Abstract: [Problem] To propose a stainless steel structure excellent in hydrogen embrittlement resistance and corrosion resistance, being high in mass productivity, simple in device structure, low in equipment cost, and having a high cost advantage, and a method for manufacturing the same. [Solving means] It is stainless steel having hydrogen embrittlement resistance and corrosion resistance, a surface of electrolytically polished stainless steel being coated with a film obtained by passivating a metal oxide formed by a wet process, wherein the film thickness of the film obtained by passivating the metal oxide formed by a wet process is greater than 100 nm. A hydrogen permeability ratio (film-formed product/film-unformed product) is equal to or less than 2.0×10?2, and a relative reduction of area (under a hydrogen atmosphere of 110 MPa/under a nitrogen atmosphere of 10 MPa) in an SSRT test is equal to or greater than 0.8.

Abstract: The present invention provides an Fe—Cr—Al based stainless steel sheet and double layered sheet having a high Al content of greater than 6.5%, honeycomb bodies employing the stainless steel sheet or double layered sheet, and a process for fabrication of the steel sheet or double layered sheet. The sheet is a high Al-containing Fe—Cr—Al based stainless steel sheet or high Al-containing double layered sheet characterized by comprising, by weight, Cr: 10-30% and Al: >6.5%-15%. Preferably, the steel sheet further comprises either or both Ti: 0.02-0.1% and Nb: 0.02-0.3%, and also comprises La: 0.01-0.1%, Ce: 0.01-0.1% and P: 0.01-0.05%. It also preferably comprises Cu: 0.01-1.0% by weight, and preferably further comprises Mg: 0.001-0.1% by weight. There is also provided a honeycomb body fabricated using the Fe—Cr—Al based stainless steel sheet.

Abstract: The present invention provides an Fe—Cr—Al based stainless steel sheet and double layered sheet having a high Al content of greater than 6.5%, honeycomb bodies employing the stainless steel sheet or double layered sheet, and a process for fabrication of the steel sheet or double layered sheet. The sheet is a high Al-containing Fe—Cr—Al based stainless steel sheet or high Al-containing double layered sheet characterized by comprising, by weight, Cr: 10-30% and Al: >6.5%-15%. Preferably, the steel sheet further comprises either or both Ti: 0.02-0.1% and Nb: 0.02-0.3%, and also comprises La: 0.01-0.1%, Ce: 0.01-0.1% and P: 0.01-0.05%. It also preferably comprises Cu: 0.01-1.0% by weight, and preferably further comprises Mg: 0.001-0.1% by weight. There is also provided a honeycomb body fabricated using the Fe—Cr—Al based stainless steel sheet.

Abstract: The present invention provides an Fe—Cr—Al based stainless steel sheet and double layered sheet having a high Al content of greater than 6.5%, honeycomb bodies employing the stainless steel sheet or double layered sheet, and a process for fabrication of the steel sheet or double layered sheet. The sheet is a high Al-containing Fe—Cr—Al based stainless steel sheet or high Al-containing double layered sheet characterized by comprising, by weight, Cr: 10-30% and Al: >6.5%-15%. Preferably, the steel sheet further comprises either or both Ti: 0.02-0.1% and Nb: 0.02-0.3%, and also comprises La: 0.01-0.1%, Ce: 0.01-0.1% and P: 0.01-0.05%. It also preferably comprises Cu: 0.01-1.0% by weight, and preferably further comprises Mg: 0.001-0.1% by weight. There is also provided a honeycomb body fabricated using the Fe—Cr—Al based stainless steel sheet.

Abstract: A pad conditioner for semiconductor substrates for performing conditioning by slide contact with the abrasive surface of the polishing pad comprises a support member having a surface opposed to the polishing pad, a joining alloy layer covering the above surface of the support member, and a group of hard abrasive grains which are spread out and embedded in the joining alloy layer and supported by the joining alloy layer. At the contact interface between each of the hard abrasive grains and the above joining alloy, the surfaces of the hard abrasive grains are covered with either a layer of metallic carbides or a layer of metallic nitrides. Ag-base and Ag—Cu-base alloys, etc., can be used as the joining alloys.

Abstract: A pad conditioner for semiconductor substrates for performing conditioning by slide contact with the abrasive surface of the polishing pad comprises a support member having a surface opposed to the polishing pad, a joining alloy layer covering the above surface of the support member, and a group of hard abrasive grains which are spread out and embedded in the joining alloy layer and supported by the joining alloy layer. At the contact interface between each of the hard abrasive grains and the above joining alloy, the surfaces of the hard abrasive grains are covered with either a layer of metallic carbides or a layer of metallic nitrides. Ag-base and Ag—Cu-base alloys, etc., can be used as the joining alloys.

Abstract: A welding flux which forms a weld metal simultaneously satisfying low-oxygen, low-nitrogen, and low-hydrogen contents, gives weld beads in good form, and joins given metal pieces without entailing weld defects is obtained by formulating the flux in a composition such that a four-component system used therein is formed of CaO, MgO, Al.sub.2 O.sub.3, and SiO.sub.2 in the following proportions based on the total amount of the system taken as unity (100%),CaO: 10 to 60%MgO: Not more than 30%Al.sub.2 O.sub.3 : 20 to 70%SiO.sub.2 : 5 to 40%that the total amount of the four components accounts for not less than 35% of the total weight of the flux less the CO.sub.2 component thereof, that the composition incorporates therein CaF.sub.2 in an amount of from 25 to 65% of the total weight of the flux less the CO.sub.