Patents by Inventor Mun-Seok Park

Mun-Seok Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20240161978
    Abstract: A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5?Hfs/Hfc?5.0 when the internal electrode includes hafnium (Hf), Hfc indicates an average Hf content (at %) in a center of the internal electrode, and Hfs indicates an average Hf content (at %) in the internal electrode, measured from the center of the internal electrode to an interface thereof in contact with the dielectric layer.
    Type: Application
    Filed: March 28, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Jun HWANG, Jin Kyung PARK, Sun Il JEONG, Gil Yong LEE, Su Ji KANG, Mun Seong JEONG, Won Seok JANG, Jung Min KIM
  • Diamond tools with multilayers of abrasive grain and method for manufacturing the same
    Patent number: 8100997
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: January 24, 2012
    Assignee: Shinhan Diamond Industrial Co., Ltd.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
  • Diamond tools with multilayers of abrasive grain and method for manufacturing the same
    Publication number: 20070151554
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Application
    Filed: February 4, 2005
    Publication date: July 5, 2007
    Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim