Abstract: A method, a system, and a computer program product for reducing heat generated during projection of visual content. The method includes determining a temperature of at least one light emitter that projects a visual content based on calibration data. The method further includes determining, by a processor, whether the temperature exceeds a temperature threshold. The method further includes calculating, by the processor, at least one adjustment that reduces a level of heat generated by the at least one light emitter during projection of the visual content. The at least one adjustment overrides at least one portion of the calibration data. The method further includes applying the at least one adjustment to the at least one light emitter and modulating the at least one light emitter to project the visual content in accordance with the at least one adjustment applied to the calibration data.

Abstract: A method and apparatus adjust portable electronic device operation based on ambient temperature. A user input of a desired performance mode of a portable electronic device can be received. An ambient temperature in an environment surrounding the portable electronic device can be determined. A device temperature mitigation threshold value can be set based on the ambient temperature and based on the desired performance mode. Portable electronic device operation can be adjusted based on the portable electronic device temperature exceeding the device temperature mitigation threshold value.

Abstract: An electronic device has a housing, at least one actuator attached to the housing, and a deformable skin having air pores. The actuators are attached to both the housing and the deformable skin to impart a motion that causes a varying amount of separation. A thermal exchange cavity is defined by the housing and the deformable skin. A skin oscillation controller is contained with the housing and is electrically connected to the at least one actuators that vary a volume of the thermal exchange cavity by deforming the deformable skin, causing an exchange of ambient air through the air pores to convectively cool the housing.

Abstract: An electronic system performs thermal management during its operation by proactively taking into account expected solar thermal loading. According to one embodiment, the electronic system determines its location and a solar thermal load value expected to affect its location. The system also determines a temperature offset value based on the solar thermal load value and predicts a future temperature for the system based on the temperature offset value and a then-current temperature for the system (e.g., as may be detected by one or more temperature sensors). The electronic system compares the predicted temperature to at least one threshold and executes a thermal mitigation procedure in the event that the predicted temperature exceeds one or more of the thresholds. According to another embodiment in which the electronic system is transportable, the determined solar thermal load value may include a solar thermal load profile for the system's expected route of travel.

Abstract: An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

Abstract: An improved electronic communications system 100 features a holder assembly 104 such as a mobile computing device dock station 106 and dock heat exchanger providing an external heat sink 162 which when coupled with a user-friendly heat transfer device 164 such as a heat pipe can transfer heat from internal electronic components 146, 148 and 154 and an internal heat sink 157 of an electronic communications device 102, such as a cellular phone or mobile computing device, via a special headset jack-heat pipe interface 167 to help cool the electronic communications device 102. The electronic communications device 102 can also include one or more thermal couplings 158-160 for coupling and providing a thermal pathway(s) from at least one of the internal electronic components 146, 148 and 154 to the internal heat sink 157.

Abstract: An electronic device has a housing, at least one actuator attached to the housing, and a deformable skin having air pores. The actuators are attached to both the housing and the deformable skin to impart a motion that causes a varying amount of separation. A thermal exchange cavity is defined by the housing and the deformable skin. A skin oscillation controller is contained with the housing and is electrically connected to the at least one actuators that vary a volume of the thermal exchange cavity by deforming the deformable skin, causing an exchange of ambient air through the air pores to convectively cool the housing.

Abstract: A method and apparatus adjust portable electronic device operation based on ambient temperature. A user input of a desired performance mode of a portable electronic device can be received. An ambient temperature in an environment surrounding the portable electronic device can be determined. A device temperature mitigation threshold value can be set based on the ambient temperature and based on the desired performance mode. Portable electronic device operation can be adjusted based on the portable electronic device temperature exceeding the device temperature mitigation threshold value.

Abstract: An electronic system performs thermal management during its operation by proactively taking into account expected solar thermal loading. According to one embodiment, the electronic system determines its location and a solar thermal load value expected to affect its location. The system also determines a temperature offset value based on the solar thermal load value and predicts a future temperature for the system based on the temperature offset value and a then-current temperature for the system (e.g., as may be detected by one or more temperature sensors). The electronic system compares the predicted temperature to at least one threshold and executes a thermal mitigation procedure in the event that the predicted temperature exceeds one or more of the thresholds. According to another embodiment in which the electronic system is transportable, the determined solar thermal load value may include a solar thermal load profile for the system's expected route of travel.

Abstract: An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

Abstract: An improved electronic communications system 100 features a holder assembly 104 such as a mobile computing device dock station 106 and dock heat exchanger providing an external heat sink 162 which when coupled with a user-friendly heat transfer device 164 such as a heat pipe can transfer heat from internal electronic components 146, 148 and 154 and an internal heat sink 157 of an electronic communications device 102, such as a cellular phone or mobile computing device, via a special headset jack-heat pipe interface 167 to help cool the electronic communications device 102. The electronic communications device 102 can also include one or more thermal couplings 158-160 for coupling and providing a thermal pathway(s) from at least one of the internal electronic components 146, 148 and 154 to the internal heat sink 157.

Abstract: A peripheral electronic device (106) can be equipped with a coupler, which in one embodiment is a thermal transference coupler (136). The thermal transference coupler (136) can include a thermally conductive surface (402) configured to draw heat from a major face (301) of another electronic device disposed within the coupler that abuts the thermally conductive surface (402).

Abstract: An electrical connector (130) is configured to draw heat out of a portable electronic device (100). The electrical connector (130) can include an electrical connection portion and a housing (131). A thermal conduit (132) is coupled to the housing (131) at a connection (536). The connection (536) is configured to transfer heat between the thermal conduit (132) and the housing (131). The electrical connector (130) can be coupled to a second electrical connector (660), which can be coupled to a heat sink (1015) to draw heat from the portable electronic device (100) through the connectors to the heat sink (1015), thus obviating the need to incorporate fans or other cooling devices in the portable electronic device (100).

Abstract: The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure relief mechanism (200), and a shearing surface (201). The housing (105) includes a cooling material (121) disposed therein. The pressure relief mechanism (200) is disposed within the housing (105) and covers the opening (203) to provide a seal that seals the housing (105). The shearing surface (201) is effective to break the seal upon exceeding a predetermined pressure within the housing (105).

Abstract: The present invention provides a two-phase thermosyphon (100) that includes a sealed housing (105). The housing (105) includes a first outer surface, a second outer surface opposite the first outer surface, a first inner surface, and a second inner surface. The housing (105) is preferably formed of a first housing piece and a second housing piece that are attached in such a way as to form a sealed housing. A porous structural material (101) is disposed within the housing (105). A plurality of slots (103) are disposed within the porous structural material (101). The slots (103) preferably run substantially perpendicular to the general direction of vapor flow through the porous structural material (101) and provide increased heat dissipation in the two-phase thermosyphon (100).