Patents by Inventor Morio Ohashi

Morio Ohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7523702
    Abstract: In a thermal head control system for controlling heating energy to a thermal had perforating stencil material unrolled from a stencil material roll, the heating energy to a thermal head is controlled according to the surface condition of the stencil material. The residue of stencil material M in a stencil material roll is calculated by residue calculating means and the elapsed time of the stencil material roll from production thereof is obtained on the basis of date data on the date of production of the stencil roll. Further, kind data on the kind of stencil material stored in the storage portion is obtained and the heating energy is obtained on the basis of the residue, the elapsed time and the kind data. On the basis of this heating energy, the heating action of the thermal head is controlled.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: April 28, 2009
    Assignee: Riso Kagaku Corporation
    Inventors: Kenji Oshima, Takashi Isozaki, Morio Ohashi
  • Publication number: 20080278563
    Abstract: In a thermal head control system for controlling heating energy to a thermal head perforating stencil material unrolled from a stencil material roll, the heating energy to a thermal head is controlled according to the surface condition of the stencil material. The residue of stencil material M in a stencil material roll (21b) is calculated by a residue calculating means (65) and the elapsed time of the stencil material roll from production thereof is obtained on the basis of date data on the date of production of the stencil material roll stored in a storage portion (70) of the stencil material roll (21b). Further, kind data on the kind of the stencil material stored in the storage portion (70) is obtained and the heating energy is obtained on the basis of the residue, the elapsed time and the kind data. On the basis of this heating energy, the heating action of the thermal head (22) is controlled.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 13, 2008
    Inventors: Kenji Oshima, Takashi Isozaki, Morio Ohashi
  • Publication number: 20080278562
    Abstract: In a thermal head control system for controlling heating energy to a thermal head perforating stencil material unrolled from a stencil material roll, the heating energy to a thermal head is controlled according to the surface condition of the stencil material. The residue of stencil material M in a stencil material roll (21b) is calculated by a residue calculating means (65) and the elapsed time of the stencil material roll from production thereof is obtained on the basis of date data on the date of production of the stencil material roll stored in a storage portion (70) of the stencil material roll (21b). Further, kind data on the kind of the stencil material stored in the storage portion (70) is obtained and the heating energy is obtained on the basis of the residue, the elapsed time and the kind data. On the basis of this heating energy, the heating action of the thermal head (22) is controlled.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 13, 2008
    Inventors: Kenji Oshima, Takashi Isozaki, Morio Ohashi
  • Patent number: 7171895
    Abstract: A stencil material roll includes stencil material in a continuous length rolled around a core tube and a memory IC which stores predetermined information. The memory IC is mounted on a wall portion which forms a part of the core tube or on a wall portion fixed to the core tube, and an easy-to-cut portion is provided on the wall portion to surround the portion where the memory IC is mounted.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: February 6, 2007
    Assignee: Riso Kagaku Corporation
    Inventors: Kenji Oshima, Morio Ohashi, Hitoshi Watanabe
  • Patent number: 7078460
    Abstract: A room temperature curable organopolysiloxane composition is provided which includes an organopolysiloxane, a curing agent, and a specific organic compound incorporating at least one sulfur atom within each molecule. By producing a molding matrix with this type of composition, unsatisfactory curing of an unsaturated polyester resin is unlikely to occur at the contact surface with the silicone rubber of the matrix, and furthermore the mold releasability of the matrix relative to unsaturated polyester resins is excellent. As a result, the matrix can be used repeatedly for a significant number of molding operations.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: July 18, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masayuki Ikeno, Morio Ohashi
  • Publication number: 20060107851
    Abstract: In a thermal head control system for controlling heating energy to a thermal head perforating stencil material unrolled from a stencil material roll, the heating energy to a thermal head is controlled according to the surface condition of the stencil material. The residue of stencil material M in a stencil material roll (21b) is calculated by a residue calculating means (65) and the elapsed time of the stencil material roll from production thereof is obtained on the basis of date data on the date of production of the stencil material roll stored in a storage portion (70) of the stencil material roll (21b). Further, kind data on the kind of the stencil material stored in the storage portion (70) is obtained and the heating energy is obtained on the basis of the residue, the elapsed time and the kind data. On the basis of this heating energy, the heating action of the thermal head (22) is controlled.
    Type: Application
    Filed: December 4, 2003
    Publication date: May 25, 2006
    Inventors: Kenji Oshima, Takashi Isozaki, Morio Ohashi
  • Publication number: 20040166271
    Abstract: A stencil material roll includes stencil material in a continuous length rolled around a core tube and a memory IC which stores predetermined information. The memory IC is mounted on a wall portion which forms a part of the core tube or on a wall portion fixed to the core tube, and an easy-to-cut portion is provided on the wall portion to surround the portion where the memory IC is mounted.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Applicant: RISO KAGAKU CORPORATION
    Inventors: Kenji Oshima, Morio Ohashi, Hitoshi Watanabe
  • Publication number: 20040010109
    Abstract: A room temperature curable organopolysiloxane composition is provided which includes an organopolysiloxane, a curing agent, and a specific organic compound incorporating at least one sulfur atom within each molecule. By producing a molding matrix with this type of composition, unsatisfactory curing of an unsaturated polyester resin is unlikely to occur at the contact surface with the silicone rubber of the matrix, and furthermore the mold releasability of the matrix relative to unsaturated polyester resins is excellent. As a result, the matrix can be used repeatedly for a significant number of molding operations.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 15, 2004
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masayuki Ikeno, Morio Ohashi
  • Publication number: 20020132912
    Abstract: A room temperature curable organopolysiloxane composition is provided which includes an organopolysiloxane, a curing agent, and a specific organic compound incorporating at least one sulfur atom within each molecule. By producing a molding matrix with this type of composition, unsatisfactory curing of an unsaturated polyester resin is unlikely to occur at the contact surface with the silicone rubber of the matrix, and furthermore the mold releasability of the matrix relative to unsaturated polyester resins is excellent. As a result, the matrix can be used repeatedly for a significant number of molding operations.
    Type: Application
    Filed: January 15, 2002
    Publication date: September 19, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masayuki Ikeno, Morio Ohashi
  • Patent number: 5905101
    Abstract: The invention relates to an ablator composition for providing ablation protection after cure thereof. The. ablator composition includes the components of: (A) 100 parts by weight of a silicone elastomer composition which is curable to a silicone elastomer by addition reaction; (B) 50-200 parts by weight of an amorphous silica having an average diameter from 0.1 to 100 .mu.m; and (C) 1-15 parts by weight of a first fiber having an average length from 0.5 to 6 mm in a longitudinal direction thereof and an average diameter from 1 to 20 .mu.m. The first fiber is at least one of a carbon fiber and a synthetic quartz fiber. An ablating material prepared by curing the ablator composition is superior in heat insulation and substantially low in ablation rate, and thus protects a spacecraft or the like from a high temperature gas, for a long time.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: May 18, 1999
    Assignees: Nissan Motor Co., Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Morio Ohashi, Hisao Okamoto
  • Patent number: 5504147
    Abstract: A process for preparing a liquid silicone composition of the type which comprises (A) a diorganopolysiloxane having a viscosity of 1000 to 100,000 centipoises and having at least two reactive groups, (B) a filler mainly composed of SiO.sub.2 having a specific surface area of not smaller than 50 m.sup.2 /g, (C) a diorganopolysiloxane having a viscosity of from 10 to 1000 centipoises and substantially free of any terminal silanol group, (D) hexamethyldisilazane and/or (E) water is described. In the process, 10 to 100 wt % of the (A) and (C) components and 100% of the (B), (D) and, if present, (E) components are mixed under heating conditions of 100.degree. to 250.degree. C. for a time sufficient to obtain a uniform dispersion. If present, the balances of the (A) and (C) components are subsequently mixed with the dispersion.
    Type: Grant
    Filed: February 28, 1995
    Date of Patent: April 2, 1996
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Morio Ohashi
  • Patent number: D533899
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: December 19, 2006
    Assignee: Riso Kagaku Corporation
    Inventors: Morio Ohashi, Kinya Ono