Abstract: A power supply circuit module includes a power supply circuit including a lower substrate, an upper substrate parallel or substantially parallel to the lower substrate, an inductor, and chip components mounted on the lower substrate, switching circuit components and chip components mounted on the upper substrate, and substrate connectors that connect the lower substrate with the upper substrate electrically and mechanically. A portion of the substrate connectors is an inductor configuring portion of the power supply circuit or a portion of an inductor configuring portion of the power supply circuit.

Abstract: An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.

Abstract: A control circuit module includes FETs each including a control terminal, an input terminal, and an output terminal, a control circuit connected to the control terminals and controlling on/off operations of the FETs by outputting a control signal to the control terminals, a first package including the FETs and the control circuit provided therein and including a first surface, a second surface, and a third surface, which is a side surface perpendicular or substantially perpendicular to the first surface and the second surface, first electrodes provided in the first package and exposed from the first surface of the first package, and a second electrode that is provided in the first package and exposed from the second surface of the first package.

Abstract: An inductor includes a first terminal and a second terminal, a first inductor conductor layer and a second inductor conductor layer, a magnetic core layer, and via conductors. The magnetic core layer is disposed between the first and second inductor conductor layers. The via conductors are connected to the first and second inductor conductor layers. The first and second terminals are electrically connected through the via conductors. The magnetic core layer includes a first magnetic substance portion including a first magnetic substance, and a second magnetic substance portion including a second magnetic substance. Magnetic properties of the second magnetic substance are different from magnetic properties of the first magnetic substance.

Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.

Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.

Abstract: An inductor includes a first terminal and a second terminal, a first inductor conductor layer and a second inductor conductor layer, a magnetic core layer, and via conductors. The magnetic core layer is disposed between the first and second inductor conductor layers. The via conductors are connected to the first and second inductor conductor layers. The first and second terminals are electrically connected through the via conductors. The magnetic core layer includes a first magnetic substance portion including a first magnetic substance, and a second magnetic substance portion including a second magnetic substance. Magnetic properties of the second magnetic substance are different from magnetic properties of the first magnetic substance.

Abstract: An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.

Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.

Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.