Abstract: One aspect of the present disclosure provides a connector capable of improving assemblability. A connector according to one aspect of the present disclosure is provided with a connector housing (50) including a plurality of accommodating portions (60A, 60B), a plurality of connection terminals (40A, 40B) held in the connector housing (50), and a plurality of nuts (80) respectively accommodated in the plurality of accommodating portions (60A, 60B). Each of the plurality of connection terminals (40A, 40B) includes a terminal connecting portion (42) to be connected to a mating terminal (100) by tightening a bolt (B1) into the nut (80). The plurality of terminal connecting portions (42) are provided apart from each other in an arrangement direction (Z) of the plurality of connection terminals (40A, 40B) and provided at positions not overlapping each other in a plan view from the arrangement direction (Z).

Abstract: The present disclosure provides a connection terminal and a wire harness that make it possible to suppress reductions in the reliability of connection to a mating terminal. A wire harness 10 that includes an electric wire 20 that has a core wire 21 and an insulating coating 22 that coats the outer circumference of the core wire 21, a connection terminal 30 that is electrically connected to the core wire 21 as exposed from the insulating coating 22, and a cylindrical shrink tube 70 that covers the connection 60 between the core wire 21 and the connection terminal 30. The connection terminal 30 includes an electric wire connection part 31 that is electrically connected to the core wire 21 of the electrical wire 20, a terminal connection part 50 that is to be connected to a mating terminal, and an intermediate linking part 40 that is between the electric wire connection part 31 and the terminal connection part 50 and links the electric wire connection part 31 and the terminal connection part 50.

Abstract: A connector, including a terminal; and a housing to which the terminal is fixed, wherein the terminal includes: a plate-like first connection; a holder projecting in one direction intersecting the first connection from a side edge of the first connection; and a second connection projecting in the one direction from a side edge of the first connection and facing the holder, the holder and the second connection being fixed in the housing.

Abstract: Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

Abstract: A connector 10 disclosed by this specification includes a housing 12 including a busbar 30 and a mounting member to be mounted into the housing 12. The housing 12 includes a first lock portion 38. The mounting member includes a second lock portion 60 to be engaged with the first lock portion 38. The first lock portion 38 is provided on the side of an exposed surface 36 of the busbar 30.

Abstract: A connector 10 disclosed by this specification includes a housing 12 including a busbar 30 and a mounting member to be mounted into the housing 12. The housing 12 includes a first lock portion 38. The mounting member includes a second lock portion 60 to be engaged with the first lock portion 38. The first lock portion 38 is provided on the side of an exposed surface 36 of the busbar 30.

Abstract: Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.

Abstract: Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

Abstract: A connector, including a terminal; and a housing to which the terminal is fixed, wherein the terminal includes: a plate-like first connection; a holder projecting in one direction intersecting the first connection from a side edge of the first connection; and a second connection projecting in the one direction from a side edge of the first connection and facing the holder, the holder and the second connection being fixed in the housing.

Abstract: Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.

Abstract: A terminal fitting includes an electric contact member (20) which has a facing surface (21) facing a contact surface (81) disposed on a counterpart terminal (80) and is connected to an external circuit. An obliquely wound coil spring (40) has an electroconductive wire member (41) wound a plurality of times so that the winding surface is oblique with respect to a coil axis L. Both ends of the electroconductive wire member (41) are fixed to the electric contact member (20) in such an attitude that the coil axis L is parallel to the facing surface (21) of the electric contact member (20), and the obliquely wound coil spring (40) is to be sandwiched between the counterpart terminal (80) and the electric contact member (20) when the counterpart terminal (80) and the electric contact member (20) come close to each other.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.

Abstract: A shielded shell and a shielded connector that prevents a fixing member for fixing a shielding member from interfering with another member such as a grommet. A shielding member such as a braided wire is placed on the outer circumferential surface of a shielded shell and fixed by the fixing member. The outer circumferential surface of the shielded shell is provided with a step portion that increases in diameter from the rear portion, at which a fixing region of the shielding member is positioned, toward a front portion, and is provided with position restriction portions that protrude outward from portions of the outer circumferential surface in the circumferential direction and restrict the position of the front end of the fixing member that is to be attached to the fixing region.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.

Abstract: A shielded shell and a shielded connector that prevents a fixing member for fixing a shielding member from interfering with another member such as a grommet. A shielding member such as a braided wire is placed on the outer circumferential surface of a shielded shell and fixed by the fixing member. The outer circumferential surface of the shielded shell is provided with a step portion that increases in diameter from the rear portion, at which a fixing region of the shielding member is positioned, toward a front portion, and is provided with position restriction portions that protrude outward from portions of the outer circumferential surface in the circumferential direction and restrict the position of the front end of the fixing member that is to be attached to the fixing region.

Abstract: A connector (10) includes a capacitor (30) with a capacitor main body (31) extending in a front-back direction and two lead wires (32) extending forward from the front end of the capacitor main body (31). Busbars (50, 60) are arranged before the capacitor (30) and have two electronic component connecting portions (55, 65) to be connected to the lead wires (32). The connector (10) also has a housing with a forwardly open insertion opening (21) into which the capacitor (30) and the busbars (50, 60) are insertable so that the busbars (50, 60) are held. An electronic component holding portion (43) is provided in the housing and includes resiliently deflectable pieces (44) that are configured to clamp the capacitor main body (31) in a deflected state.

Abstract: A power semiconductor drive circuit includes a parallel circuit connected to a gate of a power semiconductor element and constituted by two transistors for setting gate resistance of the power semiconductor element; a gate voltage monitoring circuit connected to the gate of the power semiconductor element and the parallel circuit, wherein a monitoring voltage is set in the gate voltage monitoring circuit to monitor a gate voltage of the power semiconductor element; a signal delay circuit to delay an output signal of the gate voltage monitoring circuit; and a gate control circuit to change the magnitude of combined resistance of the parallel circuit based on an output signal output from the signal delay circuit.