Abstract: In a particular implementation, a method includes: providing a first voltage to a word-line coupled to a first transistor device; providing a second voltage to a bit-line coupled to the first transistor device; providing a third voltage to a source-line coupled between a programmable resistive device and a voltage control element. Also, the first transistor device is coupled to the programmable resistive device and the voltage control element, where the programmable resistive device is configured to replace a first data value by writing a second data value in the programmable resistive device. Moreover, in response to a voltage difference across the programmable resistive device exceeding a particular threshold, limiting the voltage difference by one of reducing the second voltage on the bit-line or increasing the third voltage on the source-line.

Abstract: According to one implementation of the present disclosure, an integrated circuit comprises a memory macro unit that includes an input/output (I/O) circuit block, where read/write circuitry of the I/O circuit block is apportioned on at least first and second tiers of the memory macro unit. In a particular implementation, read circuitry of the read/write circuitry is arranged on the first tier and write circuitry of the read/write circuitry is arranged on the second tier.

Abstract: An integrated circuit includes a primary memory array with cells switchable between first and second states. The circuit also includes sacrificial memory cells; each fabricated to be switchable between the first and second states and associated with at least one row of the primary array. A controller is configured to detect a write operation to a row of the primary array, stress a sacrificial cell associated with the row and detect a failure of the associated sacrificial cell. The sacrificial cells are fabricated to have lower write-cycle endurance than cells of the primary array or are subjected to more stress. Failure of a row of the primary array is predicted based, at least in part, on a detected failure of the associated sacrificial cell.

Abstract: Various implementations described herein are related to a device having voltage regulation architecture with multiple layers arranged in a multi-layer structure. The device may include one or more layers of the multiple layers with voltage regulation circuitry that may be configured to manage at least one of process variation and temperature variation between the multiple layers of the multi-layer structure.

Abstract: Various implementations described herein are related to a method. The method may apply a write control voltage to a bitcell. The method may gradually ramp the write control voltage to the bitcell. The method may terminate application of the write control voltage to the bitcell when a write operation is sensed in the bitcell.

Abstract: A memory for an artificial neural network (ANN) accelerator is provided. The memory includes a first bank, a second bank and a bank selector. Each bank includes at least two word lines and a plurality of write word selectors. Each word line stores a plurality of words, and each word has a plurality of bytes. Each write word selector has an input port and a plurality of output ports, is coupled to a corresponding word in each word line, and is configured to select a byte of the corresponding word of a selected word line based on a byte select signal. The bank selector is coupled to the write word selectors of the first bank and the second bank, and configured to select a combination of write word selectors from at least one of the first bank and the second bank based on a bank select signal.

Abstract: A memory for an artificial neural network (ANN) accelerator is provided. The memory includes a first bank, a second bank and a bank selector. Each bank includes at least two word lines and a plurality of read word selectors. Each word line stores a plurality of words, and each word has a plurality of bytes. Each read word selector has a plurality of input ports and an output port, is coupled to a corresponding word in each word line, and is configured to select a byte of the corresponding word of a selected word line based on a byte select signal. The bank selector is coupled to the read word selectors of the first bank and the second bank, and configured to select a combination of read word selectors from at least one of the first bank and the second bank based on a bank select signal.

Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: A three-dimensional (3D) storage circuit includes two or more tiers of semiconductor dies, and a storage array of bitcells distributed on the two or more tiers to form a plurality of storage subarrays. One of the storage subarrays is arranged on a respective one of the tiers. Row and column replica/dummy tracking cells are arranged on each of the tiers. A timing circuit is coupled to the tracking cells of each of the tiers. In response to receipt of tier-specific trim bits for each of the tiers, the timing circuit independently controls a timing and/or voltage state of each of the tiers during an access operation of the 3D storage circuit to account for process and/or thermal variation between tiers of the 3D storage circuit.

Abstract: Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.

Abstract: A content-addressable memory (CAM) storage element includes bit storage cell bit comparison cells. The bit storage cell is arranged on a first die tier and includes at least one transistor, one or two bit lines, and a storage node. The bit comparison cell is arranged on a second die tier and has a match line, complementary search lines, and at least three transistors. The complementary search lines are decoupled from the bit line(s). A 3D connection couples the storage node to one of the transistors of the second die tier. The CAM cell performs at least one CAM search per clock cycle using at least four transistors per search, including the at least one transistor of the bit storage cell and the at least three transistors of the bit comparison cell, and to output results of the at least one CAM search on the match line.

Abstract: Disclosed are devices and techniques for facilitating transmission of light signals between optical waveguides formed on integrated circuit (IC) devices. In an implementation, one or more first waveguides may be formed in a structure such that at least a portion of the one or more first waveguides are exposed for optical connectivity. The structure may comprise first features to enable the structure to be interlocked with an IC device comprising second features complementary with the first features, so as to align at least a portion of the one or more first waveguides exposed to optically couple with one or more second waveguides formed in the first integrated circuit device.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate transfer of stored values between the volatile and non-volatile memory bitcells.

Abstract: Methods, systems and devices for operation of non-volatile memory device are described herein. In one aspect, a signal may have an amplitude within a continuous amplitude range, and a non-volatile memory element may be placed in an impedance state representing the amplitude. The amplitude of the signal may be recovered based, at least in part, on the impedance state of the non-volatile memory element.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate copying of memory states between the volatile and non-volatile memory bitcells.

Abstract: A system-on-chip is provided that includes functional circuitry that performs a function. Control circuitry controls the function based one or more configuration parameters. Non-volatile storage circuitry includes a plurality of non-volatile storage cells each being adapted to write at least a bit of the one or more configuration parameters in a rewritable, persistent manner a plurality of times. Read circuitry locally accesses the non-volatile storage circuitry, obtains the one or more configuration parameters from the non-volatile storage circuitry and provides the one or more configuration parameters to the control circuitry. Write circuitry obtains the one or more configuration parameters and provides the one or more configuration parameters to the non-volatile storage circuitry by locally accessing the non-volatile storage circuitry.

Abstract: Disclosed are techniques for forming and operating magnetic memory devices.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate transfer of stored values between the volatile and non-volatile memory bitcells.

Abstract: Various implementations described herein refer to a method for tracking abnormal incidents while monitoring activity of logic circuitry. The method may include detecting a tamper event related to the abnormal incidents and storing an attack signature related to the tamper event. The attack signature may be stored in non-volatile memory (NVM), such as, e.g., correlated electron random access memory (CeRAM).

Abstract: In a particular implementation, a method includes: providing a first voltage to a word-line coupled to a first transistor device; providing a second voltage to a bit-line coupled to the first transistor device; providing a third voltage to a source-line coupled between a programmable resistive device and a voltage control element. Also, the first transistor device is coupled to the programmable resistive device and the voltage control element, where the programmable resistive device is configured to replace a first data value by writing a second data value in the programmable resistive device. Moreover, in response to a voltage difference across the programmable resistive device exceeding a particular threshold, limiting the voltage difference by one of reducing the second voltage on the bit-line or increasing the third voltage on the source-line.