Abstract: A lead frame is conveyed along a convey direction in a convey path filled with a reducing gas. A semiconductor pellet is placed on the lead frame at a die bonding portion. A bonding wire made of copper or a copper alloy is supplied to the next wire bonding portion. The lower end of the bonding wire is melted with an oxyhydrogen torch surrounded by an air curtain, thereby forming a ball. The bonding wire is guided into the convey path by a capillary. The ball is thermocompressed to an electrode pad of the semiconductor pellet. The other end of the bonding wire is fused and thermocompressed against the outer lead of the lead frame at a postbonding portion. The bonding wire is thus looped between the semiconductor pellet and the outer lead.

Abstract: A machine tool having an automatic tool changing device wherein a tool magazine storing many tools is rotatably carried by, and movable with, a spindle head, and a desired tool among them can be automatically selected for being set in a spindle. Each tool is respectively held in a proper tool carrying arm swingably supported by the rotary disc which is indexed by an indexing device to be rotated to bring the selected tool to a corresponding position to the spindle. The selected tool is directly set in the spindle, while being held in the tool carrying arm, in accordance with a swing movement of the tool carrying arm from a first position to a second position. The tool carrying arm, which keeps holding the tool in such a manner as to be rotatable with the spindle while machining, can be restored to the first position by a return swing back to the magazine together with the operation finished tool.