Abstract: An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for receiving at least part of the display, where the display holder may extend adjacent part of the front side of the display and adjacent at least part of the side walls of the display. The PCB may be secured relative to the display holder and adjacent the back side of the display. The PCB may be in operative communication with the display. In some cases, a spacer may be situated between the back side of the display and the PCB.

Abstract: Systems and methods herein include features for compensating a temperature reading of a thermostat. The thermostat may include a housing and one or more temperature sensors within the housing. The thermostat may sense a temperature using one or more of the temperature sensors. A processor and/or memory of the thermostat may be capable of and/or configured to compensate the sensed temperature with a first temperature compensation model and compensate the sensed temperature with a second temperature compensation model. During compensation of the sensed temperature, the system may transition from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model over time and independent of the sensed temperature.

Abstract: An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.

Abstract: A surge protection circuit for an electronic device such as an HVAC controller. In one example, the surge protection circuit may include a first voltage clamp, a second voltage clamp, a resistor, and an output port. The first voltage clamp may provide a first clamping voltage between a power input terminal and a common terminal. The second voltage clamp may provide a second clamping voltage that is less than the first clamping voltage. The resistor may be connected in series with the second voltage clamp, and the series connected resistor and second voltage clamp may be connected in parallel with the first voltage clamp. As such, a surge current at the power input terminal may be split between the first voltage clamp and the second voltage clamp. The amount of surge current that is provided to the second voltage clamp may be set by the value of the resistor.

Abstract: An HVAC controller is configured to log one more user interactions into a user interaction log stored in its memory such that at least some of the user interactions may be recalled from the user interaction log and displayed on the user interface of the HVAC controller in response to a request by a user. The user may use the information contained in the user interaction log as an aid in troubleshooting an HVAC system.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include heat generating components such as electronics. The enclosure may also incorporate one or more dynamic components that emanate sudden amounts of heat. The present mechanism compensates for such heat sources with a compensating scheme.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the dimensional 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the dimensional 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.