Patents by Inventor Mohammad R. Madani
Mohammad R. Madani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11741389Abstract: The method for obfuscating hardware partially imitates the neural network perceptron, obfuscating the hardware design. This method obfuscates the design functionality and immunes integrated circuits against Trojan insertion. This method can also be used to check for the existence of faults inside chips. This method resolves the concern related to security and reliability when outsourcing the manufacture of integrated circuits.Type: GrantFiled: February 7, 2019Date of Patent: August 29, 2023Assignee: University of Louisiana at LafayetteInventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Patent number: 11664758Abstract: This invention comprises a panel or system of panels. Each panel comprises a top layer, which is comprised of tempered glass that is highly transparent to allow for maximum light wave transmission. These solar light waves are captured by the photovoltaic cell which comprises the second layer of the panel where this solar energy is converted into usable electrical energy. Vibrations experienced by the photopiezoelectric panel due to foot and lightweight vehicle traffic are absorbed by the PZT sheet layer, which is the third layer of the panel where they are converted into usable electrical energy. The fourth and final layer of the panel consists of the connector plate which serves as the hub and interconnection for gathering the generated electrical energies and transmitting them into the modular grid network to be consumed by various load devices, such as streetlights and other power-dependent city infrastructure.Type: GrantFiled: October 7, 2020Date of Patent: May 30, 2023Assignee: University of Louisiana at LafayetteInventors: Mohammad R. Madani, Michael S. Davis
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Patent number: 11392746Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: GrantFiled: March 8, 2021Date of Patent: July 19, 2022Assignee: University of Louisiana LafayetteInventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Patent number: 11231007Abstract: The Cascaded Wind Turbine is a new concept of wind turbine design featuring multiple hubs in succession, each hub segment adds another tier that create a cascading blade configuration. Each blade set is connected to a separate rotor via a telescopic shaft.Type: GrantFiled: September 23, 2019Date of Patent: January 25, 2022Assignee: UNIVERSITY OF LOUISIANA AT LAFAYETTEInventors: Mohammad R. Madani, Michael Stephen Davis
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Publication number: 20210262445Abstract: This invention is an auxiliary wind turbine featuring an aperture. In the preferred embodiment, the device itself is stationary, and mounts onto host objects that move such as wind turbine blades or vehicles. The Aperture Turbine may be oriented on the host object in a plurality of locations to enhance and maximize the intake of kinetic energy from the air moving around and through the Aperture Turbine when in use.Type: ApplicationFiled: February 26, 2021Publication date: August 26, 2021Inventors: Michael Stephen Davis, Mohammad R. Madani, Raymond Joseph Moreaux, III
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Publication number: 20210192119Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: ApplicationFiled: March 8, 2021Publication date: June 24, 2021Inventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Publication number: 20210111662Abstract: This invention comprises a panel or system of panels. Each panel comprises a top layer, which is comprised of tempered glass that is highly transparent to allow for maximum light wave transmission. These solar light waves are captured by the photovoltaic cell which comprises the second layer of the panel where this solar energy is converted into usable electrical energy. Vibrations experienced by the photopiezoelectric panel due to foot and lightweight vehicle traffic are absorbed by the PZT sheet layer, which is the third layer of the panel where they are converted into usable electrical energy. The fourth and final layer of the panel consists of the connector plate which serves as the hub and interconnection for gathering the generated electrical energies and transmitting them into the modular grid network to be consumed by various load devices, such as streetlights and other power-dependent city infrastructure.Type: ApplicationFiled: October 7, 2020Publication date: April 15, 2021Inventors: Mohammad R. Madani, Michael S. Davis
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Patent number: 10970453Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: GrantFiled: April 21, 2020Date of Patent: April 6, 2021Assignee: University of Louisiana at LafayetteInventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Publication number: 20210074655Abstract: A system and method for adding security to floating gate transistors (FGT), including applications for guarding integrated circuit (IC) chips against reverse engineering techniques, such as Scanning Capacitance Microscopy (SCM). By adding a processing step to the conventional FGT through adding an oppositely doped implanted layer to the substrate, the FGT state cannot be easily detected with SCM reverse engineering.Type: ApplicationFiled: September 3, 2020Publication date: March 11, 2021Inventors: Hossein Zandipour, Mohammad R. Madani
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Publication number: 20200250366Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: ApplicationFiled: April 21, 2020Publication date: August 6, 2020Inventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Publication number: 20200226492Abstract: The method for obfuscating hardware partially imitates the neural network perceptron, obfuscating the hardware design. This method obfuscates the design functionality and immunes integrated circuits against Trojan insertion. This method can also be used to check for the existence of faults inside chips. This method resolves the concern related to security and reliability when outsourcing the manufacture of integrated circuits.Type: ApplicationFiled: February 7, 2019Publication date: July 16, 2020Inventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Patent number: 10664643Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: GrantFiled: February 7, 2019Date of Patent: May 26, 2020Assignee: University of Louisiana at LafayetteInventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi
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Publication number: 20200095975Abstract: The Cascaded Wind Turbine is a new concept of wind turbine design featuring multiple hubs in succession, each hub segment adds another tier that create a cascading blade configuration. Each blade set is connected to a separate rotor via a telescopic shaft.Type: ApplicationFiled: September 23, 2019Publication date: March 26, 2020Inventors: Mohammad R. Madani, Michael Stephen Davis
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Publication number: 20190251226Abstract: The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.Type: ApplicationFiled: February 7, 2019Publication date: August 15, 2019Inventors: Siroos Madani, Mohammad R. Madani, Magdy Bayoumi