Abstract: A magnetic core includes a winding core portion and two flange portions. The winding core portion is an octagonal cylinder. Two flange portions are respectively provided to two ends of the octagonal cylinder. Each of two flange portions has a top surface. One end of each of plural winding wires is connected to the top surface of one of two flange portions, and the other end of each of the winding wires is connected to the top surface of the other one of two flange portions. The octagonal cylinder has a first lateral surface and a second lateral surface adjacent to each other. The first lateral surface of the octagonal cylinder is parallel to the top surface of each of two flange portions. The area of the first lateral surface of the octagonal cylinder is less than the area of the second lateral surface of the octagonal cylinder.

Abstract: A lead-frame structure and a magnetic core structure combined with lead-frame structure are described. The lead-frame structure includes a frame, a first metal terminal assembly, and a second metal terminal assembly. The frame includes a first assembling portion and a second assembling portion spaced apart from each other. The first metal terminal assembly is formed on the first assembling portion and includes first terminals. The second metal terminal assembly is formed on the second assembling portion and includes second terminals. A top surface of each first terminal, a top surface of each second terminal, a top surface of the first assembling portion, and a top surface of the second assembling portion are coplanar. The magnetic core structure includes a body combined with the above-described lead-frame structure. The body provides convex beds to improve a positional accuracy of the first terminals and the second terminals.

Abstract: A patch type transformer includes a magnetic core and four coils wound around a winding portion of the magnetic core. A first flange portion and a second flange portion of the magnetic core are respectively connected to two ends of the winding portion. First to fourth pads are sequentially arranged on the first flange portion along a first direction. Fifth to eighth pads are sequentially arranged on the second flange portion along a second direction opposite to the first direction. Two ends of the first coil are respectively connected to the first pad and the seventh pad. Two ends of the second coil are respectively connected to the third pad and the fifth pad. Two ends of the third coil are respectively connected to the second pad and the eighth pad. Two ends of the fourth coil are respectively connected to the fourth pad and the sixth pad.

Abstract: Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Abstract: Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Abstract: Improved balance winding of electronic components including common-mode chokes and methods for using and manufacturing the same. In one embodiment, the common-mode choke includes a core and a pair of windings. The first winding and the second winding are alternatingly wound around the core with each respective winding being flipped at least once over the traverse direction of the winding barrel of the core. In one variant, the number of flips is dependent upon the core geometry, number of windings, and/or the specification limits on electrical balance. In another variant, the windings are first twisted and/or braided prior to being wound onto the winding barrel of the core.

Abstract: An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.

Abstract: An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.

Abstract: Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.

Abstract: Improved balance winding of electronic components including common-mode chokes and methods for using and manufacturing the same. In one embodiment, the common-mode choke includes a core and a pair of windings. The first winding and the second winding are alternatingly wound around the core with each respective winding being flipped at least once over the traverse direction of the winding barrel of the core. In one variant, the number of flips is dependent upon the core geometry, number of windings, and/or the specification limits on electrical balance. In another variant, the windings are first twisted and/or braided prior to being wound onto the winding barrel of the core.

Abstract: Flexible substrate inductive apparatus and methods for manufacturing, and utilizing, the same. In one embodiment, the flexible substrate inductive device includes a square shaped ferrite core having four (4) portions of flexible substrate disposed thereon. The disposal of the conductive traces onto the substrate utilizes highly controlled manufacturing processes such that the characteristics of the device, including the spacing and pitch of the windings, can be accurately controlled. The accurate placement of these conductive traces produces an inductive device with highly consistent performance capabilities as compared with traditional wire wound inductive devices. In addition to the performance capabilities provided via the use of flexible substrates utilizing highly automated processes, the flexible substrate inductive devices disclosed herein minimize/eliminate errors associated with traditional wire wound inductive devices.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures by incorporating surface mountable chip chokes in the underlying circuit design, These conditions that result in undesirable CAF include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.