Patents by Inventor Mohammed S. Shaikh
Mohammed S. Shaikh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9630269Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.Type: GrantFiled: October 30, 2013Date of Patent: April 25, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Vijayeshwar D. Khanna, Mohammed S. Shaikh
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Patent number: 9335346Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: September 10, 2012Date of Patent: May 10, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20150118799Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.Type: ApplicationFiled: October 30, 2013Publication date: April 30, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. KHANNA, Mohammed S. SHAIKH
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Patent number: 8806740Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: August 19, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Patent number: 8595919Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: December 3, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Patent number: 8487304Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: April 30, 2010Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20120329295Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: September 10, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20110266539Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20110199109Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Publication number: 20110199108Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Patent number: 7987591Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: August 13, 2009Date of Patent: August 2, 2011Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Publication number: 20110037489Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: August 13, 2009Publication date: February 17, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Patent number: 7456640Abstract: An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.Type: GrantFiled: February 16, 2006Date of Patent: November 25, 2008Assignee: International Business Machines CorporationInventors: Ronald Richard Breton, S. Jay Chey, Steven Alan Cordes, Matthew Farinelli, Michael David Fregeau, Sherif Ahmed Goma, Gene T. Patrick, Mohammed S. Shaikh
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Patent number: 6967557Abstract: A space transformer including a body; a ground conductor within the body; a power conductor within the body, the power conductor adapted to be at a higher voltage level than a voltage level of the ground conductor; and one or more decoupling capacitors physically located within the body and electrically connected between the ground conductor and the power conductor.Type: GrantFiled: August 26, 2003Date of Patent: November 22, 2005Assignee: International Business Machines CorporationInventors: John F. Hagios, Mohammed S. Shaikh
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Patent number: 5585600Abstract: The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip which has a major surface having input and output bonding pads thereon, is secured to a lead frame having a plurality of leads adjacent the bonding pads by means of bonding wires connecting a respective one of the leads to a pad on the chip. A coating of dielectric material having a Young's modulus in the range of about 10 psi to about 500 psi is disposed around the entire length of each of the wires and over the pads and over the portion of the respective leads to which the wires are connected to act as a stress buffer. This material preferably has a T.sub.g of at least as low as -40.degree. C. Also preferably this package is encapsulated with conventional encapsulant.Type: GrantFiled: September 2, 1993Date of Patent: December 17, 1996Assignee: International Business Machines CorporationInventors: Francis E. Froebel, David L. Gardell, Gary H. Irish, Mohammed S. Shaikh
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Patent number: 5508883Abstract: An air mixer cool plate (100) for dissipating heat from a plurality of heat-generating elements (22) positioned in an air stream (26). The plate is made from a material having a thermal conductivity preferably ranging from 1 to 500 watts/meter-K and is designed to be positioned to contact the top surfaces of the heat-generating elements. The plate includes a plurality of apertures (106, 108) and a plurality of upstanding air deflectors (110). The apertures and deflectors are arranged so that when the plate is supported in predetermined relation to the heat-generating elements and the air stream, the plate will cause the air stream to be deflected so as to flow in intimate contact with the elements, thereby carrying heat away from the elements by convection and conduction.Type: GrantFiled: January 17, 1995Date of Patent: April 16, 1996Assignee: International Business Machines CorporationInventors: Douglas L. Lumbra, Mohammed S. Shaikh