Abstract: A semiconductor device includes first, second and third power supply terminals respectively supplied with first, second and third power supply voltages. The semiconductor device also includes a first terminal connectable to a host device and a second terminal connectable to a peripheral device. The semiconductor device also includes a first circuit block connected to the first terminal and the first power supply terminal and receiving data output from the host device based on the first power supply voltage, a second circuit block connected to the second terminal and the third power supply terminal and receiving data output from the peripheral device based on the third power supply voltage, and a third circuit block connected to the second power supply terminal and controlling operation of the first circuit block and the second circuit block based on the second power supply voltage.

Abstract: A semiconductor device includes first, second and third power supply terminals respectively supplied with first, second and third power supply voltages. The semiconductor device also includes a first terminal connectable to a host device and a second terminal connectable to a peripheral device. The semiconductor device also includes a first circuit block connected to the first terminal and the first power supply terminal and receiving data output from the host device based on the first power supply voltage, a second circuit block connected to the second terminal and the third power supply terminal and receiving data output from the peripheral device based on the third power supply voltage, and a third circuit block connected to the second power supply terminal and controlling operation of the first circuit block and the second circuit block based on the second power supply voltage.

Abstract: A micro-controller includes a USB control unit, an MC unit having an operation mode and a stop mode and an oscillating circuit, which is commonly used by the USB control unit and the MC unit. The USB control unit includes a watching circuit for watching a condition of a first data and a second data, which is complement data of the first data. The operation of the oscillating circuit is controlled in response to an operation control signal, which is generated by a watching result, and an oscillation control signal whose voltage level is changed in response to the mode of the MC unit.

Abstract: A semiconductor device includes first, second and third power supply terminals respectively supplied with first, second and third power supply voltages. The semiconductor device also includes a first terminal connectable to a host device and a second terminal connectable to a peripheral device. The semiconductor device also includes a first circuit block connected to the first terminal and the first power supply terminal and receiving data output from the host device based on the first power supply voltage, a second circuit block connected to the second terminal and the third power supply terminal and receiving data output from the peripheral device based on the third power supply voltage, and a third circuit block connected to the second power supply terminal and controlling operation of the first circuit block and the second circuit block based on the second power supply voltage.

Abstract: A semiconductor device includes first, second and third power supply terminals respectively supplied with first, second and third power supply voltages. The semiconductor device also includes a first terminal connectable to a host device and a second terminal connectable to a peripheral device. The semiconductor device also includes a first circuit block connected to the first terminal and the first power supply terminal and receiving data output from the host device based on the first power supply voltage, a second circuit block connected to the second terminal and the third power supply terminal and receiving data output from the peripheral device based on the third power supply voltage, and a third circuit block connected to the second power supply terminal and controlling operation of the first circuit block and the second circuit block based on the second power supply voltage.

Abstract: A micro-controller includes a USB control unit, an MC unit having an operation mode and a stop mode and an oscillating circuit, which is commonly used by the USB control unit and the MC unit. The USB control unit includes a watching circuit for watching a condition of a first data and a second data, which is complement data of the first data. The operation of the oscillating circuit is controlled in response to an operation control signal, which is generated by a watching result, and an oscillation control signal whose voltage level is changed in response to the mode of the MC unit.

Abstract: A semiconductor device having a first semiconductor element placed over a second semiconductor element, so that an edge of the first semiconductor element is not placed over a predetermined circuit in the second semiconductor element, and wherein a size of the first semiconductor element is smaller than a size of the second semiconductor element. The predetermined circuit has a characteristic that tends to change with stress greater than characteristics of other circuits on the second semiconductor element that are under the edge of the first semiconductor element.

Abstract: A micro-controller includes a USB control unit, an MC unit having an operation mode and a stop mode and an oscillating circuit, which is commonly used by the USB control unit and the MC unit. The USB control unit includes a watching circuit for watching a condition of a first data and a second data, which is complement data of the first data. The operation of the oscillating circuit is controlled in response to an operation control signal, which is generated by a watching result, and an oscillation control signal whose voltage level is changed in response to the mode of the MC unit.

Abstract: A semiconductor device that includes a first power supply terminal supplied with a first power supply voltage, a second power supply terminal supplied with a second power supply voltage, and a third power supply terminal supplied with a third power supply voltage. The semiconductor device also includes a first terminal being connectable to a host device and a second terminal being connectable to a peripheral device.

Abstract: A semiconductor device includes first through third power supply terminals respectively supplied with first, second and third power supply voltages. The semiconductor device also includes a first terminal connectable to a host device, and a second terminal connectable to a peripheral device. A first circuit block is connected to the first terminal and the first power supply terminal, and receives data output from the host device based on the first power supply voltage. A second circuit block is connected to the second terminal and the third power supply terminal, and receives data output from the peripheral device based on the third power supply voltage. A third circuit block is connected to the second power supply terminal, and controls operation of the first circuit block and the second circuit block based on the second power supply voltage.

Abstract: A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.

Abstract: A micro-controller includes a USB control unit, an MC unit having an operation mode and a stop mode and an oscillating circuit, which is commonly used by the USB control unit and the MC unit. The USB control unit includes a watching circuit for watching a condition of a first data and a second data, which is complement data of the first data. The operation of the oscillating circuit is controlled in response to an operation control signal, which is generated by a watching result, and an oscillation control signal whose voltage level is changed in response to the mode of the MC unit.

Abstract: A micro-controller includes a USB control unit, an MC unit having an operation mode and a stop mode and an oscillating circuit, which is commonly used by the USB control unit and the MC unit. The USB control unit includes a watching circuit for watching a condition of a first data and a second data, which is complement data of the first data. The operation of the oscillating circuit is controlled in response to an operation control signal, which is generated by a watching result, and an oscillation control signal whose voltage level is changed in response to the mode of the MC unit.

Abstract: A semiconductor device having a first semiconductor element placed over a second semiconductor element, so that an edge of the first semiconductor element is not placed over a predetermined circuit in the second semiconductor element, and wherein a size of the first semiconductor element is smaller than a size of the second semiconductor element. The predetermined circuit has a characteristic that tends to change with stress greater than characteristics of other circuits on the second semiconductor element that are under the edge of the first semiconductor element.

Abstract: A method of manufacturing a semiconductor device includes providing first pad electrodes for connection to leads and second pad electrodes for an internal interface, over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the first LSI chip, are placed over the second LSI chip, to implement a desired function used as for a system LSI by the two LSI chips. The plurality of LSI chips are then sealed with a resin.

Abstract: A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.

Abstract: A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.

Abstract: A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.

Abstract: A method of manufacturing a semiconductor device includes providing first pad electrodes for connection to leads and second pad electrodes for an internal interface, over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the first LSI chip, are placed over the second LSI chip, to implement a desired function used as for a system LSI by the two LSI chips. The plurality of LSI chips are then sealed with a resin.

Abstract: First pad electrodes for connection to leads and second pad electrodes for an internal interface, are provided over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the LSI chip, are placed over the LSI chip, to implement a desired function used as for the system LSI by the two LSI chips. The system LSI is easily implemented by a semiconductor device wherein a plurality of LSI chips are sealed with a resin.