Patents by Inventor Motoshi Shitanda

Motoshi Shitanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5710715
    Abstract: A vibration analysis method for detecting abnormalities by analyzing a vibration waveform. The method includes the steps of, in a plurality of observation time points {t.sub.j } composed of a number n of specified time points t.sub.j (j=1 to n) counted from a start time point t.sub.0, detecting displacements of a vibration wave f.sub.j (j=1 to n) at the individual time points of the plurality of observation time points, and comparing points in an n-dimensional space composed of the displacements, detected at the individual observation time points, with points in the n-dimensional space of a vibration waveform that are designated as being normal.
    Type: Grant
    Filed: July 27, 1995
    Date of Patent: January 20, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Motoshi Shitanda
  • Patent number: 5336935
    Abstract: An electronic parts mounting apparatus includes a plurality of parallel parts feeder units each of which accommodates a plurality of electronic parts and sequentially feeds the electronic parts to a predetermined parts pickup position; the parts feeder units being arranged in parallel so as to form a parts feeding section; a positioning device for positioning a member on which the electronic parts are to be mounted; a parts mounting device which seizes each of the electronic parts at a predetermined position of the parts feeding section and which mounts each of the electronic parts on the member; and a detection device for detecting a distal end of each of the parts feeder units so as to determine whether a particular parts feeder unit deviates from a present position.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: August 9, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi
  • Patent number: 5070601
    Abstract: An electronic component mounting apparatus has a movable table on which plural component supply units are arranged in parallel. Each of the component supply units accommodate an electronic component to be mounted on a component mounting member. A guide frame supports the table to move in a direction intersecting perpendicularly to a component supply direction of the component supply unit. A driving shaft is arranged in the direction intersecting perpendicularly to the component supply direction of the component supply unit for moving the table. A positioning device positions the component mounting member. A component mounting device holds the components and mounts the components on the mounting member, and a support member supports the driving shaft at a middle thereof.
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: December 10, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi, Kanji Hata
  • Patent number: 4999909
    Abstract: A component mounting apparatus which comprises at least first and second component supply assemblies mounted on respective movable tables that are mounted on a common track for movement therealong. The apparatus also comprises at least one positioning device for positioning a printed circuit board on which components are desired to be mounted; at least one component mounting unit for receiving a component at a predetermined position of the component supply assembly and mounting the component onto the support member; and a table moving mechanism which is selectively connectable with one of the first and second movable tables for driving the movable table along the common track.
    Type: Grant
    Filed: April 25, 1990
    Date of Patent: March 19, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Eguchi, Motoshi Shitanda, Makito Seno, Wataru Hirai
  • Patent number: 4951388
    Abstract: A method of mounting electronic components, comprising steps of: sucking an electronic component by a suction nozzle provided at the tip of a mounting head; holding the sucked electronic component in position by a centering device having an opening and closing mechanism and provided separately from the mounting head, and while holding the component applying adhesive to a side of the electronic component, the side being opposite to that sucked onto the suction nozzle; and mounting the electronic component to a designated position on a printed circuit board. The nozzles on the head are of different sizes.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: August 28, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Eguchi, Masaru Nagaike, Motoshi Shitanda, Hiroshi Sawada