Abstract: A semiconductor device includes a semiconductor substrate having a major surface and both an element-forming region and an outer peripheral voltage-withstanding region that are provided on the major surface side of the semiconductor substrate. The element-forming region includes both a cell region for forming a power element and a circuit element region for forming at least one circuit element. The circuit element region is interposed between the outer peripheral voltage-withstanding region and the cell region. The outer peripheral voltage-withstanding region includes a boundary region that adjoins the element-forming region. In the boundary region, there is provided one or more voltage-withstanding regions. At least one of the one or more voltage-withstanding regions has a withstand voltage lower than both the withstand voltages of the cell region and the circuit element region.

Abstract: A semiconductor device includes a semiconductor substrate having a major surface and both an element-forming region and an outer peripheral voltage-withstanding region that are provided on the major surface side of the semiconductor substrate. The element-forming region includes both a cell region for forming a power element and a circuit element region for forming at least one circuit element. The circuit element region is interposed between the outer peripheral voltage-withstanding region and the cell region. The outer peripheral voltage-withstanding region includes a boundary region that adjoins the element-forming region. In the boundary region, there is provided one or more voltage-withstanding regions. At least one of the one or more voltage-withstanding regions has a withstand voltage lower than both the withstand voltages of the cell region and the circuit element region.

Abstract: A semiconductor device includes a semiconductor substrate having a major surface and both an element-forming region and an outer peripheral voltage-withstanding region that are provided on the major surface side of the semiconductor substrate. The element-forming region includes both a cell region for forming a power element and a circuit element region for forming at least one circuit element. The circuit element region is interposed between the outer peripheral voltage-withstanding region and the cell region. The outer peripheral voltage-withstanding region includes a boundary region that adjoins the element-forming region. In the boundary region, there is provided one or more voltage-withstanding regions. At least one of the one or more voltage-withstanding regions has a withstand voltage lower than both the withstand voltages of the cell region and the circuit element region.

Abstract: An igniter includes a switching element, a control circuit section, and a protection element. The switching element is connected to a primary winding of an ignition coil. The control circuit section is configured to control operation of the switching element. The protection element is configured to electrically protect the control circuit section. The switching element and the protection element are formed in the same semiconductor chip, and are mounted on the same lead frame.

Abstract: A semiconductor device includes a semiconductor substrate having a major surface and both an element-forming region and an outer peripheral voltage-withstanding region that are provided on the major surface side of the semiconductor substrate. The element-forming region includes both a cell region for forming a power element and a circuit element region for forming at least one circuit element. The circuit element region is interposed between the outer peripheral voltage-withstanding region and the cell region. The outer peripheral voltage-withstanding region includes a boundary region that adjoins the element-forming region. In the boundary region, there is provided one or more voltage-withstanding regions. At least one of the one or more voltage-withstanding regions has a withstand voltage lower than both the withstand voltages of the cell region and the circuit element region.

Abstract: An igniter includes a switching element, a control circuit section, and a protection element. The switching element is connected to a primary winding of an ignition coil. The control circuit section is configured to control operation of the switching element. The protection element is configured to electrically protect the control circuit section. The switching element and the protection element are formed in the same semiconductor chip, and are mounted on the same lead frame.

Abstract: A drive control circuit includes: a first protection circuit connected between a signal input line and a ground line and clamps a voltage of AC noise superimposed on the signal input line at one clamp level; a second protection circuit connected between the signal input line and the ground line and clamps the voltage of the AC noise superimposed on the signal input line at an other clamp level; and a drive signal generation circuit generating the drive signal based on a comparison between a voltage in the signal input line and Vt. The input signal has binary levels including an L-level voltage VL and an H-level voltage VH, and a mean voltage of the AC noise is lower than a differential voltage between Vt and VL and higher than a differential voltage between Vt and VH.

Abstract: A drive control circuit includes: a first protection circuit connected between a signal input line and a ground line and clamps a voltage of AC noise superimposed on the signal input line at one clamp level; a second protection circuit connected between the signal input line and the ground line and clamps the voltage of the AC noise superimposed on the signal input line at an other clamp level Vn; and a drive signal generation circuit generating the drive signal based on a comparison between a voltage in the signal input line and Vt. The input signal has binary levels including an L-level voltage VL and an H-level voltage VH, and a mean voltage of the AC noise is lower than a differential voltage between Vt and VL and higher than a differential voltage between Vt and VH.

Abstract: A single semiconductor power module includes a power semiconductor chip including an embedded IGBT (the power semiconductor switching-device) and a control semiconductor chip. The power semiconductor chip also includes a gate series resistor integrated therein as a resistor through which the control semiconductor chip drives the power semiconductor chip. In such a configuration, a gate wire between the gate series resistor and a gate has a small lead inductance and a small parasitic capacitance with respect to the ground.

Abstract: A single semiconductor power module includes a power semiconductor chip including an embedded IGBT (the power semiconductor switching-device) and a control semiconductor chip. The power semiconductor chip also includes a gate series resistor integrated therein as a resistor through which the control semiconductor chip drives the power semiconductor chip. In such a configuration, a gate wire between the gate series resistor and a gate has a small lead inductance and a small parasitic capacitance with respect to the ground.

Abstract: A semiconductor device includes a current detection cell including a current detection device and a main cell including a power device with a means for preventing the current detection cell from being damaged by an external surge. The main cell including a first IGBT as the power device and the current detection cell including a second IGBT as the current detection device are created as a semiconductor device on a P+ substrate. A surge protection resistor is connected to the emitter of the second IGBT of the current detection cell. If a surge current caused by the external surge makes an attempt to flow through the second IGBT of the current detection cell, the surge protection resistor will limit the magnitude of the current. Thus, the magnitude of the surge current will not become a very large value.

Abstract: A multilayer printed wiring board is provided which comprises an insulation layer containing fillers and which ensures an insulation service life of a long period of time without losing electric insulation even in a case of such a very small underlayer-circuit-conductor spacing as to be not more than 100 &mgr;m. The multilayer printed wiring board comprises insulation resin portions containing no filler each of which portions is located between adjacent underlayer circuit conductors located on a base insulation substrate and each of which portions has a height higher than that of each of the underlayer circuit conductors.

Abstract: A method for producing a supported metallic catalyst capable of increasing the number of active points in the metallic catalyst supported at surface of a supporter and of using with high activity and stability, wherein metallic particles in a form of ions or atomic particles composed of several atoms are generated by an ion injecting apparatus, the metallic particles are collided, adsorbed, and supported by the supporter, and the supported metallic catalyst is made by manufacturing the adsorbing sites, and by adsorbing and supporting the metallic catalyst, concurrently.

Abstract: A metal vapor laser has a discharge tube with electrodes at opposite ends. A power source is electronically connected to the electrodes and generates a discharge in a discharge region within the discharge tube. The discharge generates laser light which emerges from the tube via windows. In order to cool the apparatus, the discharge tube is surrounded by a cooling jacket in the form of a hollow cooling vessel. A liquid flows in the cooling vessel and removes heat. The space between the cooling vessel and the discharge tube is evacuated. The cooling vessel is conductive and, since it is connected between one of the electrodes and the power supply, its inner and outer walls provide two potential paths for return current. The fact that the inner and outer walls have different diameters means that the inductance of the return paths is large. Therefore, the outer wall has a gap in it filled with insulating material.

Abstract: A metallic vapor laser apparatus includes a cylindrical discharge tube (31) having an internal space (2), a heat-insulating material (6) encompassing the periphery of the discharge tube (31), and two electrodes (3a) and (3b) having a cylindrical portion coaxial with the discharge tube (31) and disposed at both ends of the discharge tube (31). The internal space (2) are filled with a gas containing the vapor of copper as a laser medium for effecting laser oscillation by the excitation of the filler gas and the discharge.

Abstract: A liquid fuel cell having a circulation system for a fuel mixture comprising fuel and water, which comprises a first tank containing water or a water-rich fuel mixture comprising water and fuel, a second tank containing fuel or a fuel-rich mixture comprising water and fuel, a first detector for detecting the liquid level of the fuel mixture in the circulation system, a second detector for detecting a fuel concentration of the fuel mixture in the circulation system, or an output from the fuel cell, or a load current of the fuel cell, a valve means for controlling flow of the water or the water-rich mixture in the first tank to the circulation system in accordance with the output from the first detector, and a valve means for controlling flow of the fuel or the fuel-rich mixture in the second tank to the circulation system in accordance with the output from the second detector, can be stably and efficiently operated for a prolonged time in spite of different consumption rates of fuel and water even if the load

Abstract: A fuel cell made up of a pile of unit cells, each consisting of a pair of cell element and separator packed in a cell frame, in which there are formed a fuel feed path and oxide product evacuation path in the piling direction. The cell frame is provided between its inner edge offsets and the outer edges of the cell element and separator with inner packings, and further provided near its outer edge on one side with an outer packing. The sealing structure perfectly prevents a fuel leak, and yet allows compactness and easy assembling process.

Abstract: A SF.sub.6 gas insulating electric apparatus usable as a circuit breaker, etc., containing a SF.sub.6 gas insulator and a resin insulator, both of which insulators are present in an atmosphere to be exposed to arcs, characterized by making at least the surface portion to be exposed to arcs of the resin insulator from a polymer containing nitrogen atoms or a polyolefin resin, and if necessary together with an inorganic filler powder, is excellent in both surface and inner arc resistance and can maintain breaking performance for a long period of time.

Abstract: In a liquid fuel cell including a plurality of series-connected unit cells each including a fuel electrode and an oxidizer electrode disposed opposite to each other with an electrolyte layer being interposed therebetween, a fuel chamber disposed adjacent to the fuel electrode, and an oxidizer chamber disposed adjacent to the oxidizer electrode, and fuel tanks supplying liquid fuel to the fuel chambers, at least two vertically-spaced passages permitting communication of the fuel tanks with all of the fuel chambers are provided so that one of them serves as a passage for liquid fuel while the other serves as a passage for gas produced at the fuel electrodes, the liquid fuel in an amount smaller than the tank volume is charged in each of the fuel tanks to leave a non-charged space, and gas vent ports provided with gas-liquid separating means are disposed midway of the passages and/or on the tank wall portions corresponding to the non-charged spaces defined in the fuel tanks.

Abstract: A stator structure for the induction motor is disclosed, in which the winding accommodated in the slots of the stator iron core has one end portion, outside of the stator iron core, shaped to provide a flared bell-like opening, and the other end portion thereof, outside of the stator iron core, forming short-passed winding and being provided with an opening sufficiently large to permit insertion of the shaft of the rotor. Between the inner surface of the short-passed end portion and a given portion of the surface of the stator iron core a coil-supporting member is disposed. The outer surface of the coil-supporting member has a shape along the inner surface of the other coil end portion, while the inside thereof is so shaped as to provide a sufficient space or air gap with respect to the rotor to be inserted.