Abstract: An optoelectronic apparatus includes an array of emitters configured to emit beams of optical radiation. An optical substrate is mounted over the array. An optical metasurface is disposed on the optical substrate and configured to collimate and split each of the emitted beams into a respective group of collimated sub-beams, and to direct the collimated sub-beams toward a target to form a pattern of spots on the target.

Abstract: An optical device includes a substrate that includes a parallelepiped of a transparent dielectric material. The substrate is configured for propagation of a beam of optical radiation through the substrate along a beam path that includes multiple internal reflections within the substrate. The device further includes first and second optical metasurfaces disposed on one or more faces of the substrate at different, first and second points of incidence of the beam path with the one or more faces.

Abstract: A method for optical sensing includes providing a mirror comprising a central reflective region surrounded by a peripheral glare-suppressing region. A beam of light from a laser light source is directed to reflect from the central region so as to pass through an output optic along an axis toward a target scene. The light returned from the target scene through the output optic is focused onto an optical sensor, via collection optics having a collection aperture surrounding the mirror.

Abstract: A method for optical sensing includes providing a mirror comprising a central reflective region surrounded by a peripheral glare-suppressing region. A beam of light from a laser light source is directed to reflect from the central region so as to pass through an output optic along an axis toward a target scene. The light returned from the target scene through the output optic is focused onto an optical sensor, via collection optics having a collection aperture surrounding the mirror.

Abstract: A method for optical sensing includes providing a mirror comprising a central reflective region surrounded by a peripheral glare-suppressing region. A beam of light from a laser light source is directed to reflect from the central region so as to pass through an output optic along an axis toward a target scene. The light returned from the target scene through the output optic is focused onto an optical sensor, via collection optics having a collection aperture surrounding the mirror.

Abstract: An optoelectronic device includes a driver die including drive circuits and first bond pads on a front surface of the driver die. An emitter die is mounted on the front surface of the driver die and includes one or more vertical emitters and second bond pads connected to the vertical emitters. An encapsulation layer contains the emitter die and has an inner surface adjacent to the front surface of the driver die. Conductive vias extend through the encapsulation layer and have inner ends connected to the first bond pads and outer ends at an outer surface of the encapsulation layer. A redistribution layer is disposed over the outer surface of the encapsulation layer and includes conductive traces, each of which is connected to at least one terminal selected from a group of terminals consisting of the second bond pads and the outer ends of the conductive vias.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: A method for producing an optical apparatus includes providing a pair of glass wafers. One or more diffractive optical elements (DOEs) are formed on one or more of the glass wafers. A spacer is positioned between the glass wafers so as to define a cavity containing the DOEs, and a hermetic seal that bonds the glass wafers together and seals the cavity is formed.

Abstract: An optical module includes a diffractive optical element (DOE) with a transparent conductive trace disposed over a surface of the DOE. An emitter is configured to direct a beam of optical radiation through the DOE. Control circuitry is coupled to measure a resistance of the transparent conductive trace and to control operation of the emitter responsively to the resistance.

Abstract: An optical device includes a first plate having a first transparent region defining an exit face of the device, and a second plate having a second transparent region defining an entrance face of the device. At least one lens is formed over at least one of the first and second transparent regions. First and second planar reflectors are spaced apart and fixed between the first and second plates in mutually-parallel orientations diagonal to the first and second plates, thereby defining an optical path through the device from the entrance face, reflecting from the first and second reflectors, through the exit face and passing through the at least one refractive surface.

Abstract: A method for optical sensing includes providing a mirror comprising a central reflective region surrounded by a peripheral glare-suppressing region. A beam of light from a laser light source is directed to reflect from the central region so as to pass through an output optic along an axis toward a target scene. The light returned from the target scene through the output optic is focused onto an optical sensor, via collection optics having a collection aperture surrounding the mirror.

Abstract: An optical device includes a first plate having a first transparent region defining an exit face of the device, and a second plate having a second transparent region defining an entrance face of the device. At least one lens is formed over at least one of the first and second transparent regions. First and second planar reflectors are spaced apart and fixed between the first and second plates in mutually-parallel orientations diagonal to the first and second plates, thereby defining an optical path through the device from the entrance face, reflecting from the first and second reflectors, through the exit face and passing through the at least one refractive surface.

Abstract: A method for producing an optical apparatus includes providing a pair of glass wafers. One or more diffractive optical elements (DOEs) are formed on one or more of the glass wafers. A spacer is positioned between the glass wafers so as to define a cavity containing the DOEs, and a hermetic seal that bonds the glass wafers together and seals the cavity is formed.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract: A method for producing an optical apparatus includes providing a pair of glass wafers. One or more diffractive optical elements (DOEs) are formed on one or more of the glass wafers. A spacer is positioned between the glass wafers so as to define a cavity containing the DOEs, and a hermetic seal that bonds the glass wafers together and seals the cavity is formed.

Abstract: An optical device includes a first plate having a first transparent region defining an exit face of the device, and a second plate having a second transparent region defining an entrance face of the device. At least one lens is formed over at least one of the first and second transparent regions. First and second planar reflectors are spaced apart and fixed between the first and second plates in mutually-parallel orientations diagonal to the first and second plates, thereby defining an optical path through the device from the entrance face, reflecting from the first and second reflectors, through the exit face and passing through the at least one refractive surface.

Abstract: The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.

Abstract: A MEMS auto focus miniature camera module includes an image sensor and an optical train including at least one movable lens and one or more fixed lenses or fixed lens groups on either side of the movable lens. The movable lens provides an auto focus feature of the camera module. A MEMS actuator translates the movable lens through an auto focus range to adjust focus.