Patents by Inventor Moo Hyun KIM

Moo Hyun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069535
    Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.
    Type: Application
    Filed: July 14, 2022
    Publication date: February 29, 2024
    Inventors: Shinkyu KANG, Min Yong KIM, Youngduk KIM, Nam Hyuck KIM, Su Ho JEON, Min Hee KWON, Sung Nam CHO, Hyeong Geun CHAE, Gyeong Yun JO, Moon Kyu JO, Kyungchul HWANG, Moo Hyun YOO, Han Seung KIM, Daewoon JUNG, Seungtae KIM, Junhyeok JEON
  • Publication number: 20230384004
    Abstract: In order to improve cooling efficiency, the present disclosure provides a concave-convex evaporator including a first plate bent in a concave-convex shape in which a peak part and a valley part extending in a longitudinal direction are repeatedly alternately formed in a transverse direction, a second plate bent in a concave-convex shape of which one surface is repeatedly alternately formed to face one surface of the first plate, and a spacer part provided between the first plate and the second plate to maintain a separation interval so that a refrigerant flow path is formed.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 30, 2023
    Inventor: Moo Hyun KIM
  • Patent number: 11492893
    Abstract: An apparatus for predicting a deformed shape of a structure, and method of operating and forming the same. In an embodiment, the apparatus is formed with a riser with ends coupled respectively to an upper location and a lower location. The apparatus includes sensors configured to sense an inclination of the riser at riser nodes positioned on the riser between the upper location and the lower location. The apparatus further includes a data processing system configured to produce an estimate of a deformed shape of the riser employing deformed shaped functions to represent, respectively, the estimate of the deformed shape of the riser above and below the riser nodes.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 8, 2022
    Assignee: THE TEXAS A&M UNIVERSITY SYSTEM
    Inventors: Junho Choi, Moo-Hyun Kim
  • Publication number: 20220081080
    Abstract: An apparatus, method and system for real-time monitoring of underwater risers, cables, and mooring lines based on a Kalman filter. In an embodiment, the system is formed with sensors configured to sense an inclination of a riser segment between riser nodes of the riser between the upper end and the lower end. A data processing system is configured to employ a Kalman filter algorithm to produce real-time estimates of a deformed shape and a stress of the riser segment using the sensed inclination between the riser nodes.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 17, 2022
    Applicant: The Texas A&M University System
    Inventors: Moo-Hyun Kim, Hansung Kim, Chungkuk Jin
  • Patent number: 11264249
    Abstract: Apparatus, systems, and methods for conducting a hardmask (e.g., carbon containing hardmask) removal process on a workpiece are provided. In one example implementation, a process can include admitting a process gas into a plasma chamber, generating a plasma in the plasma chamber from the process gas using an inductively coupled plasma source, and exposing the carbon containing hardmask to the plasma to remove at least a portion of the carbon containing hardmask. The process gas can include a sulfur containing gas. The process gas does not include a halogen containing gas. The inductively coupled plasma source can be separated from the plasma chamber by a grounded electrostatic shield to reduce capacitive coupling between the inductively coupled plasma source and the plasma.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 1, 2022
    Assignees: Mattson Technology, Inc., Beijing E-Town Semiconductor Technology Co., Ltd.
    Inventors: Fen Dai, Tinghao Wang, Oliver D. Jan, Moo-Hyun Kim, Shawming Ma, Zhongming Liu
  • Publication number: 20210101237
    Abstract: A tool changing system of a machining center for machining a workpiece of a vehicle includes a machining unit including a jig portion for loading the workpiece and a tool loading device for loading a tool for machining the workpiece, a first magazine for storing a plurality of first tools, a second magazine for storing a plurality of second tools, and a controller configured to manage changing of the first tool between the machining unit and the first magazine and changing of the second tool between the machining unit.
    Type: Application
    Filed: March 31, 2020
    Publication date: April 8, 2021
    Inventors: Moo Hyun Kim, Jekwang Cho, Ji Won Yu
  • Publication number: 20200258718
    Abstract: Plasma processing apparatus and associated methods are provided. In one example implementation, the plasma processing apparatus can include a gas supply in a processing chamber of a plasma processing apparatus, such as an inductively coupled plasma processing apparatus. The gas supply can include one or more injectors. Each of the one or more injectors can be angled relative to a direction parallel to a radius of the workpiece to produce a rotational gas flow relative to a direction perpendicular to a center of the workpiece. Such gas supply can improve process uniformity, workpiece edge critical dimension tuning, gas ionization efficiency, and/or symmetric flow inside the processing chamber to reduce particle deposition on a workpiece and can also reduce heat localization from a stagnate flow.
    Type: Application
    Filed: February 7, 2019
    Publication date: August 13, 2020
    Inventors: Tinghao F. Wang, Yorkman Ma, Yun Yang, Shawming Ma, Moo-Hyun Kim, Peter J. Lembesis, Ryan M. Pakulski
  • Publication number: 20200194277
    Abstract: Apparatus, systems, and methods for conducting a hardmask (e.g., carbon containing hardmask) removal process on a workpiece are provided. In one example implementation, a process can include admitting a process gas into a plasma chamber, generating a plasma in the plasma chamber from the process gas using an inductively coupled plasma source, and exposing the carbon containing hardmask to the plasma to remove at least a portion of the carbon containing hardmask. The process gas can include a sulfur containing gas. The process gas does not include a halogen containing gas. The inductively coupled plasma source can be separated from the plasma chamber by a grounded electrostatic shield to reduce capacitive coupling between the inductively coupled plasma source and the plasma.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Inventors: Fen Dai, Tinghao Wang, Oliver D. Jan, Moo-Hyun Kim, Shawming Ma, Zhongming Liu
  • Publication number: 20200123891
    Abstract: An apparatus for predicting a deformed shape of a structure, and method of operating and forming the same. In an embodiment, the apparatus is formed with a riser with ends coupled respectively to an upper location and a lower location. The apparatus includes sensorsconfigured to sense an inclination of the riser at riser nodes positioned on the riser between the upper location and the lower location. The apparatus further includes a data processing system configured to produce an estimate of a deformed shape of the riser employing deformed shaped functions to represent, respectively, the estimate of the deformed shape of the riser above and below the riser nodes.
    Type: Application
    Filed: May 25, 2018
    Publication date: April 23, 2020
    Applicant: The Texas A&M University System
    Inventors: Junho Choi, Moo-Hyun Kim
  • Patent number: 10590272
    Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: March 17, 2020
    Assignee: DOOSAN CORPORATION
    Inventors: Dong Hee Jung, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
  • Patent number: 10584239
    Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: March 10, 2020
    Assignee: DOOSAN CORPORATION
    Inventors: Dong Hee Jung, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
  • Publication number: 20190292364
    Abstract: The present invention relates to a thermosetting resin composition, and a prepreg, a laminate sheet and a printed circuit board, which use the same. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof; and (b) a polytetrafluoroethylene (PTFE) filler.
    Type: Application
    Filed: June 30, 2017
    Publication date: September 26, 2019
    Applicant: DOOSAN CORPORATION
    Inventors: Moo Hyun KIM, Jeong Don KWON, Dong Hee JUNG, Ji Hong SHIN
  • Publication number: 20190284393
    Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 19, 2019
    Applicant: DOOSAN CORPORATION
    Inventors: Dong Hee JUNG, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
  • Patent number: 10019464
    Abstract: An apparatus and a method for searching for an image are provided. The apparatus includes an image receiver configured to receive an image to be searched for; an image processor configured to detect an edge of the received image and to filter pixels included on the edge of the received image based on parameters related to gradients of the edge of the received image; and an image search unit configured to search for one or more images related to the image to be searched for based on the filtered pixels included on the edge of the received image.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Won-Ki Kim, Moo-Hyun Kim, Yeong-Woong Park, Bo-Hyun Song, Jung-Jun Lee
  • Patent number: 9957389
    Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 1, 2018
    Assignee: DOOSAN CORPORATION
    Inventors: Dong Hee Jung, Duk Sang Han, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
  • Publication number: 20170342264
    Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.
    Type: Application
    Filed: December 21, 2015
    Publication date: November 30, 2017
    Applicant: DOOSAN CORPORATION
    Inventors: Dong Hee JUNG, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
  • Publication number: 20160297967
    Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.
    Type: Application
    Filed: November 25, 2014
    Publication date: October 13, 2016
    Applicant: DOOSAN CORPORATION
    Inventors: Dong Hee JUNG, Duk Sang HAN, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
  • Publication number: 20160042527
    Abstract: An apparatus and a method for searching for an image are provided. The apparatus includes an image receiver configured to receive an image to be searched for; an image processor configured to detect an edge of the received image and to filter pixels included on the edge of the received image based on parameters related to gradients of the edge of the received image; and an image search unit configured to search for one or more images related to the image to be searched for based on the filtered pixels included on the edge of the received image.
    Type: Application
    Filed: August 6, 2015
    Publication date: February 11, 2016
    Inventors: Won-Ki KIM, Moo-Hyun KIM, Yeong-Woong PARK, Bo-Hyun SONG, Jung-Jun LEE
  • Patent number: 8793335
    Abstract: The present application relates to a system and method for allowing musicians including composer, arranger, instrumental player and singer to provide music data by stages to complete a popular song or instrumental music. A system for providing music data according to the present invention includes a music data server for transmitting and receiving music data to and from at least four types of musician terminals including a first musician terminal or a composer terminal, a second musician terminal or an arranger terminal, a third musician terminal or an instrumental player terminal and a fourth musician terminal or a singer terminal; and a settlement server for performing settlement transactions related to the music data transmissions between the music data server and the musician terminals.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: July 29, 2014
    Inventor: Moo Hyun Kim
  • Publication number: 20130086173
    Abstract: The present application relates to a system and method for allowing musicians including composer, arranger, instrumental player and singer to provide music data by stages to complete a popular song or instrumental music. A system for providing music data according to the present invention includes a music data server for transmitting and receiving music data to and from at least four types of musician terminals including a first musician terminal or a composer terminal, a second musician terminal or an arranger terminal, a third musician terminal or an instrumental player terminal and a fourth musician terminal or a singer terminal; and a settlement server for performing settlement transactions related to the music data transmissions between the music data server and the musician terminals.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Inventor: Moo Hyun KIM