Patents by Inventor Moo Hyun KIM
Moo Hyun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240069535Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.Type: ApplicationFiled: July 14, 2022Publication date: February 29, 2024Inventors: Shinkyu KANG, Min Yong KIM, Youngduk KIM, Nam Hyuck KIM, Su Ho JEON, Min Hee KWON, Sung Nam CHO, Hyeong Geun CHAE, Gyeong Yun JO, Moon Kyu JO, Kyungchul HWANG, Moo Hyun YOO, Han Seung KIM, Daewoon JUNG, Seungtae KIM, Junhyeok JEON
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Publication number: 20230384004Abstract: In order to improve cooling efficiency, the present disclosure provides a concave-convex evaporator including a first plate bent in a concave-convex shape in which a peak part and a valley part extending in a longitudinal direction are repeatedly alternately formed in a transverse direction, a second plate bent in a concave-convex shape of which one surface is repeatedly alternately formed to face one surface of the first plate, and a spacer part provided between the first plate and the second plate to maintain a separation interval so that a refrigerant flow path is formed.Type: ApplicationFiled: May 23, 2023Publication date: November 30, 2023Inventor: Moo Hyun KIM
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Patent number: 11492893Abstract: An apparatus for predicting a deformed shape of a structure, and method of operating and forming the same. In an embodiment, the apparatus is formed with a riser with ends coupled respectively to an upper location and a lower location. The apparatus includes sensors configured to sense an inclination of the riser at riser nodes positioned on the riser between the upper location and the lower location. The apparatus further includes a data processing system configured to produce an estimate of a deformed shape of the riser employing deformed shaped functions to represent, respectively, the estimate of the deformed shape of the riser above and below the riser nodes.Type: GrantFiled: May 25, 2018Date of Patent: November 8, 2022Assignee: THE TEXAS A&M UNIVERSITY SYSTEMInventors: Junho Choi, Moo-Hyun Kim
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Publication number: 20220081080Abstract: An apparatus, method and system for real-time monitoring of underwater risers, cables, and mooring lines based on a Kalman filter. In an embodiment, the system is formed with sensors configured to sense an inclination of a riser segment between riser nodes of the riser between the upper end and the lower end. A data processing system is configured to employ a Kalman filter algorithm to produce real-time estimates of a deformed shape and a stress of the riser segment using the sensed inclination between the riser nodes.Type: ApplicationFiled: September 13, 2021Publication date: March 17, 2022Applicant: The Texas A&M University SystemInventors: Moo-Hyun Kim, Hansung Kim, Chungkuk Jin
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Patent number: 11264249Abstract: Apparatus, systems, and methods for conducting a hardmask (e.g., carbon containing hardmask) removal process on a workpiece are provided. In one example implementation, a process can include admitting a process gas into a plasma chamber, generating a plasma in the plasma chamber from the process gas using an inductively coupled plasma source, and exposing the carbon containing hardmask to the plasma to remove at least a portion of the carbon containing hardmask. The process gas can include a sulfur containing gas. The process gas does not include a halogen containing gas. The inductively coupled plasma source can be separated from the plasma chamber by a grounded electrostatic shield to reduce capacitive coupling between the inductively coupled plasma source and the plasma.Type: GrantFiled: December 13, 2019Date of Patent: March 1, 2022Assignees: Mattson Technology, Inc., Beijing E-Town Semiconductor Technology Co., Ltd.Inventors: Fen Dai, Tinghao Wang, Oliver D. Jan, Moo-Hyun Kim, Shawming Ma, Zhongming Liu
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Publication number: 20210101237Abstract: A tool changing system of a machining center for machining a workpiece of a vehicle includes a machining unit including a jig portion for loading the workpiece and a tool loading device for loading a tool for machining the workpiece, a first magazine for storing a plurality of first tools, a second magazine for storing a plurality of second tools, and a controller configured to manage changing of the first tool between the machining unit and the first magazine and changing of the second tool between the machining unit.Type: ApplicationFiled: March 31, 2020Publication date: April 8, 2021Inventors: Moo Hyun Kim, Jekwang Cho, Ji Won Yu
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Publication number: 20200258718Abstract: Plasma processing apparatus and associated methods are provided. In one example implementation, the plasma processing apparatus can include a gas supply in a processing chamber of a plasma processing apparatus, such as an inductively coupled plasma processing apparatus. The gas supply can include one or more injectors. Each of the one or more injectors can be angled relative to a direction parallel to a radius of the workpiece to produce a rotational gas flow relative to a direction perpendicular to a center of the workpiece. Such gas supply can improve process uniformity, workpiece edge critical dimension tuning, gas ionization efficiency, and/or symmetric flow inside the processing chamber to reduce particle deposition on a workpiece and can also reduce heat localization from a stagnate flow.Type: ApplicationFiled: February 7, 2019Publication date: August 13, 2020Inventors: Tinghao F. Wang, Yorkman Ma, Yun Yang, Shawming Ma, Moo-Hyun Kim, Peter J. Lembesis, Ryan M. Pakulski
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Publication number: 20200194277Abstract: Apparatus, systems, and methods for conducting a hardmask (e.g., carbon containing hardmask) removal process on a workpiece are provided. In one example implementation, a process can include admitting a process gas into a plasma chamber, generating a plasma in the plasma chamber from the process gas using an inductively coupled plasma source, and exposing the carbon containing hardmask to the plasma to remove at least a portion of the carbon containing hardmask. The process gas can include a sulfur containing gas. The process gas does not include a halogen containing gas. The inductively coupled plasma source can be separated from the plasma chamber by a grounded electrostatic shield to reduce capacitive coupling between the inductively coupled plasma source and the plasma.Type: ApplicationFiled: December 13, 2019Publication date: June 18, 2020Inventors: Fen Dai, Tinghao Wang, Oliver D. Jan, Moo-Hyun Kim, Shawming Ma, Zhongming Liu
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Publication number: 20200123891Abstract: An apparatus for predicting a deformed shape of a structure, and method of operating and forming the same. In an embodiment, the apparatus is formed with a riser with ends coupled respectively to an upper location and a lower location. The apparatus includes sensorsconfigured to sense an inclination of the riser at riser nodes positioned on the riser between the upper location and the lower location. The apparatus further includes a data processing system configured to produce an estimate of a deformed shape of the riser employing deformed shaped functions to represent, respectively, the estimate of the deformed shape of the riser above and below the riser nodes.Type: ApplicationFiled: May 25, 2018Publication date: April 23, 2020Applicant: The Texas A&M University SystemInventors: Junho Choi, Moo-Hyun Kim
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Patent number: 10590272Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.Type: GrantFiled: December 21, 2015Date of Patent: March 17, 2020Assignee: DOOSAN CORPORATIONInventors: Dong Hee Jung, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
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Patent number: 10584239Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.Type: GrantFiled: May 28, 2019Date of Patent: March 10, 2020Assignee: DOOSAN CORPORATIONInventors: Dong Hee Jung, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
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Publication number: 20190292364Abstract: The present invention relates to a thermosetting resin composition, and a prepreg, a laminate sheet and a printed circuit board, which use the same. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof; and (b) a polytetrafluoroethylene (PTFE) filler.Type: ApplicationFiled: June 30, 2017Publication date: September 26, 2019Applicant: DOOSAN CORPORATIONInventors: Moo Hyun KIM, Jeong Don KWON, Dong Hee JUNG, Ji Hong SHIN
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Publication number: 20190284393Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.Type: ApplicationFiled: May 28, 2019Publication date: September 19, 2019Applicant: DOOSAN CORPORATIONInventors: Dong Hee JUNG, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
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Patent number: 10019464Abstract: An apparatus and a method for searching for an image are provided. The apparatus includes an image receiver configured to receive an image to be searched for; an image processor configured to detect an edge of the received image and to filter pixels included on the edge of the received image based on parameters related to gradients of the edge of the received image; and an image search unit configured to search for one or more images related to the image to be searched for based on the filtered pixels included on the edge of the received image.Type: GrantFiled: August 6, 2015Date of Patent: July 10, 2018Assignee: Samsung Electronics Co., LtdInventors: Won-Ki Kim, Moo-Hyun Kim, Yeong-Woong Park, Bo-Hyun Song, Jung-Jun Lee
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Patent number: 9957389Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.Type: GrantFiled: November 25, 2014Date of Patent: May 1, 2018Assignee: DOOSAN CORPORATIONInventors: Dong Hee Jung, Duk Sang Han, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
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Publication number: 20170342264Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.Type: ApplicationFiled: December 21, 2015Publication date: November 30, 2017Applicant: DOOSAN CORPORATIONInventors: Dong Hee JUNG, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
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Publication number: 20160297967Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.Type: ApplicationFiled: November 25, 2014Publication date: October 13, 2016Applicant: DOOSAN CORPORATIONInventors: Dong Hee JUNG, Duk Sang HAN, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
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Publication number: 20160042527Abstract: An apparatus and a method for searching for an image are provided. The apparatus includes an image receiver configured to receive an image to be searched for; an image processor configured to detect an edge of the received image and to filter pixels included on the edge of the received image based on parameters related to gradients of the edge of the received image; and an image search unit configured to search for one or more images related to the image to be searched for based on the filtered pixels included on the edge of the received image.Type: ApplicationFiled: August 6, 2015Publication date: February 11, 2016Inventors: Won-Ki KIM, Moo-Hyun KIM, Yeong-Woong PARK, Bo-Hyun SONG, Jung-Jun LEE
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Patent number: 8793335Abstract: The present application relates to a system and method for allowing musicians including composer, arranger, instrumental player and singer to provide music data by stages to complete a popular song or instrumental music. A system for providing music data according to the present invention includes a music data server for transmitting and receiving music data to and from at least four types of musician terminals including a first musician terminal or a composer terminal, a second musician terminal or an arranger terminal, a third musician terminal or an instrumental player terminal and a fourth musician terminal or a singer terminal; and a settlement server for performing settlement transactions related to the music data transmissions between the music data server and the musician terminals.Type: GrantFiled: September 30, 2011Date of Patent: July 29, 2014Inventor: Moo Hyun Kim
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Publication number: 20130086173Abstract: The present application relates to a system and method for allowing musicians including composer, arranger, instrumental player and singer to provide music data by stages to complete a popular song or instrumental music. A system for providing music data according to the present invention includes a music data server for transmitting and receiving music data to and from at least four types of musician terminals including a first musician terminal or a composer terminal, a second musician terminal or an arranger terminal, a third musician terminal or an instrumental player terminal and a fourth musician terminal or a singer terminal; and a settlement server for performing settlement transactions related to the music data transmissions between the music data server and the musician terminals.Type: ApplicationFiled: September 30, 2011Publication date: April 4, 2013Inventor: Moo Hyun KIM