Abstract: An image processing apparatus includes a motion vector detection unit that determines a motion vector between a plurality of images obtained in time series, an image synthesis unit that obtains a synthesized image by correcting a positional deviation between the plurality of images on the basis of the determined motion vector and synthesizing the plurality of images subjected to the positional deviation correction, a smoothing area extraction unit that extracts a smoothing area in which smoothing processing is to be performed on the basis of a degree of inconsistency occurring when the positional deviation is corrected, and a smoothing processing unit that performs the smoothing processing on the extracted smoothing area, from among respective areas of the synthesized image.

Abstract: A motion vector measurement condition setting unit determines a measurement precision, which is used when measuring a motion vector between a plurality of images, on the basis of information indicating a distortion in an optical system and sets a plurality of motion vector measurement regions in which the motion vector is to be measured on an image. A motion vector calculation unit determines the motion vector between the plurality of images in each of the plurality of motion vector measurement regions at the determined measurement precision. A motion vector integration processing unit determines a positional displacement amount between the plurality of images on the basis of the motion vector determined in each of the plurality of motion vector measurement regions.

Abstract: The present invention relates to high-speed acquisition of both a perpendicular observation image and a tilt observation image, in observation using a scanning electron microscope. An electron-beam observation apparatus includes: a first electro-optical system which scans a converged electron beam from a substantially perpendicular direction to a defect on a target wafer to be observed, and acquires a defect image signal with perpendicular observation by detecting a secondary electron image or a reflected electron image generated from the defect; and a second electro-optical system which scans a converged electron beam from a tilt direction to the defect, and acquires a defect image signal with tilt observation by detecting a secondary electron image or a reflected electron image generated from the defect.

Abstract: An image processing device for performing positioning processing between a plurality of images using a positional displacement amount between the plurality of images generates a positioning image by reducing the plurality of images, sets a motion vector measurement region with which a motion vector is measured in the positioning image, determines a pixel precision motion vector in the positioning image using the motion vector measurement region, and determines a sub-pixel precision motion vector in relation to the pixel precision motion vector. A representative vector is determined on the basis of the determined sub-pixel precision motion vector, and the positional displacement amount between the plurality of images is determined by converting the representative vector at a conversion ratio employed to convert the reduced positioning images into the plurality of images prior to the reduction.

Abstract: In a scanning electron microscope, scanning region is set to be narrow, upon which focused electron beam is scanned, so that the focused electron beam can be irradiated at the almost same position by plural numbers of times, irrespective of movement of the stage or of moving of the stage during braking thereof, and upon that region to be scanned is irradiated the focused electron beam, by plural numbers of times, while changing the focal position, thereby forming an image thereof. From the image formed is calculated out a section, from which a focus-in position can be calculated out, and then the focus-in position is calculated out from that calculated section.

Abstract: Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.

Abstract: The present invention relates to high-speed acquisition of both a perpendicular observation image and a tilt observation image, in observation using a scanning electron microscope. An electron-beam observation apparatus includes: a first electro-optical system which scans a converged electron beam from a substantially perpendicular direction to a defect on a target wafer to be observed, and acquires a defect image signal with perpendicular observation by detecting a secondary electron image or a reflected electron image generated from the defect; and a second electro-optical system which scans a converged electron beam from a tilt direction to the defect, and acquires a defect image signal with tilt observation by detecting a secondary electron image or a reflected electron image generated from the defect.

Abstract: A reviewing apparatus, for enabling to conduct detailed review (ADR) and/or defect classification (ADC), effectively, through making alignment of defects detected in an upstream inspecting apparatus into the reviewing apparatus, with certainty and at high accuracy, and further within a short time-period, comprises a defect selecting portion 240 for selecting or picking up a plural number of alignment candidates from a large numbers defects, upon defect inspection information, which is detected within the inspecting apparatus, an electron microscope 21 (30) for obtaining a SEM image of the plural number of alignment candidates, through picking up an image on each of the plural number of alignment candidates, which are selected or picked up, narrowly, and a determining portion 243 for calculating out characteristic quantities relating to the plural number of alignment candidates, upon basis of the obtained SEM images thereof, and for determining on suitableness/unsuitableness for use in alignment relating to th

Abstract: Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, the retrieval of image data via an outside results confirmation system is made possible. Further, for defect data of a plurality of substrates, it is possible to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends, which makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, and designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.

Abstract: In a scanning electron microscope, scanning region is set to be narrow, upon which focused electron beam is scanned, so that the focused electron beam can be irradiated at the almost same position by plural numbers of times, irrespective of movement of the stage or of moving of the stage during braking thereof, and upon that region to be scanned is irradiated the focused electron beam, by plural numbers of times, while changing the focal position, thereby forming an image thereof. From the image formed is calculated out a section, from which a focus-in position can be calculated out, and then the focus-in position is calculated out from that calculated section.

Abstract: Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.

Abstract: Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.