Patents by Inventor Moo-Yong Park
Moo-Yong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10172571Abstract: An X-ray imaging apparatus of the present invention includes: a rotation unit disposed on a lower end of a rotation shaft through a sliding part so as to enable a sliding movement along an irradiation direction of X-ray; an X-ray source unit disposed on a lower end of one side of the rotation unit; a sensor unit installed by disposing a shaft rotation part on a lower end of the other side of the rotation unit; a driving unit including: a driving part which provides drive power to the shaft rotation part; and an interlocking part configured to allow the rotation unit to slidably move to one side or the other side according to the rotation state of the shaft rotation part.Type: GrantFiled: May 8, 2015Date of Patent: January 8, 2019Assignee: OSSTEMIMPLANT CO., LTD.Inventors: Moo-yong Park, Jae-hee Woo
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Publication number: 20170188981Abstract: An X-ray imaging apparatus of the present invention includes: a rotation unit disposed on a lower end of a rotation shaft through a sliding part so as to enable a sliding movement along an irradiation direction of X-ray; an X-ray source unit disposed on a lower end of one side of the rotation unit; a sensor unit installed by disposing a shaft rotation part on a lower end of the other side of the rotation unit; a driving unit including: a driving part which provides drive power to the shaft rotation part; and an interlocking part configured to allow the rotation unit to slidably move to one side or the other side according to the rotation state of the shaft rotation part.Type: ApplicationFiled: May 8, 2015Publication date: July 6, 2017Applicant: OSSTEMIMPLANT CO., LTD.Inventors: Moo-yong PARK, Jae-hee WOO
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Patent number: 9308059Abstract: An implant bite registration jig includes a coupling portion configured to produce a clear impression in bite impression material; a connecting portion that connects the implant jig with a fixture embedded in a patient's gums; and a body that is formed between the coupling portion and the connecting portion. The implant bite registration jig is positioned in an embedded fixture and a bite impression is taken. Reference marks are formed in the bite impression material by the registration jig, which permit accurate location of the fixture. This makes it possible to simultaneously take a dental impression and a bite impression in an implant operation, similar to a natural teeth operation, such that it is possible to reduce the cost and time for manufacturing a prosthesis.Type: GrantFiled: February 9, 2011Date of Patent: April 12, 2016Assignees: Osstem Implant Co., Ltd.Inventors: Jae Ho Ryu, Tae Hyun Gong, Moo Yong Park, Kwang Hoon Lee
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Publication number: 20120202169Abstract: An implant bite registration jig includes a coupling portion configured to produce a clear impression in bite impression material; a connecting portion that connects the implant jig with a fixture embedded in a patient's gums; and a body that is formed between the coupling portion and the connecting portion. The implant bite registration jig is positioned in an embedded fixture and a bite impression is taken. Reference marks are formed in the bite impression material by the registration jig, which permit accurate location of the fixture. This makes it possible to simultaneously take a dental impression and a bite impression in an implant operation, similar to a natural teeth operation, such that it is possible to reduce the cost and time for manufacturing a prosthesis.Type: ApplicationFiled: February 9, 2011Publication date: August 9, 2012Applicants: OSSTEM IMPLANT CO., LTDInventors: Jae Ho Ryu, Tae Hyun Gong, Moo Yong Park, Kwang Hoon Lee
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Patent number: 8062102Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.Type: GrantFiled: August 20, 2004Date of Patent: November 22, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-Yong Park, Jong-Won Lee, Sang-Rok Ha, Hong-Seong Son
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Patent number: 7559824Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.Type: GrantFiled: July 28, 2006Date of Patent: July 14, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-yong Park, Tai-hyoung Kim, Choon-goang Kim, Dong-Il Kim
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Patent number: 7488235Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.Type: GrantFiled: May 3, 2006Date of Patent: February 10, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
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Patent number: 7364497Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.Type: GrantFiled: June 30, 2005Date of Patent: April 29, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-yong Park, Tae-hoon Lee, Jae-eung Koo
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Publication number: 20080090503Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.Type: ApplicationFiled: November 16, 2007Publication date: April 17, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Moo-yong PARK, Tae-hoon LEE, Jae-eung KOO
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Publication number: 20070077871Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.Type: ApplicationFiled: July 28, 2006Publication date: April 5, 2007Inventors: Moo-Yong Park, Tai-hyoung Kim, Choon-goang Kim, Dong-Il Kim
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Patent number: 7166019Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.Type: GrantFiled: January 27, 2005Date of Patent: January 23, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-Yong Park, Ja-Eung Koo, Sang-Cheol Han, Duk-Ho Hong
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Publication number: 20060189259Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.Type: ApplicationFiled: May 3, 2006Publication date: August 24, 2006Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
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Patent number: 7066785Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.Type: GrantFiled: November 17, 2003Date of Patent: June 27, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
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Publication number: 20060003677Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.Type: ApplicationFiled: June 30, 2005Publication date: January 5, 2006Inventors: Moo-yong Park, Tae-hoon Lee, Jae-eung Koo
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Publication number: 20050176354Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.Type: ApplicationFiled: January 27, 2005Publication date: August 11, 2005Inventors: Moo-Yong Park, Ja-Eung Koo, Sang-Cheol Han, Duk-Ho Hong
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Publication number: 20050086869Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.Type: ApplicationFiled: August 20, 2004Publication date: April 28, 2005Inventors: Moo-Yong Park, Jong-Won Lee, Sang-Rok Ha, Hong-Seong Son
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Publication number: 20040137829Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.Type: ApplicationFiled: November 17, 2003Publication date: July 15, 2004Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han