Patents by Inventor MuralliKrishna GOVINDANDHANASEKARAN

MuralliKrishna GOVINDANDHANASEKARAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal test head for an integrated circuit device
    Patent number: 11454666
    Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: September 27, 2022
    Assignee: AEM SINGAPORE PTE LTD
    Inventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
  • Thermal test head for an integrated circuit device
    Patent number: 11378615
    Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 5, 2022
    Assignee: AEM SINGAPORE PTE LTD
    Inventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
  • THERMAL TEST HEAD FOR AN INTEGRATED CIRCUIT DEVICE
    Publication number: 20210325452
    Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
    Type: Application
    Filed: September 16, 2020
    Publication date: October 21, 2021
    Applicant: AEM SINGAPORE PTE LTD
    Inventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN
  • THERMAL TEST HEAD FOR AN INTEGRATED CIRCUIT DEVICE
    Publication number: 20210325453
    Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
    Type: Application
    Filed: September 16, 2020
    Publication date: October 21, 2021
    Applicant: AEM SINGAPORE PTE LTD
    Inventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN