Patents by Inventor Mototatsu Matsunaga
Mototatsu Matsunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11108248Abstract: A power supply system including a low-voltage system and a high-voltage system having the high-voltage battery, that can provide an energy-efficient system of equalization of the high-voltage battery, is provided. The power supply system includes the high-voltage system having the high-voltage battery constituted of a plurality of battery cells, the low-voltage system, an insulation transmission part configured to transmit, in an insulated fashion, energy from each of the battery cells to the low-voltage system individually, and an equalization and transmission processing part configured to measure voltage of each of the battery cells, set a target battery cell to be processed for equalization, and control operation of the insulation transmission part and thereby transmit energy of the target battery cell to the low-voltage system.Type: GrantFiled: March 12, 2019Date of Patent: August 31, 2021Assignee: YAZAKI CORPORATIONInventors: Mototatsu Matsunaga, Koichi Uezono
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Patent number: 10741979Abstract: A vehicle harness structure and an additional connection member are provided, according to which part numbers of wire harnesses are reduced and superfluous attachment in the wire harness is avoided. The vehicle harness structure includes a basic harness for interconnecting a plurality of main devices to be mounted in common on target vehicles, an additional connection member having one end connected in a branched manner to a communication line or a signal line of the basic harness and another end connected to at least one auxiliary device to be optionally post-mounted on the target vehicles, and a control function section provided in the additional connection member to control the operation of the auxiliary device.Type: GrantFiled: November 5, 2018Date of Patent: August 11, 2020Assignee: YAZAKI CORPORATIONInventors: Yoichi Maki, Mototatsu Matsunaga
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Patent number: 10522267Abstract: A wire harness structure includes a main harness that has a trunk harness routed on a vehicle, and has at least one branch harness having one end connected to the trunk harness as a branch and the other end electrically connected to an electrical device mounted on the vehicle; and a branch connection mechanism to which at least one additional electrical device mounted on the vehicle is electrically connected, and which is connected to the main harness in a retrofitting manner as a branch.Type: GrantFiled: August 7, 2018Date of Patent: December 31, 2019Assignee: YAZAKI CORPORATIONInventors: Terumitsu Sugimoto, Mototatsu Matsunaga, Tsuyoshi Uchikura, Yoichi Maki
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Publication number: 20190288523Abstract: A power supply system including a low-voltage system and a high-voltage system having the high-voltage battery, that can provide an energy-efficient system of equalization of the high-voltage battery, is provided. The power supply system includes the high-voltage system having the high-voltage battery constituted of a plurality of battery cells, the low-voltage system, an insulation transmission part configured to transmit, in an insulated fashion, energy from each of the battery cells to the low-voltage system individually, and an equalization and transmission processing part configured to measure voltage of each of the battery cells, set a target battery cell to be processed for equalization, and control operation of the insulation transmission part and thereby transmit energy of the target battery cell to the low-voltage system.Type: ApplicationFiled: March 12, 2019Publication date: September 19, 2019Applicant: Yazaki CorporationInventors: Mototatsu MATSUNAGA, Koichi UEZONO
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Patent number: 10331158Abstract: An electrical unit relaying between an electrical component and an electronic control unit which determines a target operating amount of the electrical component, includes a communication port connectable with a communication wire connected to the electronic control unit, a power supply port connectable with a power supply wire connected to an external power supply, a ground port connectable with a ground wire, and one or more electrical component ports capable of supplying electric power to the electrical component. The electrical unit receives a signal relating to the target operating amount from the electronic control unit through the communication port. Electric power for operation according to the target operating amount is supplied to the electrical unit through the power supply port. The electrical unit supplies the electric power for operation to the electrical component through the electrical component ports.Type: GrantFiled: September 13, 2017Date of Patent: June 25, 2019Assignee: YAZAKI CORPORATIONInventor: Mototatsu Matsunaga
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Publication number: 20190074641Abstract: A vehicle harness structure and an additional connection member are provided, according to which part numbers of wire harnesses are reduced and superfluous attachment in the wire harness is avoided. The vehicle harness structure includes a basic harness for interconnecting a plurality of main devices to be mounted in common on target vehicles, an additional connection member having one end connected in a branched manner to a communication line or a signal line of the basic harness and another end connected to at least one auxiliary device to be optionally post-mounted on the target vehicles, and a control function section provided in the additional connection member to control the operation of the auxiliary device.Type: ApplicationFiled: November 5, 2018Publication date: March 7, 2019Applicant: Yazaki CorporationInventors: Yoichi MAKI, Mototatsu MATSUNAGA
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Publication number: 20180342334Abstract: A wire harness structure includes a main harness that has a trunk harness routed on a vehicle, and has at least one branch harness having one end connected to the trunk harness as a branch and the other end electrically connected to an electrical device mounted on the vehicle; and a branch connection mechanism to which at least one additional electrical device mounted on the vehicle is electrically connected, and which is connected to the main harness in a retrofitting manner as a branch.Type: ApplicationFiled: August 7, 2018Publication date: November 29, 2018Applicant: Yazaki CorporationInventors: Terumitsu SUGIMOTO, Mototatsu MATSUNAGA, Tsuyoshi UCHIKURA, Yoichi MAKI
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Publication number: 20180334117Abstract: A vehicular wire harness structure includes a first wire harness configured to connect a first electrical component and a main control function portion, the first electrical component being attached to a vehicle, the main control function portion controlling the first electrical component, and a second wire harness that has one end connected to the main control function portion. The second wire harness has a sub control function portion that is provided at the other end of the second wire harness to control a second electrical component. A function for serving as a master to make a data communication with the sub control function portion which serves as a slave is installed in advance into the main control function portion and the main control function portion has no function to control the second electrical component.Type: ApplicationFiled: July 31, 2018Publication date: November 22, 2018Applicant: Yazaki CorporationInventors: Mototatsu MATSUNAGA, Yoichi MAKI
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Patent number: 10122125Abstract: A vehicle harness structure and an additional connection member are provided, according to which part numbers of wire harnesses are reduced and superfluous attachment in the wire harness is avoided. The vehicle harness structure includes a basic harness for interconnecting a plurality of main devices to be mounted in common on target vehicles, an additional connection member having one end connected in a branched manner to a communication line or a signal line of the basic harness and another end connected to at least one auxiliary device to be optionally post-mounted on the target vehicles, and a control function section provided in the additional connection member to control the operation of the auxiliary device.Type: GrantFiled: May 29, 2015Date of Patent: November 6, 2018Assignee: YAZAKI CORPORATIONInventors: Yoichi Maki, Mototatsu Matsunaga
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Patent number: 9980364Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: GrantFiled: March 22, 2016Date of Patent: May 22, 2018Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Publication number: 20180074541Abstract: An electrical unit relaying between an electrical component and an electronic control unit which determines a target operating amount of the electrical component, includes a communication port connectable with a communication wire connected to the electronic control unit, a power supply port connectable with a power supply wire connected to an external power supply, a ground port connectable with a ground wire, and one or more electrical component ports capable of supplying electric power to the electrical component. The electrical unit receives a signal relating to the target operating amount from the electronic control unit through the communication port. Electric power for operation according to the target operating amount is supplied to the electrical unit through the power supply port. The electrical unit supplies the electric power for operation to the electrical component through the electrical component ports.Type: ApplicationFiled: September 13, 2017Publication date: March 15, 2018Inventor: Mototatsu Matsunaga
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Patent number: 9888558Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.Type: GrantFiled: June 3, 2011Date of Patent: February 6, 2018Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Patent number: 9693466Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: GrantFiled: February 16, 2012Date of Patent: June 27, 2017Assignee: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Patent number: 9480142Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: GrantFiled: May 28, 2014Date of Patent: October 25, 2016Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Publication number: 20160205763Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: ApplicationFiled: March 22, 2016Publication date: July 14, 2016Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Publication number: 20150349471Abstract: A vehicle harness structure and an additional connection member are provided, according to which part numbers of wire harnesses are reduced and superfluous attachment in the wire harness is avoided. The vehicle harness structure includes a basic harness for interconnecting a plurality of main devices to be mounted in common on target vehicles, an additional connection member having one end connected in a branched manner to a communication line or a signal line of the basic harness and another end connected to at least one auxiliary device to be optionally post-mounted on the target vehicles, and a control function section provided in the additional connection member to control the operation of the auxiliary device.Type: ApplicationFiled: May 29, 2015Publication date: December 3, 2015Applicant: Yazaki CorporationInventors: Yoichi MAKI, Mototatsu MATSUNAGA
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Publication number: 20140268581Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Publication number: 20140262451Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Publication number: 20120211266Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: ApplicationFiled: February 16, 2012Publication date: August 23, 2012Applicant: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Publication number: 20110299250Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.Type: ApplicationFiled: June 3, 2011Publication date: December 8, 2011Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA