Abstract: A cooling system 100 for directly cooling an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, a leakage receiving portion 21 disposed between the cooling tank 11 and a floor surface so as to receive the coolant L leaked from the cooling tank 11, an additional leakage receiving portion 22 disposed to receive the coolant L overflown from the leakage receiving portion 21 which stores the leaked coolant by a volume in excess of a predetermined volume, and a passage 25 that connects the leakage receiving portions 21 and 23 for passing the overflown coolant L by the volume in excess of the predetermined volume. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.

Abstract: Provided efficiently and at low cost are: a package for core number ratios appropriate for all types of computers; and dies included in the package. This package includes at least one die provided with: at least one of a first core formed of a CPU core or a latency core and a second core formed of an accelerator core or a throughput core; an external interface; memory interfaces 24 to 26; and a die interface 23 which is connected to another die. The die includes a first type die and a second type die each including both the first core and the second core and the core number ratio between the first core and the second core in the first type die differs from that in the second type die. Moreover, the memory interfaces include an interface conforming to TCI. In addition, the memory interfaces further include an interface conforming to HBM.

Abstract: A cooling system 400 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 50 containing the coolant C, and a leakage receiving portion 21 disposed between the cooling tank 50 and a floor surface 32 so as to receive the coolant L leaked from the cooling tank 50. The cooling tank 50 includes a lower structure 53 fixed to the floor surface 32, an upper structure 51 having the electronic device immersed in the coolant C, and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. It is possible to provide the cooling system which is highly durable against externally exerted strong impact and vibration caused by such disaster as earthquake.

Abstract: A cooling system 300 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, and a leakage receiving portion 41 disposed between the cooling tank 11 and a floor surface so as to receive the coolant C leaked from the cooling tank 11. The leakage receiving portion 41 includes a distribution plate 40 for distributing a load applied from the cooling tank 11, a closed side wall disposed on the distribution plate to enclose the cooling tank 11, and a lid member 42 for covering an upper opening between the closed side wall and the cooling tank 11. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.

Abstract: To enable to provide efficiently and at low cost: a package for core number ratios appropriate for all types of computers; and dies included in the package. A set of the dies and the package are provided with a plurality of dies each including at least an accelerator core 21 or a CPU core 22, an external interface, memory interfaces 24 to 26, and a die interface 23 which is connected to another die. The die includes a first type die and a second type die each including both the accelerator core and the CPU core, and the core number ratio between the accelerator core and the CPU core in the first type die differs from that in the second type die. Moreover, the memory interfaces include an interface conforming to TCI. In addition, the memory interfaces further include an interface conforming to HBM.

Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).

Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.

Abstract: According to one embodiment, workflow templates are maintained, each workflow template including a predefined sequence of workflow stages associated with a particular type of medical diagnosis or process. In response to a request for processing medical image data from a user, a user identifier (ID) that identifies the user is automatically determined based on the request. At least one of the workflow templates that is specifically configured to process medical image data associated with the user is identified based on the user ID. One or more image processing operations defined by the identified workflow template are performed on the medical image data, generating a scene corresponding to an image view representing the medical image data. The scene associated with each of the workflow stages is stored in a persistent storage, where a scene includes metadata used to recreate a corresponding medical image view subsequently.

Abstract: In order to provide a 1H-magnitude neuro-semiconductor device, a semiconductor device that constitutes a neural network in which a plurality of sets each including a plurality of synapse bonds and a neuron section are connected with each other. The semiconductor device includes the synapse bonds that perform non-contact communications using magnetic coupling, and the neuron sections including a wired connection and a logical circuit. The semiconductor device has a connection array in which the synapse bonds and the neuron sections are arranged three-dimensionally. The semiconductor device has a function for enabling reconfiguration of at least some of groupings of the connection array or wired short-distance, intermediate-distance, or long-distance connections.

Abstract: A signal bridge device is provided with a plurality of bridge signal transmission/reception units, a plurality of bridge signal transmission/reception terminals, and a bridge signal distribution unit. Non-contact reception signals received by the bridge signal transmission/reception units are input into the bridge signal distribution unit. Contact reception signals received by the bridge signal transmission/reception terminals are input into the bridge signal distribution unit. The bridge signal distribution unit can output the non-contact reception signals to the bridge signal transmission/reception terminals and can output the contact reception signals to the bridge signal transmission/reception units.

Abstract: A semiconductor device includes a first semiconductor chip and a second semiconductor chip The first semiconductor chip includes a transmission circuit input unit, a transmission circuit unit, and a transmission unit. The second semiconductor chip includes a reception unit, a reception circuit unit, and a reception circuit output unit. The transmission unit and the reception unit can communicate with each other in a non-contact manner. A transmission circuit unit input signal having a predetermined transmission-side potential is input into the transmission circuit unit. A reception circuit unit input signal is input into the reception circuit unit via the non-contact communication between the transmission unit and the reception unit. The reception circuit unit outputs a reception circuit unit output signal having a predetermined reception-side potential. The ratio of the reception-side potential to the transmission-side potential can be changed.

Abstract: A cooling system has a cooling bath. The open space of the cooling bath contains a second coolant having a boiling point, and having an electronic device that has a processor that is a heat generating component mounted on a board, and is immersed in the second coolant. A boiling cooling device is thermally connected to the processor, and encloses a first coolant having a boiling point. A first heat exchanger has a high-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which the second coolant is passed, and a low-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which a third cooling medium having a boiling point is passed. A pump is configured to pressurize and deliver the second coolant warmed in the cooling bath toward the inlet of the high-temperature side passage.

Abstract: A semiconductor device includes multiple semiconductor chips and a control unit. Each of the semiconductor chips has multiple signal processing units that can be connected with each other, multiple in-chip signal lines that are respectively connected to the signal processing units and that can be connected with each other, and a connection-state changing unit that changes the connection state between the in-chip signal lines according to an instruction from the control unit. The connection-state changing unit of each semiconductor chip changes the connection state between the in-chip signal lines according to the instruction from the control unit, so that the connection state between the signal processing units is changed.

Abstract: A semiconductor switch device includes a semiconductor switch main body unit that has multiple semiconductor switch chips and a control unit, multiple first terminals that are connected to the semiconductor switch main body unit, and multiple second terminals that are connected to the semiconductor switch main body unit, the first terminals and the second terminals being connected via the semiconductor switch main body unit and a connection state between the first terminals and the second terminals being changed by the semiconductor switch main body unit. The connection-state changing unit of each semiconductor switch chip changes the connection state between multiple in-chip signal lines according to an instruction from the control unit, so that the connection state between the plurality of first terminals and the plurality of second terminals is changed.

Abstract: A semiconductor element that has an element first main surface, an element second main surface that is the reverse surface from the element first main surface, and an element side surface. The semiconductor element is configured from a semiconductor substrate part and an insulating layer part and is provided with: a signal transmission/reception terminal that is provided to the element first main surface and that contacts and can transmit/receive signals to/from an external-substrate signal transmission/reception terminal that is provided to an external substrate that is external to the semiconductor element; and a signal transmission/reception coil that is provided to the element side surface and that, via the element side surface, can transmit/receive signals in a non-contact manner to/from an external-semiconductor-element signal transmission/reception part that is provided to an external semiconductor element that is external to the semiconductor element.

Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.

Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).

Abstract: Provided is a cooling system improved in cooling performance of an electronic device and being simple and efficient. The cooling system 10 has a cooling tank 12, and the cooling tank 12 contains in its open space a first cooling liquid 13 having a boiling point T1. An electronic device 100 mounting processors 110, 112 on a board 120 is stored within the open space of the cooling tank 12 and is immersed in the first cooling liquid 13. A first heat exchanger 22 is immersed in a surface layer portion of the first cooling liquid in the cooling tank 12. The first heat exchanger 22 encloses therein a second refrigerant having a boiling point T2 (provided T1=T2 or T1>T2).

Abstract: A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.

Abstract: The purpose of the present invention is to provide a signal processing device that performs processing suitable for a signal processing device that transmits and receives signals without contact. A signal processing device is provided with a plurality of signal transmission/reception units, a plurality of signal processing units, and a signal distribution unit. The signal transmission/reception units can transmit and receive signals, without contact, between signal processing device-side signal transmission/reception units. Reception signals received by the signal transmission/reception units are inputted to the signal distribution unit. Output signals outputted by the signal processing units are inputted to the signal distribution unit. The signal distribution unit can output the reception signals to the signal processing units, and can output the output signals to the signal transmission/reception units.