Patents by Inventor Moon-chul Lee

Moon-chul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240080011
    Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 ? to 500 ?. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.
    Type: Application
    Filed: February 22, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Chul LEE, Jae Hyoung GIL, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK, Tae Kyung LEE
  • Patent number: 11894833
    Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 6, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jea Shik Shin, Duck Hwan Kim, Chul Soo Kim, Sang Uk Son, In Sang Song, Moon Chul Lee
  • Patent number: 11843365
    Abstract: A bulk-acoustic wave resonator includes a resonator including a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion disposed along a periphery of the central portion; and an insertion layer disposed between the piezoelectric layer and the substrate in the extension portion to raise the piezoelectric layer. The insertion layer includes a first insertion layer having a first inclined surface formed along a side surface facing the central portion and a second inclined surface disposed between the first insertion layer and the piezoelectric layer and having a second inclined surface spaced apart from the first inclined surface with respect to a surface direction of the first electrode. The first insertion layer is thinner than the second insertion layer.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: December 12, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Won Han, Moon Chul Lee, Sang Uk Son, Hwa Sun Lee
  • Publication number: 20230370048
    Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode, disposed on the substrate, comprising a first inclined surface and a second inclined surface; and an insertion layer disposed on an edge of the lower electrode. The first inclined surface extends from an inclined surface of the insertion layer in a region disposed inside the insertion layer. The second inclined surface extends from the first inclined surface in a region inside a region of the first inclined surface.
    Type: Application
    Filed: January 25, 2023
    Publication date: November 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Su KIM, Jae Hyoung GIL, Moon Chul LEE, Yong Suk KIM, Dong Hyun PARK, Tae Kyung LEE
  • Publication number: 20230216470
    Abstract: A bulk acoustic wave resonator includes a substrate; a central portion including a first portion of a first electrode, a first portion of a piezoelectric layer, and a first portion of a second electrode laminated in order on the substrate; and a reflective region disposed laterally of the central portion and including a second portion of the first electrode, an insertion layer, a second portion of the piezoelectric layer, and a second portion of the second electrode. A side surface of the insertion layer adjacent to the central portion has an inclined surface, the first portion of the second electrode and the second portion of the second electrode are coplanar, and an end of the second electrode overlaps the inclined surface of the insertion layer in the reflective region.
    Type: Application
    Filed: May 25, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won HAN, Hwa Sun LEE, Jeong Hoon RYOU, Moon Chul LEE, Tae Yoon KIM, Sang Kee YOON, Yong Suk KIM, Joung Hun KIM, Sung Jun LEE, Sung Joon PARK
  • Publication number: 20230208381
    Abstract: A bulk acoustic resonator includes a substrate, a frequency control layer changing a resonant frequency or antiresonant frequency of the bulk acoustic resonator according to a thickness of the frequency control layer, a piezoelectric layer disposed between the frequency control layer and the substrate, a first electrode disposed between the piezoelectric layer and the substrate, a second electrode disposed between the piezoelectric layer and the frequency control layer, a metal layer connected to the first electrode or the second electrode, and a protective layer disposed between the second electrode and the frequency control layer, wherein the frequency control layer covers a larger area than that of the protective layer.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Chul LEE, Kwang Su KIM, Jin Woo YI, Jae Hyoung GIL, Yong Suk KIM, Dong Hyun PARK
  • Publication number: 20230072487
    Abstract: A bulk acoustic wave resonator is provided. The bulk acoustic wave resonator includes a board; a resonant portion including a first electrode, a piezoelectric layer, and a second electrode, and disposed on the board, and a temperature compensation layer disposed on the resonant portion, wherein the temperature compensation layer includes a temperature compensation portion formed of a dielectric and a loss compensation portion formed of a material different from a material of the temperature compensation portion, and wherein each of the temperature compensation portion and the loss compensation portion includes a plurality of linear patterns, and the linear patterns of the temperature compensation portion and the linear patterns of the loss compensation portion are alternately disposed.
    Type: Application
    Filed: February 22, 2022
    Publication date: March 9, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won HAN, Hwa Sun LEE, Moon Chul LEE, Jeong Hoon RYOU, Tae Yoon KIM, Sang Kee YOON, Yong Suk KIM, Joung Hun KIM, Tae Kyung LEE, Jae Hyoung GIL
  • Patent number: 11595015
    Abstract: An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 ???Mg?170 ? may be satisfied, ?Mg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: February 28, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Tae Yoon Kim, Sang Kee Yoon, Chang Hyun Lim, Jong Woon Kim, Moon Chul Lee
  • Patent number: 11569793
    Abstract: An acoustic resonator includes: a resonating unit including a resonating unit including a piezoelectric layer and first and second electrodes disposed on a lower side and an upper side of the piezoelectric layer, respectively; a substrate disposed on a lower side of the resonating unit; a support unit providing a cavity between the substrate and the resonating unit; and an intermediate metal layer separated from the second electrode and disposed in the resonating unit such that at least a portion thereof is surrounded by the piezoelectric layer and the second electrode.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: January 31, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Yoon Kim, Jong Woon Kim, Dae Hun Jeong, Moon Chul Lee
  • Patent number: 11502663
    Abstract: An acoustic resonator includes: a resonating unit including a piezoelectric layer, a first electrode disposed on a lower side of the piezoelectric layer, and a second electrode disposed on an upper side of the piezoelectric layer; a substrate disposed below the resonating unit; a support unit forming a cavity between the substrate and the resonating unit; and a pillar extending through the cavity and connecting the resonating unit to the substrate. The resonating unit further includes a first insertion layer disposed above the pillar.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: November 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Yoon Kim, Jong Woon Kim, Dae Hun Jeong, Moon Chul Lee
  • Patent number: 11476833
    Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: October 18, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Yoon Kim, Tae Kyung Lee, Sang Kee Yoon, Sung Jun Lee, Chang Hyun Lim, Nam Jung Lee, Tae Hun Lee, Moon Chul Lee
  • Patent number: 11476826
    Abstract: A bulk acoustic wave resonator includes: a substrate; a membrane layer forming a cavity together with the substrate; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on a flat surface of the lower electrode; and an upper electrode covering a portion of the piezoelectric layer and exposing a side of the piezoelectric layer to air, wherein the piezoelectric layer includes a step portion extended from the side of the piezoelectric layer and disposed on the flat surface of the lower electrode.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: October 18, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Han, Dae Ho Kim, Yong Suk Kim, Seung Hun Han, Moon Chul Lee, Chang Hyun Lim, Sung Jun Lee, Sang Kee Yoon, Tae Yoon Kim, Sang Uk Son
  • Patent number: 11437975
    Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; and an insertion layer disposed below a partial region of the piezoelectric layer. A thickness of the first electrode in an active region in which the first electrode, the piezoelectric layer, and the second electrode overlap one another is less than a thickness of a region outside the active region. An angle of inclination of an internal side surface of the insertion layer is different from an angle of inclination of an external side surface of the insertion layer.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Tae Hun Lee, Yong Suk Kim, Moon Chul Lee, Sang Kee Yoon
  • Patent number: 11437977
    Abstract: A bulk-acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer at least partially covering the first electrode, and including a flat portion disposed in a central region, and an extension portion disposed outside the flat portion and having at least one step portion; an insertion layer disposed on the extension portion; and a second electrode disposed on upper portions of the insertion layer and the piezoelectric layer. The extension portion includes at least one first surface and at least one second surface disposed below an upper surface of the flat portion, and a connection surface connecting an upper surface of the flat portion to the at least one first surface or the at least one second surface, or connecting first surfaces among the at least one first surface to each other or second surfaces among the at least one second surface to each other.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Yoon Kim, Won Han, Moon Chul Lee
  • Patent number: 11424729
    Abstract: A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: August 23, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hun Lee, Tae Yoon Kim, Moon Chul Lee, Chang Hyun Lim, Nam Jung Lee, Il Han Lee
  • Publication number: 20220200565
    Abstract: A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon.
    Type: Application
    Filed: September 15, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Yeong Gyu LEE, Moon Chul LEE, Jin Suk SON, Jae Goon AUM
  • Patent number: 11323088
    Abstract: An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 ???Mg?170 ? may be satisfied, ?Mg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: May 3, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Tae Yoon Kim, Sang Kee Yoon, Chang Hyun Lim, Jong Woon Kim, Moon Chul Lee
  • Patent number: 11303262
    Abstract: A bulk-acoustic wave resonator is provided. The bulk-acoustic wave resonator comprises a substrate comprising an external connection electrode; a connection layer connected to the external connection electrode and disposed on the substrate; a first electrode disposed to cover at least a portion of the connection layer; a piezoelectric layer disposed to cover at least a portion of the first electrode; and a second electrode disposed to cover at least a portion of the piezoelectric layer. The connection layer may be disposed to surround a cavity and may be connected to the first electrode and the second electrode.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: April 12, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Je Hong Kyoung, Moon Chul Lee, Jin Suk Son, Ran Hee Shin, Hwa Sun Lee
  • Publication number: 20220085791
    Abstract: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a cavity disposed between the substrate and the first electrode; a piezoelectric layer covering at least a portion of the first electrode; a second electrode covering at least a portion of the piezoelectric layer; an insertion layer disposed between the first electrode and the piezoelectric layer; and a lower frame disposed in the cavity. At least a portion of the lower frame overlaps the insertion layer.
    Type: Application
    Filed: April 15, 2021
    Publication date: March 17, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Yoon KIM, Won HAN, Sang Hyun YI, Jae Hyoung GIL, Sang Kee YOON, Moon Chul LEE
  • Patent number: 11251767
    Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 ? or less.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Tae Yoon Kim, Dae Ho Kim, Chang Hyun Lim, Tae Hun Lee, Sang Kee Yoon, Jong Woon Kim, Won Han, Moon Chul Lee