Patents by Inventor Mitsuyoshi Tsunori

Mitsuyoshi Tsunori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150190881
    Abstract: A heating process makes a temperature of joining surfaces Wa and Ta of a pair of metal parts W and T at the start of a first joining process equal to 20% or greater, preferably, 40% or greater of a melting point of material of the metal parts W and T. The heating process makes a heating depth h of the pair of metal parts W and T at the start of the first joining process equal to 1.0 mm or greater.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 9, 2015
    Applicant: IHI Corporation
    Inventors: Naoki OIWA, Rie SAKAMOTO, Yasuhiro OTAKE, Mitsuyoshi TSUNORI, Kenji NAKAMURA, Hiroaki KAWASHIMA
  • Patent number: 8950651
    Abstract: A heating process makes a temperature of joining surfaces Wa and Ta of a pair of metal parts W and T at the start of a first joining process equal to 20% or greater, preferably, 40% or greater of a melting point of material of the metal parts W and T. The heating process makes a heating depth h of the pair of metal parts W and T at the start of the first joining process equal to 1.0 mm or greater.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: February 10, 2015
    Assignee: IHI Corporation
    Inventors: Naoki Oiwa, Rie Sakamoto, Yasuhiro Otake, Mitsuyoshi Tsunori, Kenji Nakamura, Hiroaki Kawashima
  • Publication number: 20140050519
    Abstract: A heating process makes a temperature of joining surfaces Wa and Ta of a pair of metal parts W and T at the start of a first joining process equal to 20% or greater, preferably, 40% or greater of a melting point of material of the metal parts W and T. The heating process makes a heating depth h of the pair of metal parts W and T at the start of the first joining process equal to 1.0 mm or greater.
    Type: Application
    Filed: October 23, 2013
    Publication date: February 20, 2014
    Applicant: IHI Corporation
    Inventors: Naoki OIWA, Rie Sakamoto, Yasuhiro Otake, Mitsuyoshi Tsunori, Kenji Nakamura, Hiroaki Kawashima