Patents by Inventor Moritz Engl

Moritz Engl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080061717
    Abstract: An LED array comprising at least two LED chips (2) contains a temperature sensor (3), and means are provided for regulating the operating current of the LED chips (2) as a function of the temperature detected by the temperature sensor (3). This makes it possible for the LED chips (2) to be operated for long periods at high operating current, thereby reducing the risk of thermal overload.
    Type: Application
    Filed: September 9, 2005
    Publication date: March 13, 2008
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Georg Bogner, Moritz Engl, Markus Hofmann, Joachim Reill, Thomas Reiners
  • Publication number: 20070086148
    Abstract: A housing for an electromagnetic radiation emitting optoelectronic component is specified. The housing comprises a housing base body provided with a recess in which at least one chip mounting surface is disposed. At least one outer surface of the housing base body, disposed on an emission side of the housing and adjoining the recess, is provided with a baffle layer suitable for screening an electromagnetic radiation. An electromagnetic radiation emitting component provided with such a housing and a method of making a corresponding housing or component are also specified.
    Type: Application
    Filed: September 25, 2006
    Publication date: April 19, 2007
    Inventors: Lukas Schwenkschuster, Martin Wuller, Joachim Reill, Moritz Engl
  • Publication number: 20060076572
    Abstract: A light-emitting diode arrangement having at least one light-emitting diode chip (1), each light-emitting diode chip (1) being assigned at least one optical element (4). In addition, the light-emitting diode arrangement has at least one heat-conducting element (13) which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.
    Type: Application
    Filed: September 29, 2005
    Publication date: April 13, 2006
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Rainer Huber, Joachim Reill, Kurt-Jurgen Lang, Moritz Engl, Markus Hofmann, Mario Wanninger, Michael Sailer, Stefan Grotsch
  • Publication number: 20060014429
    Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).
    Type: Application
    Filed: June 29, 2005
    Publication date: January 19, 2006
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Josef Schmid, Stefan Grotsch, Michael Hiegler, Moritz Engl, Georg Bogner, Karlheinz Arndt, Markus Schneider