Patents by Inventor Munenori Ieshige

Munenori Ieshige has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100003429
    Abstract: Disclosed is a thermal transfer sheet that can meet demands for increased printing speed in thermal transfer, higher density of thermally transferred images, and higher quality. The thermal transfer sheet comprises a substrate and an adhesive layer and a dye layer provided in that order on one side of the substrate, wherein the adhesive layer comprises a polyvinylpyrrolidone resin and a composition for suppressing hygroscopic properties of the polyvinylpyrrolidone resin.
    Type: Application
    Filed: September 10, 2009
    Publication date: January 7, 2010
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Munenori Ieshige, Mitsuru Maeda, Kenichi Hirota, Masahiro Yuki
  • Patent number: 7642219
    Abstract: Disclosed is a thermal transfer sheet that can meet demands for increased printing speed in thermal transfer, higher density of thermally transferred images, and higher quality. The thermal transfer sheet comprises a substrate and an adhesive layer and a dye layer provided in that order on one side of the substrate, wherein the adhesive layer comprises a polyvinylpyrrolidone resin and a composition for suppressing hygroscopic properties of the polyvinylpyrrolidone resin.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: January 5, 2010
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Munenori Ieshige, Mitsuru Maeda, Kenichi Hirota, Masahiro Yuki
  • Publication number: 20090022913
    Abstract: The present invention is directed to the provision of a thermal transfer sheet that can realize a high maximum transfer density in printing, does not cause blocking during storage in a roll form, can suppress, in a roll form, the transfer of a dye onto a backside layer, which faces the dye layer, does not cause an abnormal transfer in which, in printing on an object, the dye is transferred together with a dye layer onto the object, can further reduce the density in a highlight part in printing, and can form printed matter which is excellent in reproduction of gradation from highlight to shadow without any trouble. The thermal transfer sheet comprises a base material, a heat resistant slip layer provided on one side of the base material, and a dye layer provided on the other side of the base material, wherein the dye layer comprises a binder resin having a loss modulus at 60° C. of not less than 107 Pa, a loss modulus at 100° C. of not less than 106 Pa and a loss modulus at 150° C.
    Type: Application
    Filed: July 28, 2005
    Publication date: January 22, 2009
    Inventors: Tomoko Araki, Munenori Ieshige
  • Patent number: 7442670
    Abstract: A thermal transfer sheet that can meet demands for increased printing speed in thermal transfer, increased density of thermally transferred images, and higher quality and, at the same time, particularly can suppress fusing to image receiving sheets and abnormal transfer. The thermal transfer sheet includes a base material, a heat resistant slip layer provided on one side of the base material, and an adhesive layer and a dye layer provided in that order on the other side of the base material, wherein the adhesive layer includes a specific polyvinylpyrrolidone resin.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: October 28, 2008
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Munenori Ieshige, Mitsuru Maeda, Masahiro Yuki
  • Publication number: 20080069982
    Abstract: Disclosed is a thermal transfer sheet that can meet demands for increased printing speed in thermal transfer, higher density of thermally transferred images, and higher quality. The thermal transfer sheet comprises a substrate and an adhesive layer and a dye layer provided in that order on one side of the substrate, wherein the adhesive layer comprises a polyvinylpyrrolidone resin and a composition for suppressing hygroscopic properties of the polyvinylpyrrolidone resin.
    Type: Application
    Filed: January 20, 2005
    Publication date: March 20, 2008
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Munenori Ieshige, Mitsuru Maeda, Kenichi Hirota, Masahiro Yuki
  • Publication number: 20070196599
    Abstract: A thermal transfer sheet that can meet demands for increased printing speed in thermal transfer, increased density of thermally transferred images, and higher quality and, at the same time, particularly can suppress fusing to image receiving sheets and abnormal transfer. The thermal transfer sheet includes a base material, a heat resistant slip layer provided on one side of the base material, and an adhesive layer and a dye layer provided in that order on the other side of the base material, wherein the adhesive layer includes a specific polyvinylpyrrolidone resin.
    Type: Application
    Filed: December 27, 2004
    Publication date: August 23, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tsuaki Odaka, Munenori Ieshige, Mitsuru Maeda, Masahiro Yuki
  • Patent number: 7138163
    Abstract: There is provided a thermal transfer sheet which can surely prevent printing-derived cockling, fusing to a thermal head or the like caused by thermal head-derived thermal damage to a primer layer provided between a substrate sheet and a heat-resistant slip layer and, at the same time, can meet a demand for a reduction in thickness of the thermal transfer sheet and has a high level of suitability for high-speed printing. The thermal transfer sheet comprises: a substrate sheet; a colorant layer provided on one side of the substrate sheet; and a heat-resistant slip layer provided on the other side of the substrate sheet through a primer layer. The primer layer comprises a binder resin satisfying a G?a/G?b ratio value of not more than 100 wherein G?a represents the storage modulus of the binder resin at 80° C., Pa; and G?b represents the storage modulus of the binder resin at 140° C., Pa.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: November 21, 2006
    Assignee: Dai Nippon Printing Co. Ltd
    Inventors: Munenori Ieshige, Taro Suzuki
  • Publication number: 20050227023
    Abstract: The present invention relates to a thermal transfer sheet, comprising a substrate; a heat-resistant sliding layer provided on one surface of the substrate; and a dye layer comprising at least a dye and a binder resin provided on the other surface of the substrate, wherein the binder resin comprises a styrene-containing polyol resin, which which meets a demand for speeding up of printing speed of thermal transfer, and densification and quality improvement of thermally transferred images, particularly meets to a demand for densification of thermally transferred images and in which the migration of dyes to the heat-resistant sliding layer and the scumming are prevented.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 13, 2005
    Inventors: Tomoko Araki, Mitsuru Maeda, Munenori Ieshige, Hiroyuki Morikane, Takao Matsumura
  • Patent number: 6946424
    Abstract: The present invention is first directed to a thermal transfer sheet which is not high in cost for obtaining a substrate, does not involve a problem of blocking or the like at the time of winding after coating of a backside layer onto the substrate, can eliminate the need to provide a release layer on the protective layer region, and further can enhance glossiness of a print with a protective layer. The thermal transfer sheet comprises a substrate, a dye layer of at least one color and a thermally transferable protective layer provided in a face serial manner on one side of the substrate, a protective layer provided on a part of one side of the substrate, an easy-adhesion layer provided on the whole surface of the protective layer and the substrate, the dye layer being provided on the easy-adhesion layer in its region where the protective layer is not located on the underside of the easy-adhesion layer.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: September 20, 2005
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Munenori Ieshige, Naohiro Obonai, Kenichi Hirota, Takenori Omata
  • Publication number: 20040219313
    Abstract: There is provided a thermal transfer sheet which can surely prevent printing-derived cockling, fusing to a thermal head or the like caused by thermal head-derived thermal damage to a primer layer provided between a substrate sheet and a heat-resistant slip layer and, at the same time, can meet a demand for a reduction in thickness of the thermal transfer sheet and has a high level of suitability for high-speed printing. The thermal transfer sheet comprises: a substrate sheet; a colorant layer provided on one side of the substrate sheet; and a heat-resistant slip layer provided on the other side of the substrate sheet through a primer layer. The primer layer comprises a binder resin satisfying a G′a/G′b ratio value of not more than 100 wherein G′a represents the storage modulus of the binder resin at 80° C., Pa; and G′b represents the storage modulus of the binder resin at 140° C., Pa.
    Type: Application
    Filed: March 18, 2004
    Publication date: November 4, 2004
    Inventors: Munenori Ieshige, Taro Suzuki
  • Patent number: 6710016
    Abstract: A thermal transfer sheet is provided which, during storage up to use thereof, is less likely to cause a dye contained in a thermally transferable ink layer to migrate to a heat-resistant protective layer in contact with the thermally transferable ink layer and, in actually performing thermal printing, does not cause heat fusing between a thermal head and the sheet. The thermal transfer sheet comprises: a substrate sheet; a thermally transferable ink layer provided on one surface of the substrate sheet; and provided on the other surface of the substrate sheet, a heat-resistant protective layer comprising a primer layer and a heat-resistant slip layer provided in that order, the primer layer being formed of a composition comprising a synthetic resin which has a storage modulus G′ of not less than 106 Pa at 40° C. and a loss modulus G″ of not less than 104 Pa at 120° C.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: March 23, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige
  • Patent number: 6692879
    Abstract: There is provided a thermal transfer image-receiving sheet which has dyeability high enough to realize high-speed printing and low-energy printing, permits a protective layer to be thermally transferred onto an image formed on the thermal transfer image-receiving sheet, is free from heat fusing to a thermal transfer sheet at the time of image formation on the thermal transfer image-receiving sheet, and has satisfactory separability from the thermal transfer sheet.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: February 17, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shino Suzuki, Masahiro Yuki, Takenori Omata, Munenori Ieshige, Hidemasa Kaida
  • Publication number: 20030203293
    Abstract: There is provided a thermal transfer image-receiving sheet which has dyeability high enough to realize high-speed printing and low-energy printing, permits a protective layer to be thermally transferred onto an image formed on the thermal transfer image-receiving sheet, is free from heat fusing to a thermal transfer sheet at the time of image formation on the thermal transfer image-receiving sheet, and has satisfactory separability from the thermal transfer sheet.
    Type: Application
    Filed: October 21, 2002
    Publication date: October 30, 2003
    Inventors: Shino Suzuki, Masahiro Yuki, Takenori Omata, Munenori Ieshige, Hidemasa Kaida
  • Publication number: 20030181331
    Abstract: The present invention is first directed to a thermal transfer sheet which is not high in cost for obtaining a substrate, does not involve a problem of blocking or the like at the time of winding after coating of a backside layer onto the substrate, can eliminate the need to provide a release layer on the protective layer region, and further can enhance glossiness of a print with a protective layer. The thermal transfer sheet comprises a substrate, a dye layer of at least one color and a thermally transferable protective layer provided in a face serial manner on one side of the substrate, a protective layer provided on a part of one side of the substrate, an easy-adhesion layer provided on the whole surface of the protective layer and the substrate, the dye layer being provided on the easy-adhesion layer in its region where the protective layer is not located on the underside of the easy-adhesion layer.
    Type: Application
    Filed: February 20, 2003
    Publication date: September 25, 2003
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Munenori Ieshige, Naohiro Obonai, Kenichi Hirota, Takenori Omata
  • Patent number: 6498123
    Abstract: The present invention is to provide a thermal transfer sheet provided with a backface layer having high heat resistance and slipping characteristics by using a one-solution type coating solution adopting an environmentally acceptable general solvent without performing heat treatment such as aging. The thermal transfer sheet provided with the backface layer according to the present invention comprises a transfer ink layer which is melted or sublimated by heating on one surface of a substrate and the backface layer on the other surface of the substrate film, wherein the backface layer comprises a binder which comprises a polyamideimide resin and a polyamideimide silicone resin each having a grass transition temperatures of 200° C. or more based on differential thermal analysis at a specified mixing ratio, a polevalent metal salt of alkyl phosphate and filler at a specified mixing ratio.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: December 24, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige
  • Publication number: 20020127378
    Abstract: A thermal transfer sheet is provided which, during storage up to use thereof, is less likely to cause a dye contained in a thermally transferable ink layer to migrate to a heat-resistant protective layer in contact with the thermally transferable ink layer and, in actually performing thermal printing, does not cause heat fusing between a thermal head and the sheet. The thermal transfer sheet comprises: a substrate sheet; a thermally transferable ink layer provided on one surface of the substrate sheet; and provided on the other surface of the substrate sheet, a heat-resistant protective layer comprising a primer layer and a heat-resistant slip layer provided in that order, the primer layer being formed of a composition comprising a synthetic resin which has a storage modulus G′ of not less than 106 Pa at 40° C. and a loss modulus G″ of not less than 104 Pa at 120° C.
    Type: Application
    Filed: December 26, 2001
    Publication date: September 12, 2002
    Applicant: DAI NIPPON PRINTING CO.
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige
  • Publication number: 20010034302
    Abstract: The present invention is to provide a thermal transfer sheet provided with a backface layer having high heat resistance and slipping characteristics by using a one-solution type coating solution adopting an environmentally acceptable general solvent without performing heat treatment such as aging. The thermal transfer sheet provided with the backface layer according to the present invention comprises a transfer ink layer which is melted or sublimated by heating on one surface of a substrate and the backface layer on the other surface of the substrate film, wherein the backface layer comprises a binder which comprises a polyamideimide resin and a polyamideimide silicone resin each having a grass transition temperatures of 200° C. or more based on differential thermal analysis at a specified mixing ratio, a polevalent metal salt of alkyl phosphate and filler at a specified mixing ratio.
    Type: Application
    Filed: March 9, 2001
    Publication date: October 25, 2001
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige