Patents by Inventor Miwa Muto

Miwa Muto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRING BOARD
    Publication number: 20240121886
    Abstract: A wiring board includes a dielectric substrate, a ground layer disposed on one surface of the dielectric substrate, a first conductor line and a first ground plane that are disposed apart from each other on the other surface opposing the one surface of the dielectric substrate, and a second conductor line disposed immediately below the first ground plane in the dielectric substrate.
    Type: Application
    Filed: April 13, 2021
    Publication date: April 11, 2024
    Inventors: Miwa Muto, Hideaki Matsuzaki
  • Semiconductor Integrated Circuit
    Publication number: 20230361063
    Abstract: A second protective film is formed on and in contact with a first protective film, and is formed to cover the first protective film. The second protective film is also formed so that an end portion extending toward the center of a first opening is interposed between a wiring line and a bonding pad at the edge portion of the bonding pad.
    Type: Application
    Filed: September 23, 2020
    Publication date: November 9, 2023
    Inventors: Miwa Muto, Hideaki Matsuzaki
  • Impedance Converter
    Publication number: 20220247059
    Abstract: An impedance converter includes a dielectric substrate, a ground layer formed on a rear surface of the dielectric substrate, and a signal line formed in a layer from an inside to a front surface of the dielectric substrate with a distance to the ground layer gradually changed along a signal transfer direction. The signal line includes a plurality of lines stacked in the layer from the inside to the front surface of the dielectric substrate with the distance to the ground layer gradually changed along the signal transfer direction.
    Type: Application
    Filed: May 22, 2019
    Publication date: August 4, 2022
    Inventors: Miwa Muto, Hideaki Matsuzaki
  • Wire bonding structure
    Patent number: 11335661
    Abstract: A first signal electrode and a second signal electrode are connected by a first wire, a first ground electrode and a fourth ground electrode are connected by a second wire, and a second ground electrode and a third ground electrode are connected by a third wire. The second wire and the third wire cross at only one position above the first wire.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: May 17, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Miwa Muto, Hideaki Matsuzaki
  • Wire Bonding Structure
    Publication number: 20200395331
    Abstract: A first signal electrode and a second signal electrode are connected by a first wire, a first ground electrode and a fourth ground electrode are connected by a second wire, and a second ground electrode and a third ground electrode are connected by a third wire. The second wire and the third wire cross at only one position above the first wire.
    Type: Application
    Filed: February 25, 2019
    Publication date: December 17, 2020
    Inventors: Miwa Muto, Hideaki Matsuzaki