Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.

Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.

Abstract: A coplanar waveguide (CPW) apparatus comprises a substrate having a first surface and an opposing second surface. The substrate comprises a metal layer proximate to the first surface. The metal layer comprises a conductive trace comprising a signal line coupled to a launcher element at a first end of the signal line, and a ground plane co-planar with the conductive trace. The ground plane defines a substantially rectangular first region surrounding the launcher element and defining a second region surrounding the signal line, the first and second regions substantially devoid of conductive material. The launcher element has a substantially rectangular shape with a width greater than a width of the signal line at the first end.

Abstract: An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.

Abstract: A coplanar waveguide (CPW) apparatus comprises a substrate having a first surface and an opposing second surface. The substrate comprises a metal layer proximate to the first surface. The metal layer comprises a conductive trace comprising a signal line coupled to a launcher element at a first end of the signal line, and a ground plane co-planar with the conductive trace. The ground plane defines a substantially rectangular first region surrounding the launcher element and defining a second region surrounding the signal line, the first and second regions substantially devoid of conductive material. The launcher element has a substantially rectangular shape with a width greater than a width of the signal line at the first end.

Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.

Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.

Abstract: A microstrip antenna includes a substrate having a first surface and an opposing second surface, a ground plane disposed at the first surface of the dielectric layer, and a conductive layer disposed at the second surface of the substrate. The conductive layer includes a continuous conductive trace comprising a plurality of linear segments arranged in a near-closed polygonal chain. The near-closed polygonal chain can define a truncated square spiral shape. Alternatively, the near-closed polygonal chain can define one of a near-closed pentagonal shape, a near-closed hexagonal shape, a near-closed heptagonal shape, and a near-closed octagonal shape.

Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Abstract: A microstrip antenna includes a substrate having a first surface and an opposing second surface, a ground plane disposed at the first surface of the dielectric layer, and a conductive layer disposed at the second surface of the substrate. The conductive layer includes a continuous conductive trace comprising a plurality of linear segments arranged in a near-closed polygonal chain. The near-closed polygonal chain can define a truncated square spiral shape. Alternatively, the near-closed polygonal chain can define one of a near-closed pentagonal shape, a near-closed hexagonal shape, a near-closed heptagonal shape, and a near-closed octagonal shape.

Abstract: A microstrip antenna is formed on a multilayer substrate. The microstrip antenna includes a dipole formed of two dipole halves. Each of the dipole halves is formed in one of at least two layers of the multilayer substrate. Optionally, at least one passive reflector is located proximate the dipole in one of the layers, or a third layer of the substrate.

Abstract: A microstrip antenna includes at least one parasitic patch, located beside a central patch. The parasitic patch is electrically disconnected from the central patch, yet coupled to it, inductively or otherwise, to aid in transferring energy to/from the central patch.

Abstract: A hybrid control algorithm for low profile phased-array antennas, consisting of a gyro control and electronic beam-forming, operates to track the satellite. The antenna arrangements form a spatial phased-array capable of being rotated mechanically both in azimuth and elevation planes by the aid of step motors. An RF detector monitors the received RF power and provides a feedback signal to the control algorithm. Based on the monitored signals, provided by RF detector and gyros, the processing unit operates, under suitable algorithms, to home on and track the desired satellite. The arrangements can be mounted on a vehicle to provide TV and broadband internet signal to the user on the move.