Abstract: An electric circuit device includes: a first electric component; a first case that accommodates the first electric component and has a cooling channel for cooling the first electric component and a discharge port of the cooling channel; a second case that accommodates a second electric component and has a communication channel that communicates with a discharge port of the cooling channel; a first seal portion that is provided in a peripheral edge part of a discharge port of the cooling channel and seals the first case and the first electric component; a second seal portion that is provided outside the first seal portion with respect to a discharge port of the cooling channel and seals the first case and the first electric component; a through hole that is provided in the first case between the first seal portion and the second seal portion of and penetrates the first case from the first electric component side to the second case side; and a wall that is provided on one of the first case and the second case t

Abstract: Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.

Abstract: Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.

Abstract: An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

Abstract: It is an object of the present invention to enhance connection reliability of terminals while enhancing assembling performance.

Abstract: To suppress reduction in resistance against vibrations, while reducing the number of components, a power conversion device including a power semiconductor module that converts a DC current into an AC current, a plate conductor that transfers the DC current or the AC current, a resin sealing material that seals the plate conductor, and an electric component that is used to control the power semiconductor module has the resin sealing material include a supporting member. The supporting member supports the electric component, and the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.

Abstract: An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

Abstract: An object of the invention is to suppress that resistance against vibrations is reduced, while reducing the number of components. A power conversion device according to the present invention includes: a power semiconductor module that converts a DC current into an AC current; a plate conductor that transfers the DC current or the AC current; a resin sealing material that seals the plate conductor; and an electric component that is used to control the power semiconductor module, wherein the resin sealing material includes a supporting member that supports the electric component, and wherein the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.

Abstract: It is an object of the present invention to enhance connection reliability of terminals while enhancing assembling performance.

Abstract: A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.

Abstract: A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a); and a cover (5) for fixing the power semiconductor module (150a) to the flow channel forming body (20), and the power semiconductor module (150a) includes a power semiconductor element, main terminals (157b, 158b) electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover (5) has a recessed portion (5c) and an opening (5a) provided in a bottom surface portion of the recessed portion (5c), the power semiconductor module (150a) is placed to be fitted into the recessed portion (5c), the power semiconductor module (150a) is fixed to the cover (5) so that the main terminals (157b, 158b) pass through the opening (5a), the case and an inner wall of the recessed portion (5c) have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a dou

Abstract: Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.

Abstract: A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.

Abstract: A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a); and a cover (5) for fixing the power semiconductor module (150a) to the flow channel forming body (20), and the power semiconductor module (150a) includes a power semiconductor element, main terminals (157b, 158b) electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover (5) has a recessed portion (5c) and an opening (5a) provided in a bottom surface portion of the recessed portion (5c), the power semiconductor module (150a) is placed to be fitted into the recessed portion (5c), the power semiconductor module (150a) is fixed to the cover (5) so that the main terminals (157b, 158b) pass through the opening (5a), the case and an inner wall of the recessed portion (5c) have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a dou

Abstract: A power conversion apparatus includes power semiconductor modules (300U, 300V, 300W), a first flow path forming body (110) that forms a first flow path, a second flow path forming body (401) that forms a second flow bath, a first base plate (400) for mounting the second flow path forming body thereon, a drive circuit board (200), and a case (101). The drive circuit board (200) is provided so that a mounting surface of the drive circuit faces a side wall of the second flow bath forming body (401). The second flow path forming body (401) forms a housing space for housing the power semiconductor modules (300U, 300V, 300W). Further, the second flow path forming body (401) forms an insertion opening that leads to the housing space, on a side wall facing the mounting surface of the drive circuit. The power semiconductor modules (300U, 300V, 300W) have a control terminal that is connected to the &rive circuit board (200) by passing through the insertion opening.

Abstract: In a situation where a conventional inductive throttle sensor is used with a motor-driven throttle valve device to detect the rotation angle of a throttle shaft, plural sensor connection conductor sections for connecting a connector terminal to a circuit board terminal section are formed on the cover on one lateral surface side of a circuit board in the long-axis direction. This increases the dimension of the cover in the short-axis direction (the dimension in the direction of air flow in an intake path). Consequently, it is difficult to install the motor-driven throttle valve device and inductive throttle sensor in a narrow engine room. This problem is addressed by using a separate member to achieve electrical conduction between a stator circuit board and a conductor routed inside the cover installed over the stator circuit board in a concentrated manner on one side of the circuit board.

Abstract: Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.

Abstract: In a situation where a conventional inductive throttle sensor is used with a motor-driven throttle valve device to detect the rotation angle of a throttle shaft, plural sensor connection conductor sections for connecting a connector terminal to a circuit board terminal section are formed on the cover on one lateral surface side of a circuit board in the long-axis direction. This increases the dimension of the cover in the short-axis direction (the dimension in the direction of air flow in an intake path). Consequently, it is difficult to install the motor-driven throttle valve device and inductive throttle sensor in a narrow engine room. This problem is addressed by using a separate member to achieve electrical conduction between a stator circuit board and a conductor routed inside the cover installed over the stator circuit board in a concentrated manner on one side of the circuit board.

Abstract: In a situation where a conventional inductive throttle sensor is used with a motor-driven throttle valve device to detect the rotation angle of a throttle shaft, plural sensor connection conductor sections for connecting a connector terminal to a circuit board terminal section are formed on the cover on one lateral surface side of a circuit board in the long-axis direction. This increases the dimension of the cover in the short-axis direction (the dimension in the direction of air flow in an intake path). Consequently, it is difficult to install the motor-driven throttle valve device and inductive throttle sensor in a narrow engine room. This problem is addressed by using a separate member to achieve electrical conduction between a stator circuit board and a conductor routed inside the cover installed over the stator circuit board in a concentrated manner on one side of the circuit board.

Abstract: In a situation where a conventional inductive throttle sensor is used with a motor-driven throttle valve device to detect the rotation angle of a throttle shaft, plural sensor connection conductor sections for connecting a connector terminal to a circuit board terminal section are formed on the cover on one lateral surface side of a circuit board in the long-axis direction. This increases the dimension of the cover in the short-axis direction (the dimension in the direction of air flow in an intake path). Consequently, it is difficult to install the motor-driven throttle valve device and inductive throttle sensor in a narrow engine room. This problem is addressed by using a separate member to achieve electrical conduction between a stator circuit board and a conductor routed inside the cover installed over the stator circuit board in a concentrated manner on one side of the circuit board.