Patents by Inventor Mohsen Salek
Mohsen Salek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10515834Abstract: Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.Type: GrantFiled: October 5, 2016Date of Patent: December 24, 2019Assignee: Lam Research CorporationInventors: Mohsen Salek, Richard M. Blank, Richard Howard Gould, Efrain Quiles
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Publication number: 20170125272Abstract: Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.Type: ApplicationFiled: October 5, 2016Publication date: May 4, 2017Inventors: James Stephen van Gogh, Candi Kristoffersen, Mohsen Salek, Brandon Senn, Harmeet Singh, Derek John Witkowicki, Richard M. Blank, Richard Howard Gould, Efrain Quiles
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Publication number: 20170092516Abstract: A semiconductor processing system may be provided that includes a first plurality of semiconductor processing tools with a first average wafer transfer plane and a second plurality of semiconductor processing tools with a second average wafer transfer plane. The second plurality of semiconductor processing tools may be vertically offset from the first plurality of semiconductor processing tools by a first vertical distance measured between the first average wafer transfer plane and the second average wafer transfer plane, and the first and second pluralities of semiconductor processing tools are in a commonly shared space.Type: ApplicationFiled: September 26, 2016Publication date: March 30, 2017Inventors: James Stephen van Gogh, Mohsen Salek, Candi Kristoffersen, Richard Howard Gould
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Patent number: 7819079Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.Type: GrantFiled: September 8, 2006Date of Patent: October 26, 2010Assignee: Applied Materials, Inc.Inventors: Eric A. Englhardt, Michael R. Rice, Jeffrey C. Hudgens, Steve Hongkham, Jay D. Pinson, Mohsen Salek, Charles Carlson, William T Weaver, Helen R. Armer
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Publication number: 20090023297Abstract: A system for dispensing an adhesion promoting chemical includes a support plate configured to support a substrate and a dispense nozzle in fluid communication with a source of the adhesion promoting chemical, for example, HMDS. The dispense nozzle is positioned adjacent a peripheral portion of the substrate and at a first radial distance. The system also includes an exhaust aperture in fluid communication with a system exhaust. The exhaust aperture is positioned adjacent to dispense nozzle and at a second radial distance greater than the first radial distance.Type: ApplicationFiled: July 18, 2007Publication date: January 22, 2009Applicant: SOKUDO CO., LTD.Inventor: Mohsen Salek
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Publication number: 20080050679Abstract: A method of processing a substrate includes forming a coating layer over a front surface of the substrate and exposing the coating layer in an immersion scanner. The coating layer may include a photoresist layer. The method also includes performing one or more immersion processes on the substrate after exposure. As an example, the one or more immersion processes include an immersion post-exposure bake process.Type: ApplicationFiled: February 22, 2007Publication date: February 28, 2008Applicant: SOKUDO CO., LTD.Inventors: Mohsen Salek, Tetsuya Ishikawa, Christoper Beaudry, Steven Verhaverbeke, Helen Armer, Harald Herchen, Leon Volfovsky
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Publication number: 20070144439Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.Type: ApplicationFiled: September 8, 2006Publication date: June 28, 2007Inventors: Eric A. Englhardt, Michael R. Rice, Jeffrey C. Hudgens, Steve Hongkham, Jay D. Pinson, Mohsen Salek, Charles Carlson, William T. Weaver, Helen R. Armer
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Publication number: 20060286300Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: July 19, 2006Publication date: December 21, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
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Publication number: 20060278165Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: July 19, 2006Publication date: December 14, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Patent number: 7115024Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.Type: GrantFiled: January 5, 2005Date of Patent: October 3, 2006Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
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Publication number: 20060130750Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: April 22, 2005Publication date: June 22, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Mike Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20060134330Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: April 22, 2005Publication date: June 22, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
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Publication number: 20050186892Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.Type: ApplicationFiled: January 5, 2005Publication date: August 25, 2005Inventors: Hung Chen, Steven Zuniga, Charles Garretson, Thomas Osterheld, Sen-Hou Ko, Mohsen Salek
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Patent number: 6913518Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.Type: GrantFiled: May 6, 2003Date of Patent: July 5, 2005Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
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Publication number: 20040224615Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.Type: ApplicationFiled: May 6, 2003Publication date: November 11, 2004Applicant: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
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Patent number: 6709218Abstract: The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.Type: GrantFiled: June 3, 1999Date of Patent: March 23, 2004Assignee: Applied Materials, Inc.Inventors: Frederik W. Freerks, Tetsuya Ishikawa, Timothy Y. Wang, Jeffrey C. Hudgens, James R. Ciulik, Mohsen Salek, Tim Leong, Al DiFrancesco
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Publication number: 20030070695Abstract: A method and apparatus for removing an edge bead from a substrate. The apparatus includes rotatable substrate support member configured to support a substrate thereon and at least one fluid distribution nozzle positioned to distribute an edge bead removal solution onto the substrate. A conically shaped shield member is positioned above the substrate support member, the shield member having a fluid conduit formed therein and an annular gas distribution nozzle positioned on a lower portion of the shield member, the annular gas nozzle being in fluid communication with the fluid conduit. The method includes rotating a substrate on a substrate support member, dispensing an edge bead removal solution onto an exclusion zone of the substrate with at least one fluid nozzle, and dispensing a gas flow from at least one gas nozzle positioned above the substrate radially inward from the at least one fluid nozzle, the gas flow radiating outward across the exclusion zone.Type: ApplicationFiled: October 16, 2001Publication date: April 17, 2003Applicant: Applied Materials, Inc.Inventors: Ramin Emami, Bo Zheng, Mohsen Salek
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Patent number: 6390904Abstract: The present invention provides a retaining ring having an resilient liner for protecting the substrate edge from being damaged during chemical mechanical polishing and a method for making the same. Retainers made of wear resistant ceramics, such as alumina, provide better overall performance, including wear resistance, and reduced particle formation than other retaining ring materials. By incorporating a resilient liner, such as an epoxy, on the inner surface of the wear resistant ring, the substrate edge is protected from damage that can be easily caused by the hard surface of the ceramic alone.Type: GrantFiled: May 21, 1998Date of Patent: May 21, 2002Assignee: Applied Materials, Inc.Inventors: Allan Gleason, Manoocher Birang, John Prince, Mohsen Salek, Syed Askari
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Patent number: 6334229Abstract: An apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.Type: GrantFiled: January 7, 1999Date of Patent: January 1, 2002Assignee: Lam Research CorporationInventors: Mansour Moinpour, Hoang T. Nguyen, Mohsen Salek, Young C. Park, Tom Bramblett, John M. deLarios, Lynn S. Ryle, Donald E. Anderson, Wilbur C. Krusell
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Patent number: 5861066Abstract: A method and apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.Type: GrantFiled: May 1, 1996Date of Patent: January 19, 1999Assignees: OnTrak Systems, Inc., Intel CorporationInventors: Mansour Moinpour, Hoang T. Nguyen, Mohsen Salek, Young C. Park, Tom Bramblett, John M. deLarios, Lynn S. Ryle, Donald E. Anderson, Wilbur C. Krusell