Abstract: An electronics package includes a spring screw mounted assembly with a screw, a spring, a washer, electromagnetic shielding, and a seal. The seal is operable to prevent fluids or particulates from entering into the electronics package at the location where the screw engages with an enclosure forming the exterior of the electronics package. The electromagnetic shielding is operable to prevent electromagnetic interference or emission through the bore opening on the enclosure. The spring is operable to provide a controllable accurate load between processing units and the enclosure, to ensure sufficient or minimum thermal contact between components of the electronics package including the enclosure and processing units housed within the enclosure. The electronics package can include a stiffener that is operable to engage with the screw, where the stiffener is positioned proximate to the processing units.

Abstract: A dual-cam ejector assembly for a card, such as a line card, is provided. The ejector assembly comprises an elongated ejector arm having its distal end coupled to the line card so as to provide a first axis of rotation for the ejector arm. The ejector assembly further comprises an ejector cam coupled to the line card so as to provide a second axis of rotation for the ejector cam. The ejector assembly also comprises a cam pin extending from the ejector cam that couples the ejector cam to the ejector arm such that pivoting of the ejector arm around the first axis of rotation causes the ejector cam to pivot around the second axis of rotation.

Abstract: A dual-cam ejector assembly for a card, such as a line card, is provided. The ejector assembly comprises an elongated ejector arm having its distal end coupled to the line card so as to provide a first axis of rotation for the ejector arm. The ejector assembly further comprises an ejector cam coupled to the line card so as to provide a second axis of rotation for the ejector cam. The ejector assembly also comprises a cam pin extending from the ejector cam that couples the ejector cam to the ejector arm such that pivoting of the ejector arm around the first axis of rotation causes the ejector cam to pivot around the second axis of rotation.

Abstract: In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.

Abstract: In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.

Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.

Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.