of coolant along which the coolant flows; a plurality of fins formed on the fin base and partitioning the flow path into a plurality of small flow paths; and an adjustment plate vertically disposed between the fin base and the cover, and perpendicularly disposed with respect to the plurality of fins, wherein the adjustment plate including different height potions.Type: ApplicationFiled: May 20, 2015Publication date: December 3, 2015Applicant: Fujitsu LimitedInventors: Mitsutaka Yamada, Shinichirou Okamoto, Masumi Suzuki, Jie Wei
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Publication number: 20140340847Abstract: A substrate unit includes: a substrate arranged with a first heat generating element on one surface and a second heat generating element on the other surface; a first cooler that is arranged on one surface side of the substrate and that is in contact with the first heat generating element; a second cooler that is arranged on the other surface side of the substrate and that is in contact with the second heat generating element; a supply port provided in the first cooler, the supply port supplying the coolant to the first cooler; a discharge port provided in the first cooler, the discharge port discharging the coolant in the first cooler; and transport tubes that are connected to the first cooler and the second cooler, the transport tubes allowing the coolant to be transported between the first cooler the second cooler.Type: ApplicationFiled: April 21, 2014Publication date: November 20, 2014Applicant: FUJITSU LIMITEDInventors: Yoshihisa IWAKIRI, Jie WEI, Keizou Takemura, Mitsutaka YAMADA
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Patent number: 6787711Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.Type: GrantFiled: July 16, 2002Date of Patent: September 7, 2004Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki
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Publication number: 20030111262Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.Type: ApplicationFiled: July 16, 2002Publication date: June 19, 2003Inventors: Shunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki
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Patent number: 6193905Abstract: A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.Type: GrantFiled: January 30, 1995Date of Patent: February 27, 2001Assignee: Fujitsu LimitedInventors: Mitsutaka Yamada, Kishio Yokouchi, Nobuo Kamehara, Koichi Niwa
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Patent number: 5349499Abstract: A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.Type: GrantFiled: April 28, 1993Date of Patent: September 20, 1994Assignee: Fujitsu LimitedInventors: Mitsutaka Yamada, Kishio Yokouchi, Nobuo Kamehara, Koichi Niwa
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Patent number: 5038571Abstract: A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: C.sub.n F.sub.2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generating semiconductor devices and other devices to a cryogenic temperature, exhibits an increased heat flux and thus an increased cooling capability, in addition to a simple and small structure of the cooling system, and a prevention of environmental pollution.Type: GrantFiled: November 17, 1989Date of Patent: August 13, 1991Assignee: Fujitsu LimitedInventors: Kishio Yokouchi, Mitsutaka Yamada, Nobuo Kamehara, Koichi Niwa