Patents by Inventor Mitsutoshi Yoshinobu

Mitsutoshi Yoshinobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5780147
    Abstract: Disclosed is a laminate comprising a thermosetting resin-impregnated prepreg layer (A) constituting a surface layer, a rubber or thermoplastic resin layer (B) having a flexibility and a hot melt resin adhesive layer (C), the thermosetting resin-impregnated prepreg layer and rubber or thermoplastic resin layer being heat bonded through the hot melt resin adhesive layer. The layer (A) is a prepreg impregnated with a thermosetting resin selected from a diallyl phthalate resin, an unsaturated polyester, a phenol resin, an aminoalkyd resin, an epoxy resin, an acrylurethane resin and a melamine resin. The rubber or resin of the layer (B) is a rubber or a thermoplastic resin selected from chlorinated polyethylene, polybutene, ethylene-vinyl acetate copolymer, an ethylene-propylene-diene copolymer, a chloroprene polymer, chlorosulfonated polyethylene, a styrene-butadiene copolymer and polyvinyl chloride. In addition, the hot melt resin of the layer (C) is a hot melt resin having a melting point of 60.degree. to 165.
    Type: Grant
    Filed: March 13, 1996
    Date of Patent: July 14, 1998
    Assignee: Daiso Co., Ltd.
    Inventors: Mikio Sugahara, Mitsutoshi Yoshinobu, Yoshiyuki Tanaka