Patents by Inventor Motohiko Katoh

Motohiko Katoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bump forming method
    Patent number: 5953624
    Abstract: A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: September 14, 1999
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Akio Bando, Motohiko Katoh, Hirofumi Moroe