Patents by Inventor Motoki Masaki
Motoki Masaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230054631Abstract: A radio wave absorber includes hexagonal ferrite particles and a holding material-filled with the hexagonal ferrite particles. The hexagonal ferrite particles include first particles and second particles that are larger than the first particles in particle size.Type: ApplicationFiled: February 27, 2020Publication date: February 23, 2023Applicant: Mitsubishi Electric CorporationInventors: Motoki MASAKI, Fumiaki BABA
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Publication number: 20220412676Abstract: A heat dissipation member includes a thermal radiation ceramic material, and the thermal radiation ceramic material contains silicon nitride and boron nitride as main components. The ratio of the mass of boron nitride to the mass of silicon nitride and boron nitride is 10 mass % to 40 mass %.Type: ApplicationFiled: January 21, 2020Publication date: December 29, 2022Applicant: Mitsubishi Electric CorporationInventors: Motoki MASAKI, Shinya TOKIZAKI
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Publication number: 20220412533Abstract: In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.Type: ApplicationFiled: April 13, 2020Publication date: December 29, 2022Applicant: Mitsubishi Electric CorporationInventors: Katsuya JINNO, Motoki MASAKI, Sohei SAMEJIMA
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Patent number: 11095179Abstract: A thermosetting resin composition of the present disclosure includes an epoxy resin (1) containing a curing agent, and inorganic particles (2) having a rutile-type crystal structure and an average particle diameter of 500 nm or less. Further, a stator coil of the present disclosure includes a coil conductor (6), and an insulating layer (7) obtained by winding an insulating tape around the coil conductor (6), impregnating the insulating tape with the thermosetting resin composition, and molding the impregnated insulating tape by heating and pressurizing. In addition, a rotating electric machine of the present disclosure includes a stator core (4) having a slot (10), in which the stator coil (5) is accommodated.Type: GrantFiled: July 13, 2016Date of Patent: August 17, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takahiro Mabuchi, Azusa Osawa, Motoki Masaki, Shinya Tokizaki
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Patent number: 10351728Abstract: A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.Type: GrantFiled: January 10, 2014Date of Patent: July 16, 2019Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Mariko Takahara, Kenji Mimura, Yurie Nakamura, Motoki Masaki
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Publication number: 20190165632Abstract: A thermosetting resin composition of the present disclosure includes an epoxy resin (1) containing a curing agent, and inorganic particles (2) having a rutile-type crystal structure and an average particle diameter of 500 nm or less. Further, a stator coil of the present disclosure includes a coil conductor (6), and an insulating layer (7) obtained by winding an insulating tape around the coil conductor (6), impregnating the insulating tape with the thermosetting resin composition, and molding the impregnated insulating tape by heating and pressurizing. In addition, a rotating electric machine of the present disclosure includes a stator core (4) having a slot (10), in which the stator coil (5) is accommodated.Type: ApplicationFiled: July 13, 2016Publication date: May 30, 2019Applicant: Mitsubishi Electric CorporationInventors: Takahiro MABUCHI, Azusa OSAWA, Motoki MASAKI, Shinya TOKIZAKI
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Publication number: 20160115343Abstract: A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.Type: ApplicationFiled: January 10, 2014Publication date: April 28, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Mariko TAKAHARA, Kenji MIMURA, Yurie NAKAMURA, Motoki MASAKI
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Patent number: 9029438Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.Type: GrantFiled: December 28, 2010Date of Patent: May 12, 2015Assignee: Mitsubishi Electric CorporationInventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
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Publication number: 20130012621Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.Type: ApplicationFiled: December 28, 2010Publication date: January 10, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
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Patent number: 8193633Abstract: Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 ?m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 ?m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.Type: GrantFiled: September 12, 2008Date of Patent: June 5, 2012Assignee: Mitsubishi Electric CorporationInventors: Kenji Mimura, Hideki Takigawa, Hiroki Shiota, Kazuhiro Tada, Takashi Nishimura, Hiromi Ito, Seiki Hiramatsu, Atsuko Fujino, Kei Yamamoto, Motoki Masaki
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Publication number: 20100226095Abstract: Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 ?m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 ?m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.Type: ApplicationFiled: September 12, 2008Publication date: September 9, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kenji Mimura, Hideki Takigawa, Hiroki Shiota, Kazuhiro Tada, Takashi Nishimura, Hiromi Ito, Seiki Hiramatsu, Atsuko Fujino, Kei Yamamoto, Motoki Masaki