Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.

Abstract: An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.

Abstract: A digitizer tablet has a base integrated with a heat sink. The base includes a flat portion which surrounds the heat sink. The sink is recessed relative to the flat portion and includes a flat upper surface on which a thermal pad is mounted. A planar member overlies the base and has a plurality of heat generating modules mounted on the underside thereof, the modules being pressed into the thermal pad to establish a thermal conduction whereby heat flows from the modules through the thermal pad and into the heat sink. The underside of the heat sink is recessed and has a plurality of cooling pins which provide a relatively large area. The pins are cooled by natural air convection and radiation, and lie within the recess to prevent body contact with portions other than the tips thereof. Bosses mount the planar member on the base and coact with fasteners to press the modules against the thermal pad.

Abstract: This invention relates to personal computers in which provision is made for effective cooling of components capable of generating significant heat during operation, such as certain high performance microprocessors. The personal computer has an enclosure for enclosing operating components, a printed circuit board mounted within the enclosure for supporting and interconnecting operating components of the personal computer, heat generating components mounted on the printed circuit board for performing operating functions for the personal computer, a fan for inducing air to flow into the enclosure, a fan for expelling air from the enclosure, and an air flow directing baffle mounted within the enclosure in the path of air flow from one fan toward the other fan and adjacent the heat generating components for directing the flow of air through the enclosure to pass over and cool the heat generating components.

Abstract: A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.

Abstract: A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

Abstract: A thermal tester for measuring the efficiency of a heat transfer device for cooling semiconductor chips is disclosed having a positioning means operable to position the heat transfer device in thermal contact with the chip. The positioning means is adjustable in at least 5 degrees of freedom. Temperature sensors are provided to sense the temperature of the chip, the chip support substrate and the positioning means adjacent the heat transfer device. Means is provided to dispose the chip and heat transfer device in a vacuum. Control means is also provided to adjust the temperature of the chip unitl it is the same as the substrate to thereby assure heat transfer occurs only from the chip to the positioning means by way of the heat transfer device. When this thermal balance is achieved the thermal resistance of the heat transfer device can be calculated.

Abstract: A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module. The provision of thin leaf shaped members each having a relatively long thin planar surface in thermal contact with a planar surface of the chip to be cooled, said thin leaf shaped members each being contained within a module cover, each of said thin leaf shaped members being spring biased in thermal contact with said planar surface of said chip, whereby the relatively long thin planar surface of each thin leaf shaped member is maintained in intimate thermal contact with the planar surface of the chip.