Abstract: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water- and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

Abstract: A datacenter rack assembly providing a liquid cooling arrangement to service an autonomous rack and an immersion cooling rack coexisting within the datacenter rack assembly is presented. The datacenter rack assembly comprises an autonomous rack containing at least one electronic processing assembly, an integrated heat exchanger, and at least one liquid cooling block while the immersion cooling rack comprises a dielectric immersion cooling fluid at least one electronic processing assembly immersed in the dielectric immersion cooling fluid, and at least one liquid cooling block. The datacenter rack assembly incorporates a liquid cooling distribution arrangement to control distribution of liquid for cooling of the autonomous and IC racks through various liquid flow distribution channel segments, temperature sensors, and communication-enabled flow control valves based on detected temperature conditions.

Abstract: An electronic device and a cooling monitoring system for an electronic device receiving power from a power supply. The electronic device includes a board at least in part immersed in an immersion case comprising a first heat-transfer liquid for cooling of the electronic device, one or more sensors configured to measure an operating parameter of the first heat-transfer liquid, and a controller communicably connected to the one or more sensors, the controller being configured to receive signals from the one or more sensors and, in response to determining that the signals indicate that the operating parameter of the first heat-transfer liquid is above a threshold, cause to disconnect the electronic device from the power supply.

Abstract: A fluid leakage deflection arrangement for a liquid-cooled rack-mounted electronic processing assembly and a method for deflecting fluid leakages in a liquid-cooled rack-mounted electronic processing assembly are disclosed. The fluid leakage deflection arrangement comprises an immersion case containing a first cooling liquid in which an electronic device of the rack-mounted electronic processing assembly is at least partially submerged therein; and a deflection unit configured to prevent the electronic device from being in contact with a leaking liquid distinct from the first cooling liquid by diverting leaking liquid away from the electronic components.

Abstract: An autonomous immersive cooling container configured to cool at least one electronic device is described. The autonomous immersive cooling container includes a container, having sidewalls, that contains a dielectric immersion cooling liquid, the at least one electronic device being, at least in part, immersed in the dielectric immersion cooling liquid. The autonomous immersive cooling container further includes a plurality of cooling structures disposed at non-perpendicular angles on the sidewalls, the plurality of cooling structures configured to transfer heat from an interior of the container to exterior air such that no additional cooling subsystem is used to cool the dielectric immersion cooling liquid.

Abstract: A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

Abstract: A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.

Abstract: A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.