Patents by Inventor Muneyuki Odaira

Muneyuki Odaira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and manufacturing method thereof
    Patent number: 9472527
    Abstract: Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: October 18, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Toshiya Akamatsu, Muneyuki Odaira
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150221607
    Abstract: Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.
    Type: Application
    Filed: January 5, 2015
    Publication date: August 6, 2015
    Inventors: TOSHIYA AKAMATSU, Muneyuki Odaira
  • ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF THE ELECTRONIC APPARATUS
    Publication number: 20140159235
    Abstract: An electronic component includes an electrode portion and a solder portion formed on the electrode portion. In the electronic component, the electrode portion includes a first conductive portion and a second conductive portion each having different diffusion coefficient with respect to a component of the solder portion on a top surface of the electrode portion, and the solder portion is formed on the first conductive portion and the second conductive portion.
    Type: Application
    Filed: November 6, 2013
    Publication date: June 12, 2014
    Applicant: FUJITSU LIMITED
    Inventor: Muneyuki Odaira