Patents by Inventor Mitsuyoshi Nishide

Mitsuyoshi Nishide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11804638
    Abstract: A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: October 31, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Mitsuyoshi Nishide, Takayuki Nagano, Isao Tamaki, Tomohiro Kato, Akira Baba, Haruhiko Mori
  • Patent number: 11769623
    Abstract: A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: September 26, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Junji Kurobe, Mitsuyoshi Nishide
  • Publication number: 20220302507
    Abstract: A solid-state battery including a solid-state battery laminate having a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer, each of the positive electrode layer and the negative electrode layer having an electrode active material. A first active material contour portion in which the electrode active material in one of the positive electrode layer and the negative electrode layer extends to a first plan-view contour of the solid-state battery laminate, and a first non-active material contour portion in which the electrode active material in the other of the positive electrode layer and the negative electrode layer does not extend to the first plan-view contour of the solid-state battery laminate face each other in a lamination direction.
    Type: Application
    Filed: June 7, 2022
    Publication date: September 22, 2022
    Inventors: Yosuke TOMOSHIGE, Mitsuyoshi NISHIDE
  • Patent number: 11443890
    Abstract: A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Mitsuyoshi Nishide, Shinichiro Banba
  • Publication number: 20220231347
    Abstract: A wireless rechargeable solid-state battery module includes a solid-state battery; an internal structure including an internal circuit electrically connected with the battery; positive and negative electrode terminals, each of which is electrically connected with the solid-state battery, is exposed on an outer surface, and is where the positive or negative electrode terminal can be mounted on an electronic circuit board; barrier layers that entirely or partially contain a conductor and isolate the battery and the internal structure from an outside air environment; and a power receiving terminal electrically connected with an external circuit, which includes a power receiving coil coupled with an external electromagnetic or magnetic field, is electrically connected with the internal circuit, and is in an outside of the barrier layers.
    Type: Application
    Filed: April 8, 2022
    Publication date: July 21, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kiyokazu YAMADA, Tatsuya HOSOTANI, Tomohiro KATO, Mitsuyoshi NISHIDE
  • Publication number: 20220231539
    Abstract: A wireless rechargeable solid-state battery module includes a solid-state battery; internal structures that are provided with an internal circuit electrically connected with the solid-state battery; a barrier layer that isolates the solid-state battery from an outside air environment; and a positive electrode terminal and a negative electrode terminal each of which is electrically connected with the solid-state battery, is exposed on an outer surface, and is arranged so that the positive electrode terminal or the negative electrode terminal can be mounted on a mounting board. The internal circuit includes a wireless charging circuit that receives power from an outside via an electromagnetic field or a magnetic field produced by power transmission from the outside and controls charging to the solid-state battery.
    Type: Application
    Filed: April 8, 2022
    Publication date: July 21, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kiyokazu YAMADA, Tatsuya HOSOTANI, Tomohiro KATO, Mitsuyoshi NISHIDE
  • Patent number: 11387037
    Abstract: A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 12, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Mitsuyoshi Nishide, Shinichiro Banba, Masahiro Ozawa
  • Patent number: 11373796
    Abstract: An inductor component 1 includes a resin layer 2, a protective film 4, two metal pins 5 provided to stand in the resin layer 2, and a metal plate 6 joined to both of the metal pins 5, and both of the metal pins 5 and the metal plate 6 configure an inductor electrode 7. Both of the metal pins 5 are provided to stand in the resin layer 2, upper end surfaces 5a thereof are exposed to an upper surface 2a of the resin layer 2, and lower end surfaces 5b thereof are exposed to a lower surface 2b. Recesses 8 are formed around the peripheral edges of the upper end surfaces 5a of both of the metal pins 5 by laser beam irradiation.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: June 28, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Mitsuyoshi Nishide
  • Patent number: 11239022
    Abstract: An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: February 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai
  • Publication number: 20220013816
    Abstract: A solid-state battery that includes a solid-state battery laminate having a main surface configured as a circuit forming surface; and a circuit that controls the solid-state battery on the main surface.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 13, 2022
    Inventors: Mitsuyoshi Nishide, Osamu Chikagawa
  • Publication number: 20220013846
    Abstract: A battery that includes a substrate, a solid-state battery on the substrate, and a circuit for the solid-state battery on the substrate.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 13, 2022
    Inventors: Mitsuyoshi Nishide, Tomohiro Kato, Takayuki Nagano
  • Patent number: 11164695
    Abstract: A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: November 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai, Haruhiko Mori
  • Patent number: 11075029
    Abstract: Substrate-side wiring electrode patterns 16, which form a part of a coil electrode 12, are provided on a wiring substrate 20, and as a result reductions in the size and profile of a resin insulating layer 31, in which a coil core 11 is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module 1 can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns 16, which form a part of the coil electrode 12, are provided on the wiring substrate 20, the heat generated by a coil 10 can be efficiently released from the substrate-side wiring electrode patterns 16 to the wiring substrate 20. Therefore, the heat dissipation property of the coil module 1 can be improved at low cost.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: July 27, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichiro Banba, Yoshihito Otsubo, Norio Sakai, Mitsuyoshi Nishide
  • Publication number: 20210167471
    Abstract: A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 3, 2021
    Inventors: Mitsuyoshi Nishide, Takayuki Nagano, Isao Tamaki, Tomohiro Kato, Akira Baba, Haruhiko Mori
  • Patent number: 10734156
    Abstract: An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 4, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai
  • Patent number: 10734150
    Abstract: An inductor device (1) includes a magnetic body (2) and a conductor buried in the magnetic body (2), and the conductor includes first conductors (3) as metal pins. The magnetic body (2) is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors (3) one end portions of which are exposed to the second main surface of the magnetic body (2) and a second conductor (4) which is connected to the other end portions of the first conductors (3).
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: August 4, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Norio Sakai, Mitsuyoshi Nishide, Shinichiro Banba, Tatsuyuki Yamada, Tetsuya Kanagawa, Atsuko Omori
  • Patent number: 10553347
    Abstract: A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins 7, bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: February 4, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichiro Banba, Norio Sakai, Mitsuyoshi Nishide
  • Patent number: 10506717
    Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with end faces 70a to 70d of the metal pins 7a to 7d exposed from an upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect the end faces 70a and 70c of the short metal pins 7a and 7c and the end faces 70b and 70d of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and the wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: December 10, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai
  • Patent number: 10499506
    Abstract: A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: December 3, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaaki Hanao, Tsuyoshi Katsube, Hiromichi Kawakami, Mitsuyoshi Nishide
  • Patent number: 10424430
    Abstract: A module includes an insulating layer, a ring-shaped magnetic core built in the insulating layer, a coil electrode disposed in the insulating layer so as to spirally wind around the magnetic core, and heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer. Building the magnetic core into the insulating layer as described above eliminates the need to provide the principal face of the insulating layer with a large mounting area for mounting a coil formed by the magnetic core and the coil electrode. This allows the area of the principal face of the insulating layer to be reduced to achieve miniaturization of the module. The presence of the heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer improves dissipation of the heat generated from the coil.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: September 24, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Mitsuyoshi Nishide, Yoshihito Otsubo