Patents by Inventor Mitunori Mizoguti

Mitunori Mizoguti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8866183
    Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: October 21, 2014
    Assignee: Panasonic Industrial Devices Sunx Co., Ltd.
    Inventors: Sachio Higuchi, Takashi Tanaka, Mitunori Mizoguti, Tsuyoshi Inui, Atsuo Fukuda
  • Publication number: 20130181251
    Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
    Type: Application
    Filed: September 26, 2011
    Publication date: July 18, 2013
    Applicant: PANASONIC INDUSTRIAL DEVICES SUNX CO., LTD.
    Inventors: Sachio Higuchi, Takashi Tanaka, Mitunori Mizoguti, Tsuyoshi Inui, Atsuo Fukuda