Abstract: Microphones including a housing defining a cavity, a plurality of conductors positioned within the cavity, at least one dielectric bar positioned within the cavity, and a transducer diaphragm. The conductors are structured to move in response to pressure changes while the housing remains fixed. A first conductor generates first electrical signals responsive to the pressure changes resulting from changes in an atmospheric pressure. A second conductor generates second electrical signals responsive to the pressure changes resulting from acoustic activity. The dielectric bar is fixed with respect to the cavity and remains fixed under the pressure changes. The dielectric bar is adjacent to at least one of the conductors. In response to an applied pressure that is an atmospheric pressure and/or an acoustic pressure, the transducer diaphragm exerts a force on the housing and displaces at least a portion of conductors with respect to the dielectric bar.

Abstract: A microphone assembly includes an acoustic filter with a first highpass cut-off frequency. The microphone assembly additionally includes a forward signal path and a feedback signal path. The forward signal path is configured to amplify or buffer an electrical signal generated by a transducer in response to sound and to convert the electrical signal to a digital signal. The feedback signal path is configured to generate a digital control signal based on the digital signal and to generate and output a sequence of variable current pulses based on the digital control signal. The variable current pulses suppress frequencies of the electrical signal below a second highpass cut-off frequency, higher than the first highpass cut-off frequency.

Abstract: A microphone assembly includes an acoustic transducer and an audio signal electrical circuit configured to receive an output signal from the acoustic transducer. The output signal includes an audio signal component and a tracking signal component. The audio signal component is representative of an acoustic signal detected by the acoustic transducer and the tracking signal component is based on an input tracking signal applied to the acoustic transducer. The audio signal electrical circuit includes an analog to digital converter configured to convert the output signal into a digital signal, an extraction circuit configured to separate the tracking signal component and the audio signal component from the digital signal, an envelope estimation circuit configured to estimate a tracking signal envelope from the tracking signal component, and a signal correction circuit configured to reduce distortion in the audio signal component using the tracking signal envelope.

Abstract: A microphone assembly includes a transducer element and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize a microphone signal generated by the transducer element to generate a corresponding digital microphone signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital microphone signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node at the transducer output configured to combine the microphone signal and the analog feedback signal.

Abstract: This disclosure provides methods, systems, and apparatuses, for a microphone circuit. In particular, the circuit includes transducer that can sense pressure changes and generate an electrical signal having frequency components in a first frequency range and in a second frequency range higher than the first frequency range. The circuit includes a feedback circuitry that can attenuate frequency components in the first frequency range in the electrical signal and, from it, generate an audio signal. A feedback path circuit includes a low pass filter having a cut-off frequency within the first frequency range, and filters the audio signal to generate a low pass filter signal that includes frequency components in the first frequency range. The low pass filter signal can be used to generate a low frequency pressure signal that corresponds to low frequency pressure changes sensed by the transducer.

Abstract: A microphone assembly includes a transducer element and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize a microphone signal generated by the transducer element to generate a corresponding digital microphone signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital microphone signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node at the transducer output configured to combine the microphone signal and the analog feedback signal.

Abstract: A microphone assembly includes an acoustic transducer and an audio signal electrical circuit configured to receive an output signal from the acoustic transducer. The output signal includes an audio signal component and a tracking signal component. The audio signal component is representative of an acoustic signal detected by the acoustic transducer and the tracking signal component is based on an input tracking signal applied to the acoustic transducer. The audio signal electrical circuit includes an analog to digital converter configured to convert the output signal into a digital signal, an extraction circuit configured to separate the tracking signal component and the audio signal component from the digital signal, an envelope estimation circuit configured to estimate a tracking signal envelope from the tracking signal component, and a signal correction circuit configured to reduce distortion in the audio signal component using the tracking signal envelope.

Abstract: A microphone assembly comprising: a housing including a base, a cover, and a sound port; a MEMS transducer element disposed in the housing, the transducer element configured to convert sound into a microphone signal voltage at a transducer output; and a processing circuit. The processing circuit comprising a transconductance amplifier comprising an input node connected to the transducer output for receipt of the microphone signal voltage, the transconductance amplifier being configured to generate an amplified current signal representative of the microphone signal voltage in accordance with a predetermined transconductance of the transconductance amplifier; and an analog-to-digital converter comprising an input node connected to receive the amplified current signal, said analog-to-digital converter being configured to sample and quantize the amplified current signal to generate a corresponding digital microphone signal.

Abstract: A microphone assembly includes a transducer and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize an electrical signal generated by the transducer to generate a corresponding digital signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node configured to combine the electrical signal and the analog feedback signal.

Abstract: A microphone assembly includes an acoustic filter with a first highpass cut-off frequency. The microphone assembly additionally includes a forward signal path and a feedback signal path. The forward signal path is configured to amplify or buffer an electrical signal generated by a transducer in response to sound and to convert the electrical signal to a digital signal. The feedback signal path is configured to generate a digital control signal based on the digital signal and to generate and output a sequence of variable current pulses based on the digital control signal. The variable current pulses suppress frequencies of the electrical signal below a second highpass cut-off frequency, higher than the first highpass cut-off frequency.

Abstract: A microphone assembly includes an acoustic transducer element configured to convert sound into a microphone signal in accordance with a transducer frequency response including a first highpass cut-off frequency. The microphone assembly additionally includes a processing circuit including a signal amplification path configured to receive, sample and digitize the microphone signal to provide a digital microphone signal. A frequency response of the signal amplification path includes a second highpass cut-off frequency which is higher than the first highpass cut-off frequency of the acoustic transducer element.

Abstract: A microphone assembly includes an acoustic transducer element configured to convert sound into a microphone signal in accordance with a transducer frequency response including a first highpass cut-off frequency. The microphone assembly additionally includes a processing circuit including a signal amplification path configured to receive, sample and digitize the microphone signal to provide a digital microphone signal. A frequency response of the signal amplification path includes a second highpass cut-off frequency which is higher than the first highpass cut-off frequency of the acoustic transducer element.

Abstract: A microphone assembly includes a transducer element and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize a microphone signal generated by the transducer element to generate a corresponding digital microphone signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital microphone signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node at the transducer output configured to combine the microphone signal and the analog feedback signal.

Abstract: The present invention relates to a driver circuit wherein upper and lower legs of a first driver comprise first and second sets of parellelly coupled semiconductor switches, respectively. A control circuit is configured to generate respective control signals for the first and second sets of parellelly coupled semiconductor switches to create a current path through the upper and lower legs during an overlap time period between state transitions of a driver output.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

Abstract: An integrated circuit configured to provide a microphone output signal, comprising: a preamplifier coupled to receive an input signal, generated by either a first microphone member or a second microphone member, where one of the members is movable relative to the other microphone member; a voltage pump to output a pumped voltage; and a low-pass filter coupled to filter the pumped voltage from the voltage pump and to provide a bias voltage to either microphone member.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.