Patents by Inventor Mohamad Fauzi Yahaya

Mohamad Fauzi Yahaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resilient snap fitment member
    Patent number: 5732450
    Abstract: A resilient snap fitment member comprising a first spacing member extending from a surface of a mount. A lateral member extends from the first spacing member and is spaced from the mount. A second spacing member extends from the lateral member in the direction away from the surface and a cantilevered abutment member extends from the second spacing member co-acting with the mount to capture a mountable member such as a printed circuit board.
    Type: Grant
    Filed: February 7, 1997
    Date of Patent: March 31, 1998
    Assignee: Motorola, Inc.
    Inventors: Tee Hoh Quah, Seong Jin Lim, Mohamad Fauzi Yahaya