Abstract: A computer-implemented method, system and computer program product for recommending design changes in designing a digital integrated circuit. An analysis of the digital integrated circuit being designed is performed, where the result of such an analysis involves violations being identified and stored. A stored violation, such as a cross-domain, cross-hierarchy and multi-cycle violation, may then be analyzed to identify a root cause of the violation using a rule. Such a rule may be used for triaging various failures in the cross-domain, cross-hierarchy and/or multi-cycle violation of the digital integrated circuit. A design change in the design of the digital integrated circuit may then be recommended based on the identified root cause of the violation. In this manner, the root cause of failures are effectively identified in the design of digital integrated circuits using an offline analysis of cross-domain, cross-hierarchy and/or multi-cycle violations using a rules-based approach.

Abstract: Multi-layer polymeric films and methods of forming the same are provided. The film includes a combination of layers forming the core of the film, and a polymeric skin layer forming each of the outer surfaces of the multi-layer film. The combination of layers forming the core of the film includes: a polypropylene-rich “A” layer, in which polypropylene is the major component of the “A” layer; and a polyethylene-rich “B” layer, in which polyethylene is the major component of the “B” layer. In some cases, the “B” layer may have high density polyethylene as its major component. In the core, there is at least one “A” layer and at least one “B” layer, and the “B” layer is joined at least indirectly to the “A” layer. The “A” layer(s) and the “B” layer(s) combine to make up 20% to 60% of the thickness of the multi-layer polymeric film.

Abstract: Multi-layer polymeric films and methods of forming the same are provided. The film includes a combination of layers forming the core of the film, and a polymeric skin layer forming each of the outer surfaces of the multi-layer film. The combination of layers forming the core of the film includes: a polypropylene-rich “A” layer, in which polypropylene is the major component of the “A” layer; a polyethylene-rich “B” layer, in which polyethylene (for example HDPE) is the major component of the “B” layer, and a “C” layer that serves as an energy dissipating layer. The “A” layer(s) and the “B” layer(s) combine to make up 20% to 60% of the thickness of the multi-layer polymeric film.