Patents by Inventor Mourad Laknin

Mourad Laknin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8702006
    Abstract: A microcircuit card body-based device with first and second electronic labels, the labels having respective first and second near-field electronic communications elements suitable for being activated by applying a magnetic field. The first and second labels also have respective first and second magnetic shielding elements placed, respectively, between a first face of the card body-based device and the first communications element and between a second face of the card body-based device and the second communications element in such a manner that applying the magnetic field to one of the faces of the body activates only one of the first and second communications elements.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: April 22, 2014
    Assignee: Oberthur Technologies
    Inventors: Mourad Laknin, Julien Fortel
  • Patent number: 8544756
    Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: October 1, 2013
    Assignee: Oberthur Technologies
    Inventors: Olivier Bosquet, Mourad Laknin, Denis Vere
  • Publication number: 20120138691
    Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 7, 2012
    Applicant: OBERTHUR TECHNOLOGIES
    Inventors: Olivier BOSQUET, Mourad LAKNIN, Denis VERE
  • Publication number: 20110121084
    Abstract: First and second electronic labels, the labels having respective first and second near-field electronic communications means suitable for being activated by applying a magnetic field. The first and second labels further comprise respective first and second magnetic shielding means placed respectively between a first face of the body and the first communications means and between a second face of the body and the second communications means in such a manner that applying the magnetic field to one of the faces of the body activates only one of the first and second communications means.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: OBERTHUR TECHNOLOGIES
    Inventors: Mourad LAKNIN, Julien Fortel
  • Publication number: 20100328189
    Abstract: One component is provided with an electrical connection wire and the other component is provided with an electrical connection pad. The process includes a wire routing step along at least one out-and-back path so as to form at least first and second rectilinear portions on the outward and return paths while running through at least one loop connecting the two portions. In addition, the process includes a step for attaching the wire to the pad at at least one electrical conduction point in such a way that each of the rectilinear portions is connected to the pad.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 30, 2010
    Applicant: Oberthur Technologies
    Inventors: Mourad Laknin, Laurent Garnier