Patents by Inventor Mustafa Haswarey

Mustafa Haswarey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
    Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Method and apparatus for detaching a microprocessor from a heat sink
    Patent number: 11296009
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey
  • Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
    Patent number: 11291115
    Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: March 29, 2022
    Assignee: Intel Corporation
    Inventors: Shelby A. Ferguson, Bijoyraj Sahu, Russell Aoki, Thomas Boyd, Eric W. Buddrius, Kevin Ceurter, Mustafa Haswarey, Rolf Laido, Daniel Neumann, Rachel Taylor, Anthony Valpiani
  • METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
    Publication number: 20190304871
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey
  • MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL FOR MICROPROCESSOR THERMAL SOLUTIONS
    Publication number: 20190304870
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND AUTOMATIC THERMAL INTERFACE MATERIAL SEPARATION FEATURES FOR USE IN LAND GRID ARRAY SOCKETS
    Publication number: 20190306985
    Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Inventors: Shelby A. Ferguson, Bijoyraj Sahu, Russell Aoki, Thomas Boyd, Eric W. Buddrius, Kevin Ceurter, Mustafa Haswarey, Rolf Laido, Daniel Neumann, Rachel Taylor, Anthony Valpiani