Abstract: A friction stir welding method in which a first member to be welded and a second member to be welded and having a first step portion are welded by friction stir welding using a welding tool includes the steps of arranging the first member to be welded on a step supporting surface of the first step portion with a gap between the first member to be welded and a side surface of the first step portion, pushing the welding tool into the first member to be welded from a surface of the first member to be welded while rotating the welding tool and inserting the welding tool until reaching the step supporting surface of the second member to be welded and stirring the first member to be welded and the second member to be welded by rotating the welding tool to form a welding part.

Abstract: A pressure receiving surface inclined to a rotation axis is provided on the side surface of a stir probe of a rotating tool. The pressure receiving surface includes a pressure receiving region which is always perpendicular to a rotation tangential direction in a cross section perpendicular to the rotation axis. In friction stir processing, the stir probe is caused to rotate in a rotation direction B in which the normal direction of the pressure receiving surface is positive. According to this kind of rotating tool, as it has no shoulder, a joint width does not increase even when a stirring region is deep, and also, a plastic flow in a rotation direction is generated by a pressure receiving surface, so that it is possible to reduce the proportion of the plastic flow in the rotation axis direction, and thus possible to suppress an occurrence of burr.

Abstract: This semiconductor device includes: a first insulation resin portion formed on the mounting surface side of a lead frame; a second insulation resin portion formed on the heat dissipation surface side of the lead frame; and a heatsink fixed to the heat dissipation surface of the second insulation resin portion, wherein the second insulation resin portion has a second skirt portion formed at an end of a thin molded portion, the first insulation resin portion has a first skirt portion covering the second skirt portion, and an outer peripheral surface part of the second skirt portion has a first end connected to the lead frame and the first skirt portion, a second end connected to the heatsink, and at least one bent portion formed between the first end and the second end.

Abstract: A friction stir welding method in which a first member to be welded and a second member to be welded and having a first step portion are welded by friction stir welding using a welding tool includes the steps of arranging the first member to be welded on a step supporting surface of the first step portion with a gap between the first member to be welded and a side surface of the first step portion, pushing the welding tool into the first member to be welded from a surface of the first member to be welded while rotating the welding tool and inserting the welding tool until reaching the step supporting surface of the second member to be welded and stirring the first member to be welded and the second member to be welded by rotating the welding tool to form a welding part.

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Abstract: This semiconductor device includes: a first insulation resin portion formed on the mounting surface side of a lead frame; a second insulation resin portion formed on the heat dissipation surface side of the lead frame; and a heatsink fixed to the heat dissipation surface of the second insulation resin portion, wherein the second insulation resin portion has a second skirt portion formed at an end of a thin molded portion, the first insulation resin portion has a first skirt portion covering the second skirt portion, and an outer peripheral surface part of the second skirt portion has a first end connected to the lead frame and the first skirt portion, a second end connected to the heatsink, and at least one bent portion formed between the first end and the second end.

Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: To obtain a resin type identification method and a resin type identification apparatus with which an optimum infrared reflection spectrum for identifying a resin piece can be selected and accurate identification processing can be performed successively on individual resin pieces even when the resin pieces are identified using a single optical detector, at least one identifying signal power is selected by executing signal processing on the basis of signal powers corresponding to infrared reflection intensities obtained by emitting infrared light onto the resin piece, and the resin type of the resin piece is identified on the basis of an infrared reflection spectrum corresponding to the selected identifying signal power.

Abstract: To obtain a resin type identification method and a resin type identification apparatus with which an optimum infrared reflection spectrum for identifying a resin piece can be selected and accurate identification processing can be performed successively on individual resin pieces even when the resin pieces are identified using a single optical detector, at least one identifying signal power is selected by executing signal processing on the basis of signal powers corresponding to infrared reflection intensities obtained by emitting infrared light onto the resin piece, and the resin type of the resin piece is identified on the basis of an infrared reflection spectrum corresponding to the selected identifying signal power.

Abstract: An elevator rope including a rope main body; and a covering resin layer that covers the periphery of the rope main body and comprises a molded product of a composition which composition is produced by mixing a thermoplastic polyurethane elastomer, a thermoplastic resin other than the thermoplastic polyurethane elastomer and an isocyanate compound having two or more isocyanate groups per molecule; a rope main body impregnated with an impregnating solution comprising a hydroxy compound having two or more hydroxy groups per molecule and an isocyanate compound having two or more isocyanate groups per molecule and having a lower viscosity than a melt viscosity of the composition for forming the covering resin layer is used as the rope main body; the elevator rope has a stable friction coefficient that does not depend on temperature or sliding velocity.

Abstract: An elevator rope of the present invention includes: a rope main body; and a covering resin layer that covers the periphery of the rope main body and comprises a molded product of a composition for forming the covering resin layer, wherein the composition is produced by mixing a thermoplastic polyurethane elastomer, a thermoplastic resin other than the thermoplastic polyurethane elastomer and an isocyanate compound having two or more isocyanate groups per molecule. Preferably, a rope main body impregnated with an impregnating solution comprising a hydroxy compound having two or more hydroxy groups per molecule and an isocyanate compound having two or more isocyanate groups per molecule and having a lower viscosity than a melt viscosity of the composition for forming the covering resin layer is used as the rope main body. The elevator rope of the present invention has a stable friction coefficient that does not depend on temperature or sliding velocity.

Abstract: A belt splicing apparatus includes: a mold including a cavity into which connecting end portions of a resin-made belt are inserted, opposing each other, to connect the end portions by using a bonding resin; a heating unit that heats a bonding resin to more than a flow starting temperature of the bonding resin; and a pressure maintaining unit. The pressure maintaining unit includes: a reservoir communicating with the cavity and maintaining the bonding resin in a fluid state; a pressure transmitting member that transmits pressure to the bonding resin in the fluid state; an urging unit that urges the pressure transmitting member; and an urging force adjusting unit that adjusts an urging force applied by the urging unit.

Abstract: A mixture of first material chips and second material chips is charged by a first frictional charging device made of a first material property, and then first and second sorted matters are sorted from the mixture by an electric field across first and second opposed electrodes. After that, the second sorted matter of higher content of the second material chips than the content of the first material chips is charged by a second frictional charging device made of a second material property, and then third and fourth sorted matters are sorted from the second sorted matter by an electric field across third and fourth opposed electrodes.

Abstract: A belt splicing apparatus includes: a mold including a cavity into which connecting end portions of a resin-made belt are inserted, opposing each other, to connect the end portions by using a bonding resin; a heating unit that heats a bonding resin to more than a flow starting temperature of the bonding resin; and a pressure maintaining unit. The pressure maintaining unit includes: a reservoir communicating with the cavity and maintaining the bonding resin in a fluid state; a pressure transmitting member that transmits pressure to the bonding resin in the fluid state; an urging unit that urges the pressure transmitting member; and an urging force adjusting unit that adjusts an urging force applied by the urging unit.

Abstract: A method of manufacturing a waveguide includes forming two waveguide units, each waveguide unit having a channel defined by a bottom wall and two side walls generally transverse to the bottom wall, flanges extending from the side walls, outside the groove, transverse to the side walls and generally parallel to the bottom wall, the flanges including though holes; joining the two waveguide units to each other so that the flanges of a first of the waveguide units abut the flanges of a second of the waveguide units, with the grooves forming a channel for guiding waves; and, by insert molding, forming a thermoplastic resin cover that fills the through holes in the flanges and covers both of the first and second waveguide units, at least partially.

Abstract: A nonreflective waveguide terminator includes a waveguide portion and an electromagnetic wave absorber. The portion has a rectangular opening in a plane perpendicular to a radio-wave propagation direction. The portion has one open end in the direction and the other end closed by a terminating metal internal wall. The portion has a radio-wave propagation space surrounded by first and second metal internal walls parallel to a radio-wave electric field, and third and fourth metal internal walls perpendicular to the field. The exterior shape of the absorber is a parallelepiped. The absorber has a rear-end surface positioned at a predetermined distance from the terminating wall and parallel to the terminating wall or is provided against the terminating wall. The surface of the absorber having the largest rectangular area is on the third or the fourth metal internal wall.

Abstract: A waveguide unit including a vertically polarized waveguide, a horizontally polarized waveguide, and a waveguide type-polarized wave converter interposed between said waveguides. The waveguide type-polarized wave converter has a slit, the shape of which being combination of two quadrate parts and a connecting part for connecting the two quadrate parts. Those polarized waveguides and polarized wave converter are integrally manufactured but can be divided into two parts.

Abstract: A first resin is prepared which has a content of electrically conductive particles adjusted in the range from 60 wt % to 90 wt %, and a melt shear viscosity adjusted in the range from 1×103 Pa.sec to 1×107 Pa.sec. A second resin is prepared which has a content of electrically conductive particles that is adjusted in the range from 50 wt % to less than 90 wt % and that is less than that of the first resin. The second resin has a melt shear viscosity adjusted in the range from 1×102 Pa.sec to less than 1×105 Pa.sec. A resin block prepared from the first resin is placed in a mold, and the second resin is injection molded into the mold while heating the mold to the melting temperature of the first resin or above.